I posted the following reply to Daniel Nenni’s article on TSMC 28nm yield:
“I agree that design teams need to take more ownership of the yield issue. Unfortunately, yield is such a sensitive topic that people only talk about it when it’s bad! The defect density vs. die size and yield curves above represent the simplest area-based yield model, based on an average across many designs, … Read More
Mentor Blogs
Posts tagged with 'CAA'
5
Mar, 2012
11
May, 2010
This week, I’m off to present a paper on Critical Area Analysis and Memory Redundancy. It’s at the 2010 IEEE North Atlantic Test Workshop in Hopewell Junction, NY, just up the road from Fishkill. IBM is in Fishkill. IBM invented CAA in what, the 1960’s? Venturing into IBM country to speak on Critical Area Analysis is kind of like being the court jester. I just hope they don’t say, “Off with his head.” … Read More
Redundancy, CAA, SoC, SRAM
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Smart Energy Profile (SEP) 2.0 specification released – What this means to you?
Anil Khanna (Posted 5/15/13) -
When an Innovative Plan Works!
Jamie Little (Posted 5/14/13) -
Embedded education
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Where Is The Manufacturing World Coming To?
Michael Ford (Posted 5/16/13) -
Retain your existing investment in assembly programs even if you change your machines
Mark Laing (Posted 5/14/13) -
How do you manage your assembly variants?
Mark Laing (Posted 5/8/13) - All Blog Posts
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Estimating wiring harness costs in seconds
John Day (Posted 5/9/13) -
A pickup truck with park assist and a lot more
John Day (Posted 5/6/13) -
To Infinity and Beyond
J VanDomelen (Posted 4/30/13) - All Blog Posts
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OVM Gets Connected
Dennis Brophy (Posted 9/10/12) -
The floating point argument
Colin Walls (Posted 9/10/12) -
Open Stand & EDA Standardization
Dennis Brophy (Posted 8/28/12) - All Blog Posts
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Part 1: The 2012 Wilson Research Group Functional Verification Study
Harry Foster (Posted 5/8/13) -
Those nasty wire’s and reg’s in Verilog
Dave Rich (Posted 5/3/13) -
Getting AMP’ed Up on the IEEE Low-Power Standard
Dennis Brophy (Posted 4/29/13) - All Blog Posts
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Battle of Fins and BOXes
Arvind Narayanan (Posted 12/7/12) -
TSMC 28nm yield (SemiWiki)
Simon Favre (Posted 3/5/12) -
DAC 2011 is upon us!
Simon Favre (Posted 5/11/11) - All Blog Posts
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Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow Budgets
Robin Bornoff (Posted 5/15/13) -
Why Not Just Shove a Heatsink on Top of it? Part 1
Robin Bornoff (Posted 5/13/13) -
Hot Off the Press
Nazita Saye (Posted 5/3/13) - All Blog Posts
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PADS Tips and Tricks: Building a PCB Decal with Polar Patterns
Jim Martens (Posted 5/13/13) -
Interactive Routing in the PADS ES Suite
Jim Martens (Posted 5/9/13) -
Schematic Capture in the PADS ES Suite video release
Gary Lameris (Posted 5/3/13) - All Blog Posts
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EDA vs. Windows 8
Mike Jensen (Posted 5/6/13) -
VHDL-AMS Stress Modeling – Part 3
Mike Jensen (Posted 3/25/13) -
VHDL-AMS Stress Modeling - Part 2
Mike Jensen (Posted 1/28/13) - All Blog Posts
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U.S. DOT launches large V2V and V2I test
John Day (Posted 8/23/12) -
Did you know this?
John Day (Posted 6/25/12) -
Why aren’t tools from different suppliers easier to integrate?
John Day (Posted 6/19/12) - All Blog Posts
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To Infinity and Beyond
J VanDomelen (Posted 4/30/13) -
Warp Factor 10, Mr. Sulu
J VanDomelen (Posted 4/25/13) -
Bombardier Steps Up to the Big Boys
J VanDomelen (Posted 4/20/13)
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Instant Replay for Debugging SoC Level Simulations
Mark Olen (Posted 12/13/11) -
GENIVI development strategy requires competitors to cooperate
John Day (Posted 11/10/11) -
ARM Development Conference
Colin Walls (Posted 7/4/11)
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Estimating wiring harness costs in seconds
John Day (Posted 5/9/13) -
A pickup truck with park assist and a lot more
John Day (Posted 5/6/13) -
If you’re in Europe this summer
John Day (Posted 4/29/13)
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How do you define DFM?
David Abercrombie (Posted 5/19/09) -
Are Design Rules Broken?
David Abercrombie (Posted 5/15/09)
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