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So, you want to predict component temperatures do you? Part V

Posted Dec 7, 2009, by Robin Bornoff

Like a river this blog series is slowing down due to its increased width and depth, that and a lot of travel on my part. So, let’s get it back on track! The previous blog focussed on the relatively well known 2 resistor compact thermal model (CTM) method, its strengths (simple to measure and describe) and its deficiencies (unconfirmed and inconsistent accuracy for different package styles and operating … Read More

Tags: Thermal Resistor, Accuracy, BCI, 2R, Package Model, Delphi, Electronics Cooling

Mechanical Analysis

So, you want to predict component temperatures do you? Part IV

Posted Nov 8, 2009, by Robin Bornoff

Next stop on the avenue of package thermal modelling is 2 resistor CTMs (compact thermal models). Specifically Theta_jb and Theta_jc, the thermal resistance between junction and board and junction and case respectively. Unlike their lowly 1R cousins these two resistances do not purport to include the effects of the package environment (well almost not) as such they should in theory be more BCI (boundary … Read More

Tags: BCI, CTM, 2R, Thermal Resistor, Electronics Cooling

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Mentor Blogs

Posts tagged with '2R'

So, you want to predict component temperatures do you? Part V

So, you want to predict component temperatures do you? Part IV

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