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15 Apr, 2014
Mechanical Analysis

Future World

Posted by Nazita Saye

Nazita Saye One of my recent social media feeds hit me like a ton of bricks over the weekend. “Yesterday belongs to the past. Tomorrow is the future. Today is a gift – that’s why it’s called the present” (Bill Keane). I sat there blinking at it for a while letting the thought sink in. You see I recently had discovered that while out walking some 600+ miles around the English countryside over the past couple … Read More

FloTHERM XT, FloEFD, Thermal, T3ster

14 Apr, 2014

Colin Walls I recently presented a session at EE Live! on USB 3.0, which proved quite popular. There were a number of questions and discussion about what is wrong with USB [mainly the connectors] and where it is going in the future. Of course, the question of USB 3.1 came up … My class included very little information on USB 3.1 because the standard is not yet finalized. It is slated for late 2014 and there … Read More

USB, USB 3.0, USB 3.1

11 Apr, 2014

John Day In my last post I noted the launch by Freescale and Broadcom of a single-chip automotive microcontroller (MCU) that supports compact video compression and fast transmission of video data throughout a vehicle over unshielded twisted pair cabling. The firms said cabling weight could be reduced by up to 30% and connectivity costs reduced by up to 80%. But wait, there’s more. Cable weight in cars … Read More

automotive infotainment, Broadcom, Advanced driver assistance systems (ADAS), Maxim Integrated Products, microcontrollers, Freescale Semiconductor, head-up displays

11 Apr, 2014

Charles Pfeil This is the second post in this routing series. View the introduction post here. To increase fabrication yield, it is important to center the traces between the fanout vias inside the BGA area. Large BGAs are usually 1mm pitch and medium sized ones are 0.8mm. Then we go down to 0.65, 0.5, 0.45 and 0.4. Is anybody designing with even finer pitch BGAs? In any case, it is important to center the traces … Read More

11 Apr, 2014

J VanDomelen NASA officials want you – to cast your vote. Now through 15 April 2014, aerospace geeks everywhere have the opportunity to vote on their favorite futuristic space suit design. NASA’s next space suit, the Z-2, is the second and newest prototype in the space organization’s Z series of next-generation spacesuits. Its predecessor, the Z-1 suit, was named one of the best inventions of 2012 by Time Magazine. … Read More

Military, Milaero, nasa, 3D scanning, Aerospace, 3D Printing, Mentor.com, Space suit, Technology, Mil-Aero, Mentor, Z-1, z-2, Mentor Graphics

10 Apr, 2014

Dennis Brophy Its always fun to take the wraps off of solutions we have been hard at work developing.  The global team of Mentor Graphics engineers have spent considerable time and energy to bring the next level of SoC design and verification productivity to what seems to be a never ending response to Moore’s Law.  As silicon feature sizes get smaller, design sizes get larger and the verification problem mushrooms.  … Read More

UPF, UVM, Codelink, Enterprise Verification Platform, Accellera, Portable Stimulus, VirtuaLAB, Gary Smith EDA, Moore's Law

9 Apr, 2014

Jamie Little We’re seeing an explosion around portable devices in the market. From consumer gadgets to medical devices to industrial instruments, battery operated, handheld and wearable devices are penetrating many sectors of the market. While these new class of devices tend to be more compact compared to prior generations, they offer a great deal of connectivity and functionality packed into these smaller and more … Read More

wearables, RTOS, Ineda Systems, IoT, Dhanush, Nucleus, Power Management, Low Power, MIPS

8 Apr, 2014

Matt Radochonski Today we have a guest-blogger appearance.  Phil Brumby is a Senior Technical Marketing Engineer for our Runtime Solutions team and manages the technical and engineering developments for development for our graphics and user interface products. He led a web seminar a few weeks ago titled “Create Compelling User Interfaces for Embedded with Qt Framework” and received more questions than he … Read More

UI, User Interface, Embedded Linux, Linux, CodeBench, Qt, Qt framework, Nucleus, Q&A

8 Apr, 2014

Colin Walls As I mentioned last week, I have just been to EE Live! in San Jose, California. Having arrived home a little while ago – 22 hours door to door, with baggage taking a little longer – I am pondering my impressions of this year’s event … Starting off with the positives. What I saw of the conference was buzzing. There were lots of classes available, covering all aspects of embedded … Read More

Embedded Systems Conference, EE Live!

6 Apr, 2014

Colin Walls A few weeks ago, I wrote about my involvement in a program to connect schools with industry, with a particular focus on technology. Part of this activity supports a UK government initiative [there are two words that I rarely seem to use next to one another] to teach every child to program computers. In the US, I believe the plan is for everyone to know how to program, which is rather ambitious. I am … Read More

Off-Topic

3 Apr, 2014

Mark Laing Hi there It was a great three days in Las Vegas last week for the IPC Apex Trade Show. We met many new and existing customers at our booth. The attendance seemed to be higher than last year though I don’t know the official numbers. I presented at the PCB Designers Forum on the Monday morning on simplying all those part and package libraries that you need to manage. This was also one of the areas … Read More

IPC Apex, ICT, AOI, apex, testability, vPlan, process, BOM, data preparation, process preparation, stencil, bill of materials

2 Apr, 2014

Vern Long before video games, children had simpler means of entertainment. Boys had their army men and marbles. Girls had their coloring books and paper dolls. As a young boy, I used to watch my sister carefully cut out dolls and clothes to glue on them, and thought yuck! 15 years later I found myself doing the same thing…well kind of. If you have been in the PCB design industry for as long as I have, you … Read More

2 Apr, 2014

Matt Radochonski Some of us from the Mentor Embedded team are spending the week in San Jose for the EELive Show and here are a few pictures we’ve snapped from the setup day and first day of open floor.  Most of these were taken by Ricardo Anguiano. A few shots of the Mentor Embedded Booth: Nuclues NanoPower BLE Demo: Nucleus Power Management Framework Demo: Folks milling about prior to show floor opening: A … Read More

EELive, Ricardo Professional Photographer, AMD

2 Apr, 2014

John McMillan

TechValidate, an independent third-party survey company, recently surveyed over 15000 verified PADS users with real-world questions about their PADS experiences. This survey includes responses to questions that all EDA vendors should be asking their users. Questions like: Why do you choose PADS over competitive products? Would you recommend PADS to a friend? What PADS features save you the most time

Read More

1 Apr, 2014

Matt Radochonski As part of the Mentor Embedded team I’m excited to finally share that we’re partnering with AMD Embedded to provide open-source embedded Linux development for heterogeneous and multi-core processors from AMD. Last year in September AMD shared details about its embedded product roadmap; this provided a great deal of insight into the commitment and growing investment AMD is making into embedded systems … Read More

yocto project, CodeBench, GNU, AMD, Yocto, gnu linux, Linux

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