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Mentor Blogs

Posts tagged with 'Electronics Cooling'

25 Feb, 2014

John Parry SEMI-THERM is one of the premier thermal management conferences and has the most targeted exhibition by far, with some 40+ exhibitors, including Mentor Graphics as Platinum Sponsor, so it’s a great place to network with people in the ‘cooling business’. The exhibition is FREE TO ATTEND, so if you’re in the bay area and interested in thermal management stop by and see us at the DoubleTree Hotel and … Read More

Electronics Cooling, Flomerics, CFD, SEMI-THERM, T3ster, JEDEC

25 Feb, 2014

Robin Bornoff Electronic products, and products that contain electronics, are typified by being constructed of 100s if not 1000s of individual parts. A CPU alone is the most complex manufactured product on earth as demonstrated in this excellent picture story on Tom's Hardware. From the IC through package, PCB and chassis, items are glued, cured, soldered, screwed and assembled into the myriad of products that run … Read More

flotherm v10, Electronics Cooling

14 Feb, 2014

Robin Bornoff FloTHERM V10 is a major release that marks 25 years as the leading electronics thermal simulation tool. This series will introduce the top 10 features that we've delivered, hopefully giving some insights not just on the features themselves, but also on the background as to how and why we've developed them. To start with let's look at the most obvious change, a new graphical user interface (GUI). … Read More

flotherm v10, Electronics Cooling

15 Jan, 2014

Robin Bornoff The latest release of FloTHERM, V10, is now available! It is a major release, satisfying over 40 software enhancement requests as posted and voted on by the FloTHERM userbase on the Mentor IDEAS site. The release addresses user feedback regarding pre-processing model definition and debugging, vastly improves the performance of the CFD solver, extends FloTHERM’s transient simulation capability … Read More

flotherm v10, Electronics Cooling

14 Nov, 2013

Robin Bornoff Late in 1988 two key employees of CHAM (Concentration Heat And Momentum Ltd.), the first commercial CFD vendor and at the time market leader, left to set up a new type of CFD company. Recognising the opportunity to package CFD in focussed, highly automated and application specific products, David Tatchell and Harvey Rosten started to develop what would become FloTHERM. A CFD simulation tool targeted … Read More

Electronics Cooling

25 Oct, 2013
Mechanical Analysis

Future Phone

Posted by Nazita Saye

Nazita Saye You all know how gadget-mad I am, right? Well guess what’s got my senses buzzing today? A mobile phone that you can build yourself from various components … something akin to a Lego phone and it’s called the Phoneblok. A Dutch designer, Dave Hakkens, came up with the idea after he wanted to replace a single broken component in his mobile phone. When he was told that he couldn’t just replace the broken … Read More

CFD, Electronics Cooling, Airflow

5 Jul, 2013

Robin Bornoff An appreciation of heat flow paths is a pre-requisite for good thermal design. If you attempt to augment heat flow where there is none then your expectations are as futile as your design skills. The real value of simulation for me is that it enables an insight into the behaviour of a proposed design (this is true for simulation of any design and any behaviour). Once you understand the true physics of … Read More

Heatsink, Electronics Cooling

15 May, 2013

Robin Bornoff Two different package styles, two very different thermal responses when a extruded plate fin heatsink is placed on each. At the very least a FloTHERM simulation can be used to observe the thermal behaviour of a product concept, beyond that it can be used to understand *why* the thermal behaviour is what it is. In Part 1 we saw that the BGA type package benefited from an 81% drop of junction temperature … Read More

Heatsink, Electronics Cooling, Jessica Alba and Mena Suvari and George Clooney and Leonardo DiCaprio

13 May, 2013

Robin Bornoff A common enough question. Heatsinks are often perceived to be the magic answer to all electronics cooling challenges. They should be called ‘area extenders’ as heat does not just disappear into them. Heat spreads throughout a heatsink passing to the air over a much larger area than it would otherwise do. Air can then do its magic, whisking the heat away thus keeping the electronics that … Read More

Heatsink, Electronics Cooling

19 Apr, 2013

Robin Bornoff In the royal family of thermal IC package modelling types, a detailed model is King. All critical 3D geometry is modelled explicitly, no abstraction into a thermal resistor equivalent model, no hiding all the proprietary design information inside either. Pros and cons of detailed models I covered a few years ago in this blog. Packaged ICs are complex, constructed of many parts, with many different material … Read More

Electronics Cooling, calibration, Package Model, T3ster

5 Apr, 2013

Robin Bornoff By way of an apology for the more verbose blogs I’ve been issuing recently I’d like to present you with a blog that serves no other purpose than to show a pretty picture. CFD as an acronym has quite a few different interpretations. Contracts for Difference if you’re into your financials. Colour For Directors if you’re in marketing. Cheats, Frauds and Deceivers if you’re … Read More

Electronics Cooling, CFD

5 Apr, 2013

Robin Bornoff Electronics cooling simulation was born out of the world of CFD, rather fully conjugate heat transfer simulation where convective, radiative and conductive affects are considered concurrently. Back in the day much talk was had about turbulence modelling, convective discretisation schemes and linear equation solvers, all typical CFD subjects but somewhat out of place in the context of what became the … Read More

CTM, Electronics Cooling, CFD, T3ster

22 Feb, 2013

Robin Bornoff The JESD51-14 standard was published in November 2010, prepared by the  JEDEC JC-15 Committee on Thermal Characterization. It outlines a new process to measure what is the most common IC package thermal metric, Theta_jc. This is the thermal resistance between the die and the package case face. More specifically the face of the package that is to be cooled by an external heatsinking method. Theta_jc … Read More

JEDEC, Electronics Cooling, JESD51-14, Theta_jc

25 Jan, 2013

Robin Bornoff The temperature rise that electronic components attain in operation is due to 3 things. The power that they dissipate, the ambient temperature surrounding the product and the various thermal bottlenecks that the heat passes through on its journey from the source to the ambient. An accurate simulation requires all 3 aspects to be modelled correctly. In terms of the bottlenecks, conductive resistance … Read More

Electronics Cooling, DynTIM, thermal conductivity, TIM

18 Jan, 2013

Robin Bornoff Before you sell it, or commission it, you want to be sure that it works. Monies have been spent on getting things this far, some of it on you via your overhead and your expansive salary (yeh, ok, I hear you). Expectation is that your organisation will make more money back. Last thing you want is to have your product fail, have to be tweaked, fixed, respun, redesigned or canned. What you’d like … Read More

T3ster, Electronics Cooling, TERALED

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