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Mentor Blogs

Posts tagged with 'boundary scan'

11 Jun, 2013

Mark Laing Hi there Boundary Scan has been available for well over 15 years now and it has continued to evolve over that time as the initial IEEE standard 1149 has been updated to cover more than just digital devices. Although for most printed circuit designs full testing through 4 or 5 connections is not possible a significant number of designs have some number of components on them that support the Boundary … Read More

ICT, Flying Probe, testability, vPlan, boundary scan, process, Design For Test, programming, data preparation

2 Apr, 2013

Mark Laing Hi there One of the areas that we constantly look to enhance with each release is our support for the machines that are in use with our customers. Although we use the Mentor Ideas site as a opportunity to derive feedback from yourselves, I also wanted to take this chance to ask you to let me know which machines you still need us to support either because they are new to the market or needed to address … Read More

AOI, Enhancement, Flying Probe, ICT, AXI, data preparation, bill of materials, Design For Test, Automated Optical Inspection, Automated X-Ray Inspection, documentation, boundary scan, BOM, process, vPlan, SPI, THT, Solder Paste Inspection, programming

26 Feb, 2013

Mark Laing Hi there I recently discussed the new capability in Valor MSS Process Preparation 11.3. I mentioned that I would go in to more detail on some of the areas that are part of this version and I will cover the new Test Probe Placement capability today. We have added an all new Test Probe Placement Session in 11.3 that performs the physical test probe placement analysis natively within the application. This … Read More

AOI, Flying Probe, ICT, AXI, data preparation, bill of materials, Design For Test, Automated Optical Inspection, Automated X-Ray Inspection, boundary scan, BOM, process, vPlan, testability, VPL

21 Feb, 2013

Mark Laing Hi there The Valor team are here in San Diego at the IPC Apex Trade Show. We’ve had a great couple of days, meeting our customers, plenty of new ones as well as meeting with some of the other vendors at the show. Our theater presentations have been well received, bringing people in to the booth and then stopping afterwards, asking questions and looking for more information. If you are at the show … Read More

Enhancement, documentation, programming, Solder Paste Inspection, AOI, Design For Test, SPI, apex, stencil, testability, Automated Optical Inspection, VPL, BOM, Automated X-Ray Inspection, vPlan, boundary scan, approved vendor list, data preparation, AXI, AVL, bill of materials, Flying Probe, Planning, mixed vendor, OIB, IPC, ICT

20 Nov, 2012

Mark Laing Hi there It has been a few months since we launched the World Class Process Preparation Webinar including a video of an overall product demonstration. Over the past couple of months I have met with a number of people who implemented the Valor MSS Process Preparation solution and are achieving the efficiencies and improvements that we describe in the Webinar. Therefore I would like to provide you with … Read More

mixed vendor, AOI, Flying Probe, ICT, BOM, boundary scan, AVL, bill of materials, documentation, data preparation, Design For Test, vPlan, Planning, testability, VPL, stencil, programming, process

6 Nov, 2012

Mark Laing Hi there I have been posting comments on my blog now for a number of months. The topics have been based on the feedback and conversations I’ve had with many users of Process Engineering software, both Mentor Graphics and non-Mentor Graphics products, all around the world. Many of you have also taken the time to add comments on these postings which I really appreciate. I’d like to open up … Read More

mixed vendor, AOI, Flying Probe, ICT, BOM, boundary scan, AVL, bill of materials, documentation, data preparation, Design For Test, Planning, testability, vPlan, stencil, programming, process

18 Sep, 2012

Mark Laing Hi there As a follow up to my posting last week on measuring test coverage, which you can read from the following link: http://www.mentor.com/pcb-manufacturing-assembly/blog/post/how-do-you-measure-test-coverage–77cbb106-851f-4f26-a548-4857098f23d4 I would like to hear from test and process engineers on what types of equipment form part of your test and inspection strategy. How do In-Circuit test … Read More

Design For Test, Flying Probe, AOI, testability, vPlan, ICT, data preparation, BOM, programming, boundary scan

24 Sep, 2011

Mark Laing Another area I discussed in my recent article for PCB007 was with Design For Test or DFT. Ensuring that accurate test or inspection techniques have been catered for before a layout is signed off will ensure that any assembly or component issues will be found as early as possible in the manufacturing process. For each additional step during the manufacturing process it is estimated that the cost of corrective … Read More

boundary scan, Design For Test, ICT, Flying Probe

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