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We Love FloTHERM V9.2

Posted Apr 7, 2011, by Robin Bornoff

FloTHERM, and its sister product FloVENT, have been going since 1989. Many in the Mechanical Analysis Division in Mentor have been working on these products for that time, personally I’m up to 15 years. It’s testament to the products and their success that our passion for them continues unabated. V9.2 was released this week, the ~20th release in these product lines. Many vendors will stand … Read More

Tags: CTM, Electronics Cooling, bottleneck, FloVENT

Mechanical Analysis

Measuring the Real World

Posted Aug 2, 2010, by Nazita Saye

I believe in simulation and its effectiveness. I’ve seen how much money it can save. I’m also not the most patient person on the face of the planet. Therefore, I like simulation because it can give fast answers to rather big questions. But sometimes you need more. Sometimes you also need to measure the real world. This is especially true in the world of semiconductors. You see heat dissipation in … Read More

Tags: Thermal, T3ster, CTM, JEDEC, characteristics, package, Semiconductor, measurement hardware, NXP Semiconductors

Mechanical Analysis

So, you want to predict component temperatures do you? Part IV

Posted Nov 8, 2009, by Robin Bornoff

Next stop on the avenue of package thermal modelling is 2 resistor CTMs (compact thermal models). Specifically Theta_jb and Theta_jc, the thermal resistance between junction and board and junction and case respectively. Unlike their lowly 1R cousins these two resistances do not purport to include the effects of the package environment (well almost not) as such they should in theory be more BCI (boundary … Read More

Tags: BCI, CTM, 2R, Thermal Resistor, Electronics Cooling

Mechanical Analysis

So, you want to predict component temperatures do you? Part II

Posted Oct 12, 2009, by Robin Bornoff

Lumped block package representation makes the best use of limited available data to simulate for an ‘indication’ of case temperature. Some indication is better than none but I wouldn’t bet on it, really, I wouldn’t. Accurate case and junction temperature prediction can only be realised with either a fully 3D detailed representation or an abstracted CTM (compact thermal model) representation. Here we’ll … Read More

Tags: Thermal Resistor, CTM, Electronics Cooling, Component, SPICE, Thermal Resistance, IBIS

Electromagnetic (EM) Design & Simulation Software

Via modeling - what do I really need?
Patrick Carrier (Posted 11/2/11)
How can we obtain the s-parameters data with non-50 normalization?
Jian Zheng (Posted 2/28/11)
The effects of different bends on performances of wideband digital circuits.
Jian Zheng (Posted 8/26/10)
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Embedded Software

Measuring RTOS performance - a Web seminar
Colin Walls (Posted 5/14/12)
The value of MISRA-compliant software
John Day (Posted 5/8/12)
Preparing for GTC
Colin Walls (Posted 5/7/12)
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ESL

Mentor ESL in TSMC Reference Flow 12
Thomas Bollaert (Posted 6/6/11)
48th DAC - Gary’s Magic Formula
Thomas Bollaert (Posted 6/6/11)
DAC: 9th ESL Symposium
Thomas Bollaert (Posted 5/16/11)
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Valor MSS PCB Manufacturing Systems Solutions

The World Is Trying It’s Hardest To Leave Me Unimpressed….
Michael Ford (Posted 5/17/12)
The value of consolidated data preparation
Mark Laing (Posted 5/15/12)
Get the little things right - consistently
Bernard Sutton (Posted 5/15/12)
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Electrical & Wire Harness Design

Tracking telematics in China
John Day (Posted 5/14/12)
Comfy cars
John Day (Posted 4/30/12)
Packages and Passengers
J VanDomelen (Posted 4/28/12)
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Functional Verification

Dave Rich Featured on EEWeb
Tom Fitzpatrick (Posted 5/12/12)
How Did I Get Here?
Dennis Brophy (Posted 3/22/12)
Expanding the Verification Academy!
Harry Foster (Posted 2/26/12)
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IC Manufacturing

Our OWL ran down the batteries after only 1 month !
Steve Collis (Posted 1/29/10)
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IC Design

TSMC 28nm yield (SemiWiki)
Simon Favre (Posted 3/5/12)
DAC 2011 is upon us!
Simon Favre (Posted 5/11/11)
Mentor Graphics User to User (U2U)
John Ferguson (Posted 4/11/11)
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Mechanical Analysis

Hockey Puck Aerodynamics
Travis Mikjaniec (Posted 5/18/12)
Top 10 Things I Learned From Engineers
Nazita Saye (Posted 5/15/12)
Smoke, Smoke, Everywhere?
Travis Mikjaniec (Posted 5/11/12)
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PCB Design Software & Tools

PADS Tips and Tricks: Pin Swapping
Jim Martens (Posted 5/15/12)
Turn off your phone!
Patrick Carrier (Posted 5/3/12)
Is it SSN or is it Crosstalk?
Patrick Carrier (Posted 5/2/12)
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System Modeling

Rooster Tail Engineering
Mike Jensen (Posted 5/3/12)
Automotive IESF 2012
Mike Jensen (Posted 4/25/12)
Teaching and Learning CAN Bus
Mike Jensen (Posted 4/10/12)
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Vehicle System Design

IESF 2011 Moves to Frankfurt
Mike Jensen (Posted 9/26/11)
Making automotive electronics reliable
John Day (Posted 9/29/10)
Visteon’s concept car debuts in Paris
John Day (Posted 9/27/10)
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Aerospace and Military Solutions

Packages and Passengers
J VanDomelen (Posted 4/28/12)
Boeing tenacity finds its bounty
J VanDomelen (Posted 4/27/12)
Birth of a giant, and a giant rivalry
J VanDomelen (Posted 4/26/12)

Automotive Solutions

Tracking telematics in China
John Day (Posted 5/14/12)
Comfy cars
John Day (Posted 4/30/12)
Where would you like to charge your EV?
John Day (Posted 4/27/12)

Low Power Solutions

See ya at the Finish Dad!
Steve Collis (Posted 3/27/10)
Time to Power Diet!
Steve Collis (Posted 2/26/10)
The rest of my family need mobile devices that can charge themselves!
Steve Collis (Posted 2/12/10)

Manufacturing Variability Solutions

How do you define DFM?
David Abercrombie (Posted 5/19/09)
Are Design Rules Broken?
David Abercrombie (Posted 5/15/09)

ebay said Hello, just wanted to mention, I liked this post. ... in DAC Panel: Bridging Pre-Silicon Verification and Post-Silicon Validation
Roger said I do have to agree. Learning to be computer engien... in X-Ray Vision Glasses … Here and Now
Mutlu said Hi John,Thanks for the comment.I think you and I a... in UVM Adoption: Go Native-UVM or use OVM Compatibility Kit?
Dave Rich said Make sure you are using the 32-bit version of Ques... in Using the UVM 1.0 Release with Questa
BK said How to resolve error in simulating UVM1.1 W7(64-bi... in Using the UVM 1.0 Release with Questa
(Wasted) Effort Spent In Verification | AgileSoC said [...] in that series comes via my new favorite har... in Part 5: The 2010 Wilson Research Group Functional Verification Study
(Wasted) Effort Spent In Verification | AgileSoC said [...] just spent a few minutes reading Harry Foste... in Prologue: The 2010 Wilson Research Group Functional Verification Study
More Than Two Decades and Still Going Strong; FloTHERM and FloVENT V9.3 Now Released « Robin Bornoff's blog said [...] XML strategy, whereby geometry data can be a... in FloTHERM and its new XML neutral file format
omer said Hello Dave, Thank you very much for progressive e... in SystemVerilog Coding Guidelines: Package import versus `include
Michael Ford said The currently most popular aspect of design for re... in Extreme Design!

Mentor Blogs

Posts tagged with 'CTM'

We Love FloTHERM V9.2

Measuring the Real World

So, you want to predict component temperatures do you? Part IV

So, you want to predict component temperatures do you? Part II

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