Electronics cooling simulation was born out of the world of CFD, rather fully conjugate heat transfer simulation where convective, radiative and conductive affects are considered concurrently. Back in the day much talk was had about turbulence modelling, convective discretisation schemes and linear equation solvers, all typical CFD subjects but somewhat out of place in the context of what became the … Read More
Posts tagged with 'CTM'
FloTHERM, and its sister product FloVENT, have been going since 1989. Many in the Mechanical Analysis Division in Mentor have been working on these products for that time, personally I’m up to 15 years. It’s testament to the products and their success that our passion for them continues unabated. V9.2 was released this week, the ~20th release in these product lines. Many vendors will stand … Read More
I believe in simulation and its effectiveness. I’ve seen how much money it can save. I’m also not the most patient person on the face of the planet. Therefore, I like simulation because it can give fast answers to rather big questions. But sometimes you need more. Sometimes you also need to measure the real world. This is especially true in the world of semiconductors. You see heat dissipation in … Read More
Next stop on the avenue of package thermal modelling is 2 resistor CTMs (compact thermal models). Specifically Theta_jb and Theta_jc, the thermal resistance between junction and board and junction and case respectively. Unlike their lowly 1R cousins these two resistances do not purport to include the effects of the package environment (well almost not) as such they should in theory be more BCI (boundary … Read More
Lumped block package representation makes the best use of limited available data to simulate for an ‘indication’ of case temperature. Some indication is better than none but I wouldn’t bet on it, really, I wouldn’t. Accurate case and junction temperature prediction can only be realised with either a fully 3D detailed representation or an abstracted CTM (compact thermal model) representation. Here we’ll … Read More
Embedded software development books
Colin Walls (Posted 12/8/14)
Yet more embedded articles - power, MMUs, the static keyword, and multicore
Colin Walls (Posted 12/1/14)
Colin Walls (Posted 11/24/14)
PADS Home Page
NASA Wins Mentor Technology Leadership Award With PADS!
John McMillan (Posted 12/11/14)
Touch Screen Use in PCB Design?
John McMillan (Posted 12/9/14)
7 PCB SILKSCREEN QUICK TIPS - White paper
John McMillan (Posted 11/30/14)
Valor PCB Manufacturing Systems Solutions
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Latest Issue of Verification Horizons Available!
Tom Fitzpatrick (Posted 12/12/14)
SystemVerilog Testbench Debug - Are we having fun yet?
Rich Edelman (Posted 11/24/14)
ARM® Techcon Paper Report: How Microsoft Saved 4 Man-Months Meeting Their Coverage Closure Goals Using Automated Verification Management & Formal Apps
Joe Hupcey III (Posted 11/17/14)
Domestic Hot Water Heating, 'Wat-er' Waste of Energy. Part 1: Pun Intended
Robin Bornoff (Posted 12/15/14)
If You're Going to Lose it, You Might as Well Use it!
Robin Bornoff (Posted 11/25/14)
Help from Above
Nazita Saye (Posted 11/20/14)
Silicon Test and Yield Analysis
Vehicle System Design
U.S. DOT launches large V2V and V2I test
John Day (Posted 8/23/12)
Did you know this?
John Day (Posted 6/25/12)
Why aren’t tools from different suppliers easier to integrate?
John Day (Posted 6/19/12)
3D-IC Design and Test Solutions
Shelly Stalnaker (Posted 3/20/14)
Aerospace and Military Solutions
Accelerating ARM-based Design
Instant Replay for Debugging SoC Level Simulations
Mark Olen (Posted 12/13/11)
GENIVI development strategy requires competitors to cooperate
John Day (Posted 11/10/11)
ARM Development Conference
Colin Walls (Posted 7/4/11)
Automotive Ethernet Takes Three Steps Forward
John Day (Posted 12/11/14)
Testing the 2015 Subaru Outback
John Day (Posted 12/5/14)
2nd International Conference on Advanced Automotive 48V Power Supply Systems
John Day (Posted 11/28/14)