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Mentor Blogs

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20 May, 2014

John Day I appreciate Mentor Graphics inviting me to moderate a panel discussion at the Design Automation Conference (DAC). The topic: Electric Vehicle Electrical/Electronic Architectures – Evolutionary or Revolutionary. Based on first impressions it appears that the session will be lively. If you’re planning to attend, the session starts at 4:00 pm on Tuesday, June 3 in room 309. The session topic is the degree … Read More

Lear Corporation, Mentor Graphics, Delphi, Wrightspeed Inc., Seoul National University, TUM CREATE LTD

20 May, 2014

John McMillan

This is the 3rd of my 5-part blog series focusing on cool features, tips and tricks that will enable you to get the most out of the LP Creator included with every seat of PADS VX. Part 1 and Part 2 of my PADS LP Creator blog can be found on our new PADS.com website here: pads.com/blog. Fun Fact #3: Did you know that once you’ve created a land pattern, like a typical 0603 capacitor, that you can quickly

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Land pattern creation

19 May, 2014

Colin Walls As I continue with my current pre-occupation with C++, I decided to discuss some aspects of the language with my colleague Jonathan Roelofs, who is a development tools specialist. Like me, Jonathan is particularly interested in the tools issues that concern embedded developers. As it seems to have wide interest, I decided to explore exception handling … I have a concern about the overhead of extra … Read More

exception handling, EHS

16 May, 2014

Michael Ford

At APEX this year, I was talking about material inventory integrity across the factory shop-floor and warehouse infrastructure, and the huge effect that it can have on the bottom line of any manufacturing business. You can see this on YouTube: https://www.youtube.com/watch?v=dGBIFL_RXkw&noredirect=1 The ERP system is one of the largest investments made in electronics manufacturing. It is responsible

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Material Turns, Inventory Accuracy

15 May, 2014
Embedded Software

C++ Q&A

Posted by Colin Walls

Colin Walls As my interest in C++ continues, I have been soliciting questions about C++ for embedded on various social media platforms. I you have a question, please email or tweet and I will do my best to answer it. #AB10630 / gettyimages.com Here is a question that came in yesterday: How testable is C++, specifically for constructs like abstract classes, templates, exceptions? This is quite a complex question … Read More

15 May, 2014

John Parry Come and join us for THERMINIC 2014 in London! The first deadline for abstract submissions to the 20th IEEE Workshop on THERMAL INVESTIGATIONS OF IC’s AND SYSTEMS (THERMINIC 2014) to be held at the magnificent World Heritage Site in Greenwich, London, has now passed. We’ve had a great response to the first call for abstracts, with more abstracts submitted this year compared to last year. The quality … Read More

Thermal measurements, THERMINIC, Compact Thermal Models, CTMs, CFD, power electronics, Thermomechanical reliability

15 May, 2014

Andrew Patterson Next week in Gothenburg the 10th GENIVI All-Members meeting is taking place. At the Demonstration Showcase on Wednesday 21st May, Mentor Graphics Embedded Software will present a wide array of Infotainment integrations, covering in-house technology, as well as leading partner solutions. The technology on dsiplay will include: Consolidated Domains We will have a GENIVI compliant Linux Infotainment system … Read More

14 May, 2014
Mechanical Analysis

New Beginnings

Posted by Mathew Clark

Mathew Clark As of late our Blog has become rather inactive. Not that we are not interested in writing anymore, but we are so. Darn. Busy. New products, new problems that need solving, and of course new ideas. However, it seems that there is a light at the end of the tunnel and there is a silhouette of a man that would like to welcome you to my first installation of our revived Blog. If the analogy doesn’t … Read More

#Electronics, #JEDEC, #cooling, #thermal, #T3ster, #testing

14 May, 2014

Mark Laing

Hi there My latest webinar has just been posted on the Mentor.com web site. I have posted the link below to get you there directly. Being able to manufacture PCB products around the world provides a number of advantages to the manufacturer. The challenge is being able to move those products to different locations efficiently even if the lines are the same, never mind if the lines are different machine

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13 May, 2014

John Day Reliability is an increasingly critical factor in the automotive industry especially considering the proliferation of electronic features and systems in today’s and tomorrow’s cars. Alas, there are no reliable cars without reliable electronic components, which is to say devices and subsystems able to function as intended despite very hot or very cold environments. For quite some time now, Mentor Graphics … Read More

Mentor Graphics, MicReD, IGBTs, T3ster, Thermal Testing, MOSFETs, power components

13 May, 2014

Shelly Stalnaker With the advent of advanced process nodes, IC design teams have an increasing ability to pack more functionality and performance into state-of-the art SoCs. At the same time, every new node transition brings a flood of new design challenges that can severely impact design performance, power, and time-to-market. The introduction of multi-patterning, FinFET devices, complex DRC/DFM requirements, increased … Read More

P&R, Olympus-SoC, place and route, 16nm, 20nm, 10nm, IC Design, Multi-Patterning, double patterning, FinFET

12 May, 2014

Paul Johnston Quiz Question: If Capital electrical platform engineering software stated its’ version at the first year of release at 1.0 and we moved through a new number before the decimal point to denote each new version the current version instead of being called 2013.1 would be called what? Answer: By my calculations, I believe it would be Version 9. What’s in it for you? This Blog post is a little bit longer … Read More

Interoperability, Integrated Electrical Systems, Outsourced Integrated Electrical Systems Software, automotive wiring harness, Capital, Automotive Electrical and Electronic Systems Design, Electrical Interconnect Design, ROI, Upgrades, IESD, Customer Support, Wire Harness, Deployment

12 May, 2014

Colin Walls As I mentioned last week, I am very much in “C++ mode” just now, mainly because I am preparing for some online classes. As a result of various social media contacts, I am getting some interesting impressions of how C++ is viewed among embedded developers. There is certainly much controversy. Some developers love it, but many are very critical. Various aspects of the language concern engineers, … Read More

EHS, exception handling

9 May, 2014

John McMillan

This is the 2nd of my 5-part blog series focusing on fun facts, tips and tricks that will enable you to get the most out of the PADS LP Creator, now included with every seat of PADS VX. In Part 1 I showed you one example of how a single calculator accommodates all the different lead styles and component families within a single calculator. I also showed you a different way to create non-standard SMT

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Land pattern creation

8 May, 2014

Shelly Stalnaker Remember learning your colors in kindergarten? Learning how to debug color assignment errors in multi-patterning can sometimes seem just as confusing. In Take Two of the Tech Talk videos on multi-patterning, David Abercrombie continues his discussion with Brian Bailey of Semiconductor Engineering about color assignment issues, and possible corrective actions. More often than not, a color assignment … Read More

David Abercrombie, design debugging, Calibre, IC Verification, Multi-Patterning, double patterning, IC Design

Embedded Software

Valor MSS PCB Manufacturing Systems Solutions

Electrical & Wire Harness Design

Functional Verification

IC Manufacturing

IC Design

Silicon Test and Yield Analysis

System Modeling

Vehicle System Design

3D-IC Design and Test Solutions

Aerospace and Military Solutions

Accelerating ARM-based Design

Automotive Solutions

Fabless/Foundry Ecosystem Solutions

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