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Posts tagged with 'BGA Substrates'

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Semiconductor Package Thermal Characterization and Design as Easy as 1-2-3

Posted Feb 24, 2010, by Nazita Saye

If you are involved with semiconductor packaging design, then have I got news for you. We just announced the availability of FloTHERM IC – a web-based tool that delivers a high level of automation to design tasks associated with full-spectrum thermal characterization and validation. From what I understand, a typical semiconductor thermal team spends about 60% of their time on standard package thermal … Read More

Tags: Semiconductor, ROI, Smart Parts, CFD, BGA Substrates, Thermal Characterization, JEDEC, Package Design, Validation, FloTHERM IC, FloTHERM PACK

Electromagnetic (EM) Design & Simulation Software

Via modeling - what do I really need?
Patrick Carrier (Posted 11/2/11)
How can we obtain the s-parameters data with non-50 normalization?
Jian Zheng (Posted 2/28/11)
The effects of different bends on performances of wideband digital circuits.
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Embedded Software

Measuring RTOS performance - a Web seminar
Colin Walls (Posted 5/14/12)
The value of MISRA-compliant software
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ESL

Mentor ESL in TSMC Reference Flow 12
Thomas Bollaert (Posted 6/6/11)
48th DAC - Gary’s Magic Formula
Thomas Bollaert (Posted 6/6/11)
DAC: 9th ESL Symposium
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Valor MSS PCB Manufacturing Systems Solutions

The value of consolidated data preparation
Mark Laing (Posted 5/15/12)
Get the little things right - consistently
Bernard Sutton (Posted 5/15/12)
We're eager to hear your improvement suggestions
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Electrical & Wire Harness Design

Tracking telematics in China
John Day (Posted 5/14/12)
Comfy cars
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Packages and Passengers
J VanDomelen (Posted 4/28/12)
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Functional Verification

Dave Rich Featured on EEWeb
Tom Fitzpatrick (Posted 5/12/12)
How Did I Get Here?
Dennis Brophy (Posted 3/22/12)
Expanding the Verification Academy!
Harry Foster (Posted 2/26/12)
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IC Manufacturing

Our OWL ran down the batteries after only 1 month !
Steve Collis (Posted 1/29/10)
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IC Design

TSMC 28nm yield (SemiWiki)
Simon Favre (Posted 3/5/12)
DAC 2011 is upon us!
Simon Favre (Posted 5/11/11)
Mentor Graphics User to User (U2U)
John Ferguson (Posted 4/11/11)
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Mechanical Analysis

Top 10 Things I Learned From Engineers
Nazita Saye (Posted 5/15/12)
Smoke, Smoke, Everywhere?
Travis Mikjaniec (Posted 5/11/12)
Agile software development practices in the Mechanical Analysis Division
Robin Bornoff (Posted 5/11/12)
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PCB Design Software & Tools

PADS Tips and Tricks: Pin Swapping
Jim Martens (Posted 5/15/12)
Turn off your phone!
Patrick Carrier (Posted 5/3/12)
Is it SSN or is it Crosstalk?
Patrick Carrier (Posted 5/2/12)
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System Modeling

Rooster Tail Engineering
Mike Jensen (Posted 5/3/12)
Automotive IESF 2012
Mike Jensen (Posted 4/25/12)
Teaching and Learning CAN Bus
Mike Jensen (Posted 4/10/12)
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Vehicle System Design

IESF 2011 Moves to Frankfurt
Mike Jensen (Posted 9/26/11)
Making automotive electronics reliable
John Day (Posted 9/29/10)
Visteon’s concept car debuts in Paris
John Day (Posted 9/27/10)
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Aerospace and Military Solutions

Packages and Passengers
J VanDomelen (Posted 4/28/12)
Boeing tenacity finds its bounty
J VanDomelen (Posted 4/27/12)
Birth of a giant, and a giant rivalry
J VanDomelen (Posted 4/26/12)

Automotive Solutions

Tracking telematics in China
John Day (Posted 5/14/12)
Comfy cars
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Where would you like to charge your EV?
John Day (Posted 4/27/12)

Low Power Solutions

See ya at the Finish Dad!
Steve Collis (Posted 3/27/10)
Time to Power Diet!
Steve Collis (Posted 2/26/10)
The rest of my family need mobile devices that can charge themselves!
Steve Collis (Posted 2/12/10)

Manufacturing Variability Solutions

How do you define DFM?
David Abercrombie (Posted 5/19/09)
Are Design Rules Broken?
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Dave Rich said Make sure you are using the 32-bit version of Ques... in Using the UVM 1.0 Release with Questa
BK said How to resolve error in simulating UVM1.1 W7(64-bi... in Using the UVM 1.0 Release with Questa
(Wasted) Effort Spent In Verification | AgileSoC said [...] in that series comes via my new favorite har... in Part 5: The 2010 Wilson Research Group Functional Verification Study
(Wasted) Effort Spent In Verification | AgileSoC said [...] just spent a few minutes reading Harry Foste... in Prologue: The 2010 Wilson Research Group Functional Verification Study
More Than Two Decades and Still Going Strong; FloTHERM and FloVENT V9.3 Now Released « Robin Bornoff's blog said [...] XML strategy, whereby geometry data can be a... in FloTHERM and its new XML neutral file format
omer said Hello Dave, Thank you very much for progressive e... in SystemVerilog Coding Guidelines: Package import versus `include
Michael Ford said The currently most popular aspect of design for re... in Extreme Design!
Morad said Good blog post. I was cneikchg continuously to thi... in UVM Takes Shape in the Accellera VIP-TSC
Naomi said , what did the team at Freescale tell you that led... in Here’s how bad it was
Cody said I do not think it is wise to place the blame on an... in A car coming too fast

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Semiconductor Package Thermal Characterization and Design as Easy as 1-2-3

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