Home Mentor Blogs tag: ceramic and aluminum electrolytic devices

Mentor Blogs

Posts tagged with 'ceramic and aluminum electrolytic devices'

Blogs RSS

20 Oct, 2011

Manufacturing critical components in the U.S.

Posted by John Day

KEMET Corp. held a ribbon-cutting ceremony this week to inaugurate a power film capacitor manufacturing facility at its plant in Simpsonville, South Carolina. The $34.1 million project includes a $15.1 million grant from the U.S. Department of Energy (DoE), $2.5 million in incentives from the State of South Carolina, and KEMET’s own investment of $16.5 million. KEMET plans to employ at least 113 people … Read More

hybrid and electric vehicles, KEMET, ceramic and aluminum electrolytic devices, power film capacitors

Embedded Software

SEP 2.0
Colin Walls (Posted 6/17/13)
How to make use of Android on Linux IVI systems with Linux Containers
Kamran Shah (Posted 6/12/13)
Device Firmware Upgrade through USB
Colin Walls (Posted 6/10/13)
All Blog Posts

PCB Design

New PADS Website and Webinar
Jim Martens (Posted 6/11/13)
Selective Autorouting to Increase Productivity
Jim Martens (Posted 6/5/13)
What’s New with PADS?
Jim Martens (Posted 6/3/13)
All Blog Posts

Valor MSS PCB Manufacturing Systems Solutions

Do you use Boundary Scan in your PCB assembly process?
Mark Laing (Posted 6/11/13)
Juki ISS Interface, now improved
Mark Laing (Posted 5/31/13)
Where Is The Manufacturing World Coming To?
Michael Ford (Posted 5/16/13)
All Blog Posts

Electrical & Wire Harness Design

Help me find a parking space
John Day (Posted 6/14/13)
A truck transformed
John Day (Posted 6/9/13)
The massive growth of automotive electronics
John Day (Posted 5/30/13)
All Blog Posts

FPGA

OVM Gets Connected
Dennis Brophy (Posted 9/10/12)
The floating point argument
Colin Walls (Posted 9/10/12)
Open Stand & EDA Standardization
Dennis Brophy (Posted 8/28/12)
All Blog Posts

Functional Verification

Texas-Sized DAC Edition of Verification Horizons Now Up on Verification Academy
Tom Fitzpatrick (Posted 5/31/13)
IEEE 1801™-2013 UPF Standard Is Published
Dennis Brophy (Posted 5/29/13)
Part 1: The 2012 Wilson Research Group Functional Verification Study
Harry Foster (Posted 5/8/13)
All Blog Posts

IC Design

Battle of Fins and BOXes
Arvind Narayanan (Posted 12/7/12)
TSMC 28nm yield (SemiWiki)
Simon Favre (Posted 3/5/12)
DAC 2011 is upon us!
Simon Favre (Posted 5/11/11)
All Blog Posts

Mechanical Analysis

Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow Budgets
Robin Bornoff (Posted 5/15/13)
Why Not Just Shove a Heatsink on Top of it? Part 1
Robin Bornoff (Posted 5/13/13)
Hot Off the Press
Nazita Saye (Posted 5/3/13)
All Blog Posts

System Modeling

SystemVision 5.10
Mike Jensen (Posted 6/5/13)
Engineering Muscle Memory
Mike Jensen (Posted 5/21/13)
EDA vs. Windows 8
Mike Jensen (Posted 5/6/13)
All Blog Posts

Vehicle System Design

U.S. DOT launches large V2V and V2I test
John Day (Posted 8/23/12)
Did you know this?
John Day (Posted 6/25/12)
Why aren’t tools from different suppliers easier to integrate?
John Day (Posted 6/19/12)
All Blog Posts

Aerospace and Military Solutions

Lofty Goals Part One
J VanDomelen (Posted 5/30/13)
Coming Soon to a TV Near You
J VanDomelen (Posted 5/29/13)
To Infinity and Beyond
J VanDomelen (Posted 4/30/13)

Accelerating ARM-based Design

Instant Replay for Debugging SoC Level Simulations
Mark Olen (Posted 12/13/11)
GENIVI development strategy requires competitors to cooperate
John Day (Posted 11/10/11)
ARM Development Conference
Colin Walls (Posted 7/4/11)

Automotive Solutions

Help me find a parking space
John Day (Posted 6/14/13)
A truck transformed
John Day (Posted 6/9/13)
The massive growth of automotive electronics
John Day (Posted 5/30/13)

Foundry Solutions

How do you define DFM?
David Abercrombie (Posted 5/19/09)
Are Design Rules Broken?
David Abercrombie (Posted 5/15/09)

paulo luiz said Hi Robin Thanks for your clarification. I used the... in Thermal Design Perfection Starts with the use of FloTHERM PACK
Robin Bornoff said Rjb is experimentally measured as defined the the ... in Thermal Design Perfection Starts with the use of FloTHERM PACK
paulo luiz said The thermal resistance from junction to board (Rjb... in Thermal Design Perfection Starts with the use of FloTHERM PACK
prabhu_k said hi dave, i am trying to stimulate questasim 10.1... in Using the UVM 1.0 Release with Questa
Dave Rich said The functionality of uvm_container merged into UV... in An Extension to UVM: The UVM Container
Dave Rich said I know a few companies that have gone to the troub... in SystemVerilog Coding Guidelines
Linc Jepson said Dave, It's almost 4 years after this post. As fa... in SystemVerilog Coding Guidelines
simmons10 vigorda said What to Look for in a Hard Drive That You Are Purc... in Shortening Design Cycles With Concurrent Engineering
HMR said I am a bit worried some publications I have recent... in A Load of HVAC TLAs

Mentor Blogs

Posts tagged with 'ceramic and aluminum electrolytic devices'

Manufacturing critical components in the U.S.

Recent Comments

Tags

Blogs by Design Area

Mentor Blog Authors

The EDA Technology Leader™