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12 Sep, 2014

Matthew Ballance Verification engineers spend lots of time creating tests. In fact, creating enough tests to verify the design functionality consistently tops the list of verification challenges, according to periodic surveys of our customers. Top Verification Challenges One challenge in test creation is that verification occurs in multiple environments. For high-level models, verification might be performed in a SystemC … Read More

12 Sep, 2014

John Day The Intelligent Transportation Society (ITS) World Congress in Detroit last week was quite an event, from Mary Barra’s keynote on Sunday evening, during which she announced GM’s entry into vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) technology, to Bill Ford’s Monday morning look at the future of transportation, to the myriad demos on Belle Isle, and the array of exhibits and panel sessions … Read More

11 Sep, 2014

Dennis Brophy From those just beginning to study electronic systems design to the practicing engineer, this is the time of the year when those taking their first steps to learn VHDL, Verilog/SystemVerilog join the academic “back to school” crowd and those who are using design & verification languages in practice are honing skills at industry events around the world. A new academic year has started and the Mentor … Read More

10 Sep, 2014
PADS Home Page

PADS VX Roundtable

Posted by Jim Martens

Jim Martens

Thanks to everyone for attending the PADS VX Roundtable webinar!  If you have not viewed it, it is now available on-demand Click Here To View Now!  We had great attendance.  I personally liked this new format – it gave Mike and me the opportunity to answer your questions directly, not just delivering a PowerPoint presentation. How did you like this new format? Is it something we should do again? Please

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9 Sep, 2014

John McMillan

Hello PADS users ! For us, nothing is more important than our customers’ continued success. When we hear about the amazing PCB’s our customers are designing, we like to celebrate by sharing those stories with the world. We know every great PCB design has a great user story – and we want to help tell yours ! Email me: John_McMillan@mentor.com  to find out more ! Thanks,  John

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9 Sep, 2014
PCB Design

The Future of Integrity

Posted by Patrick Carrier

Patrick Carrier I have recently been blogging about signal and power integrity, how the two are related, and how they can cross over.  This was prompted by an article I recently wrote for the DesignCon branch of EDN.  Twenty years ago, one of the biggest barriers to designing high-speed PCBs was ensuring signal integrity.  About ten years ago, power integrity started becoming a serious issue.  So what is next?  Is … Read More

8 Sep, 2014

Patrick Carrier There are a lot of reasons to mix SI and PI analysis – trying to figure out a worst-case stimuli to determine PDN performance, trying to see the effect of a poor PDN on signals due to SSN issues, or just being able to properly analyze a single-ended via.  In fact, to get an accurate model of a single-ended via, you have to mix SI and PI.  The reason is that the power distribution network, or PDN … Read More

8 Sep, 2014

Colin Walls In a recent post I mentioned that I have written a lot of articles over the years. I sometimes wonder how many, but it is certainly in the hundreds. Although historically they were in print, nowadays, most of my work appears online. A particular favorite outlet is a popular venue for embedded developers: embedded.com I have cataloged and highlighted some more of my work … In due course, I will … Read More

8 Sep, 2014

Robin Bornoff Develop 3D is a UK based Magazine and Website focussing on the technologies involved in product design. The latest copy had a fascinating article on Dell’s Precision Workstation labs. This blog is being written on a Precision M4500 which I’ve lugged around countless airports and dumped, wearily, on numerous hotel beds. The fact that it works as well now as when I first got it a few years ago is … Read More

7 Sep, 2014

Shelly Stalnaker The 9th annual International Electrostatic Discharge Workshop (IEW) is being held May 4-7, 2015, at the Granlibakken Resort in Lake Tahoe, CA. The Call for Papers promises glimpses of “friendly but shy” bears and other wildlife at the conference site, located at 6,350 feet up in a mountain valley. Frankly, I prefer my bears to be decidedly shy, if that means they’ll be close enough … Read More

7 Sep, 2014

John Day When Agero, best known for its roadside assistance services, introduced a smartphone-based telematics system for usage based insurance (UBI), I wondered about the benefit(s). Agero said its system offered advantages over OBDII hardware solutions for assessing behind-the-wheel behavior, but those advantages weren’t immediately obvious, so I asked Jeff Blecher, Agero’s senior VP of strategy, about them. He … Read More

5 Sep, 2014

Doug Kolak Do you have an upcoming project and don’t have a tool that can handle system level thermo-fluid analysis? Are you evaluating your current simulation options to make sure they meet the needs of your business for years to come? Are you curious about new ways of solving problems of the world today in particular with the use of CFD? If you are like most engineers I speak with, the process for getting access … Read More

4 Sep, 2014
Mechanical Analysis

Hello World

Posted by Don Miller

Don Miller My blog series will cover the historical context which lead to the creation of Internal Flow Systems. Encompassing both the motives and the methods behind the book, the series will inevitably raise questions about the reliability of many of the other available sources of available data. I also hope to make clear this isn’t a subject of academic interest alone; the subject of loss coefficients … Read More

4 Sep, 2014

Robin Bornoff A release so good it has 11 best top 10 features, very Spinal Tap. I thought I’d wrap up this series with a list of more minor, but imo, very useful features and finish off with some words on cultural idioms. FloTHERM V10.0 and V10.1 together satisfy about 60 software enhancement requests as voted for on the Mentor IDEAS site for Mechanical Analysis Products, a strategy we’ve been committing … Read More

4 Sep, 2014

Robin Bornoff Arguably the most important (and often least well characterised) parameter controlling the temperature of electronic products is their power dissipation. Usually dissipated on the active layer of a die, this heat power seeps through the die, package, PCB, air, chassis all the way to the ambient in which the product sits. The less heat power the better, the lower the temperature rises that occur. The … Read More

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