Hi there
One of the least efficient areas in PCB assembly concerns the creation and management of package data that will be consumed across the shop-floor. For example DFM processes rely on accurate package data to determine component to component spacing issues or using accurate pin terminus contact data to ensure that solder joints will form correctly. Accurate package data is critical for DFT analysis … Read More
programming, AOI, bill of materials, mixed vendor, process, documentation, data preparation, Design For Test, Flying Probe, ICT, BOM, VPL, vPlan, stencil, testability