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Mentor Blogs

Posts tagged with 'Electronics Cooling'

5 Apr, 2013

Robin Bornoff By way of an apology for the more verbose blogs I’ve been issuing recently I’d like to present you with a blog that serves no other purpose than to show a pretty picture. CFD as an acronym has quite a few different interpretations. Contracts for Difference if you’re into your financials. Colour For Directors if you’re in marketing. Cheats, Frauds and Deceivers if you’re … Read More

Electronics Cooling, CFD

5 Apr, 2013

Robin Bornoff Electronics cooling simulation was born out of the world of CFD, rather fully conjugate heat transfer simulation where convective, radiative and conductive affects are considered concurrently. Back in the day much talk was had about turbulence modelling, convective discretisation schemes and linear equation solvers, all typical CFD subjects but somewhat out of place in the context of what became the … Read More

CTM, Electronics Cooling, CFD, T3ster

22 Feb, 2013

Robin Bornoff The JESD51-14 standard was published in November 2010, prepared by the  JEDEC JC-15 Committee on Thermal Characterization. It outlines a new process to measure what is the most common IC package thermal metric, Theta_jc. This is the thermal resistance between the die and the package case face. More specifically the face of the package that is to be cooled by an external heatsinking method. Theta_jc … Read More

JEDEC, Electronics Cooling, JESD51-14, Theta_jc

25 Jan, 2013

Robin Bornoff The temperature rise that electronic components attain in operation is due to 3 things. The power that they dissipate, the ambient temperature surrounding the product and the various thermal bottlenecks that the heat passes through on its journey from the source to the ambient. An accurate simulation requires all 3 aspects to be modelled correctly. In terms of the bottlenecks, conductive resistance … Read More

Electronics Cooling, DynTIM, thermal conductivity, TIM

18 Jan, 2013

Robin Bornoff Before you sell it, or commission it, you want to be sure that it works. Monies have been spent on getting things this far, some of it on you via your overhead and your expansive salary (yeh, ok, I hear you). Expectation is that your organisation will make more money back. Last thing you want is to have your product fail, have to be tweaked, fixed, respun, redesigned or canned. What you’d like … Read More

T3ster, Electronics Cooling, TERALED

27 Sep, 2012

Robin Bornoff I put the title in quotes as it’s the title of a blog post by John Chawner at Pointwise who keeps a pleasantly vendor neutral(ish) blog about all things CFD called ‘Another Fine Mesh’, including the excellent weekly ‘This Week in CFD’ that is becoming a bit of a mecca for the CFD community. John’s blog focusses on a white paper Mentor issued recently about How to … Read More

Electronics Cooling, FloEFD, CFD, FloVENT

9 Aug, 2012

Robin Bornoff One thing the Mechanical Analysis Division is not guilty of is vendor hubris. Despite the passion we have about our CFD based simulation solutions we know our place, especially in terms of where best to apply our solutions throughout the design process. CFD is a very powerful tool to predict 3D heat air flow and heat transfer but it certainly isn’t the only approach. As is common in both electronics … Read More

FloVENT, HVAC, Electronics Cooling, thermal comfort, U-Value

3 May, 2012

Robin Bornoff It has been almost 3 years since I started this blog and I hope you’ve found it as interesting as I have cathartic. Although I’m not as yet bereft of topic ideas, I thought this would be a good time to solicit a guest blog from industry. It was either that or a Simponsesque montage of previous posts. I covered the highly successful provision of FloTHERM models of power packages from NXP … Read More

NXP, Electronics Cooling, thermal design guide

17 Apr, 2012

Robin Bornoff In 1989 Flomerics was the first organisation to provide application specific CFD based simulation software where all pre and post-processing capabilities were contained within a single WIMP based graphical user interface. That pioneering period involved missionary sales to add simulation to the arsenal of the design engineer, enabling virtual prototyping to be used as a precursor to physical build and … Read More

FloVENT, Electronics Cooling, HVAC, XML

4 Apr, 2012

Robin Bornoff The UK government has a policy for all year 10 or year 11 students to undertake a week’s work experience. Last week we welcomed a 15 year old student to the Mentor office where the FloTHERM and FloVENT software development is done. The student was tasked with simulating the air flow and temperature distribution in the office space using FloVENT. Using our own software to model our own offices … Read More

Electronics Cooling, FloVENT, CFD, HVAC, thermal comfort

10 Feb, 2012

Robin Bornoff As with all good inventions, you quickly wonder how on earth you could have done without them before. Relieving thermal bottlenecks reduce temperatures; it’s so blindingly obvious. Now that we have the ability to visualise with FloTHERM exactly where the thermal bottlenecks are in a design, the job of the (overworked/underpaid) thermal design engineer just got that more productive. Electronic … Read More

Electronics Cooling, bottleneck, thermal bottleneck, thermal chokepoint

30 Jan, 2012

Robin Bornoff ‘Bits stuck onto other bits’, a succinct definition of an electronic product, if not a product that contains electronics. Soldering is the method of choice for getting the components to attach to the pcb, the layered board that contains the metallic traces connecting component pins to other component pins. Rivets, welds, screws or bolts for the chassis, some form of gluing or sticky adhesion … Read More

Electronics Cooling, CFD, thermal chokepoint, T3ster, thermal bottleneck

22 Jan, 2012

Robin Bornoff By far and away the most common enquiry by someone using FloTHERM, especially at the start of their adoption, is “How do I model my components?”. This is hardly surprising as the mainstay of electronics thermal management is the control of operating component temperatures (junction and/or case). A virtual prototyping design by simulation approach requires models of components capable of such predictions. … Read More

NXP Semiconductors, Electronics Cooling

18 Jan, 2012

Robin Bornoff Probably due to the beer fridge, I now seem to be becoming the repository of broken electronic products with an expectation that the cause of their demise can be identified, retrospectively, using thermal simulation. This week my good colleague John Parry dumped a rather poorly DVD player on my desk with a ‘go on then’ look. There’s nothing quite like the sight of a scorched PCB to … Read More

bottleneck, Electronics Cooling, beer, thermal interface material, TIM, thermal bottleneck

9 Jan, 2012

Robin Bornoff It’s estimated that, from a figure of 0.4% in 1995, now about 30% of the world’s population are ‘internet users’. Not sure exactly what being a ‘user’ entails; looking at a web page? clicking a link? sending an email? Probably the latter considering how many I receive. The Romans used little wax or wooden tablets, the Victorians introduced a penny-post system, today … Read More

Email, Electronics Cooling, telecoms

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