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Mentor Blogs

Posts tagged with 'Design Process'

13 Nov, 2009

John Parry Thermal headroom is a concept I’ve been pushing for a few years, but I guess many people aren’t familiar with it, so I thought some additional commentary would be appropriate. Here goes: What I’ve drawn looks pretty simple. Starting from the ambient we can attribute to total temperature rise for some critical IC to a temperature rise in the air, the PCB and/or heat sink, then the temperature rise in … Read More

Thermal Headroom, Design Flow, Design Process, CFD, FloTHERM.PACK

15 Oct, 2009

John Parry I’d expected to be posting about FloTHERM.PACK this time, but I thought I’d better let you know what I’ve been working on the last couple of weeks instead. I’ve been putting together the Mechanical Analysis Division’s presentations for the European Solutions Expos in Finland, The Netherlands, Sweden, and Egypt amongst other places, plus the Alcatel Thales forum in Paris and U2U in Munich. Details of … Read More

Solutions Expo, FloTHERM.PACK, Design Process, Saving Cost, Saving Time, FloTHERM.PCB, PCB Respin

10 Sep, 2009

John Parry I thought I’d put up a brief post about an exciting series of free web seminars that address key engineering challenges in product design. The first of these is a seminar aimed at engineering managers to explain how their mechanical designers can perform a CFD Analysis without leaving the familiar comfort of their MCAD tool. Web Seminar: CFD Analysis for MCAD Designers - Better Products, Faster Historically … Read More

CFD History, Design Process, CFD, Mesh Generation, Meshing

14 Aug, 2009

John Parry Strictly speaking that’s mechanical engineers, and the information comes from Parametric Design Corporation (PTC), in their white paper Five Things You Should Know About 3D CAD Software. As PTC say - it’s a startling fact. Having had experience of keeping track of my own time to charge to different projects the figure really jumped out at me. I found that if you take away the time spent on internal … Read More

Design Flow, ROI, Return on Investment, CAE Market, Design Process, Flow Behavior

1 Jun, 2009

John Parry To many professional analysts with a background in Computational Fluid Dynamics, most electronics cooling applications look pretty straightforward. There aren’t any complex physical processes to model like combustion (well hopefully not), high pressures or high temperatures (again, hopefully not) or high speed flow. Typically there are no free surfaces or multiphase flows, and no moving geometry. So, … Read More

Design Process, CFD, Mesh Generation, Meshing

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