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Mentor Blogs

Posts tagged with 'Component'

4 Jan, 2010

Robin Bornoff This series, despite being somewhat lengthy, is by no means a complete overview of the various methods, options and approaches to predicting component temperatures. Here is some stuff I didn’t cover… My bias in this series is towards the prediction of component temperature via simulation using a 3D CFD approach adopted in our (as ever) market leading FloTHERM and FloTHERM.PCB products. 3D CFD is not … Read More

Electronics Cooling, Component, T3ster, Network, Psi

17 Dec, 2009

Robin Bornoff On the sliding scale of thermal component model representation king of all is a ‘detailed’ model. A 3D definition of all of the internal construction geometry and material properties does away with any of the accuracy inconsistency issues associated with the derived CTM (thermal resistor network type) approach. Despite the fact that all models are wrong a detailed model representation of a package … Read More

Detailed, Electronics Cooling, Component, Thermal Resistor, Package Model

12 Oct, 2009

Robin Bornoff Lumped block package representation makes the best use of limited available data to simulate for an ‘indication’ of case temperature. Some indication is better than none but I wouldn’t bet on it, really, I wouldn’t. Accurate case and junction temperature prediction can only be realised with either a fully 3D detailed representation or an abstracted CTM (compact thermal model) representation. Here we’ll … Read More

Thermal Resistor, CTM, Electronics Cooling, Component, SPICE, Thermal Resistance, IBIS

9 Oct, 2009

Robin Bornoff Prediction of component temperatures is central to electronics cooling simulation, the management of their temperatures  is central to electronics cooling design. Either way, heat is dissipated inside a component, component gets hot, if component gets too hot, component stops working. When creating an electronics cooling simulation model the question of how to thermally represent the components is key. The … Read More

Component, Electronics Cooling, CFD

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