Sign In
Forgot Password?
Sign In | | Create Account

Mentor Blogs

Posts tagged with 'Electronics Cooling'

10 Feb, 2012

Robin Bornoff As with all good inventions, you quickly wonder how on earth you could have done without them before. Relieving thermal bottlenecks reduce temperatures; it’s so blindingly obvious. Now that we have the ability to visualise with FloTHERM exactly where the thermal bottlenecks are in a design, the job of the (overworked/underpaid) thermal design engineer just got that more productive. Electronic … Read More

Electronics Cooling, bottleneck, thermal bottleneck, thermal chokepoint

30 Jan, 2012

Robin Bornoff ‘Bits stuck onto other bits’, a succinct definition of an electronic product, if not a product that contains electronics. Soldering is the method of choice for getting the components to attach to the pcb, the layered board that contains the metallic traces connecting component pins to other component pins. Rivets, welds, screws or bolts for the chassis, some form of gluing or sticky adhesion … Read More

Electronics Cooling, CFD, thermal chokepoint, T3ster, thermal bottleneck

22 Jan, 2012

Robin Bornoff By far and away the most common enquiry by someone using FloTHERM, especially at the start of their adoption, is “How do I model my components?”. This is hardly surprising as the mainstay of electronics thermal management is the control of operating component temperatures (junction and/or case). A virtual prototyping design by simulation approach requires models of components capable of such predictions. … Read More

NXP Semiconductors, Electronics Cooling

18 Jan, 2012

Robin Bornoff Probably due to the beer fridge, I now seem to be becoming the repository of broken electronic products with an expectation that the cause of their demise can be identified, retrospectively, using thermal simulation. This week my good colleague John Parry dumped a rather poorly DVD player on my desk with a ‘go on then’ look. There’s nothing quite like the sight of a scorched PCB to … Read More

bottleneck, Electronics Cooling, beer, thermal interface material, TIM, thermal bottleneck

9 Jan, 2012

Robin Bornoff It’s estimated that, from a figure of 0.4% in 1995, now about 30% of the world’s population are ‘internet users’. Not sure exactly what being a ‘user’ entails; looking at a web page? clicking a link? sending an email? Probably the latter considering how many I receive. The Romans used little wax or wooden tablets, the Victorians introduced a penny-post system, today … Read More

Email, Electronics Cooling, telecoms

3 Jan, 2012

Robin Bornoff LED based lighting is now a very hot topic (believe me, in electronic thermal management circles that used to be funny, the first few times). Control of packaged IC junction temperatures will always have a bearing on reliability but for LEDs thermal also effects functional performance in terms of brightness and colour. The hotter they get, the dimmer they appear. A particular contradiction in the context … Read More

LED, Electronics Cooling, TERALED, LEDs, T3ster

23 Dec, 2011

Robin Bornoff Joseph Fourier led a full and interesting life. Apart from his obvious legacy of Fourier’s Law that relates the temperature difference across a solid to the steady state heat flow through it he was also once governor of lower Egypt and Permanent Secretary of the French Academy of Sciences. It was with a little more than a passing sense of irony that his belief in wrapping the body up in blankets … Read More

Electronics Cooling, die level thermal analysis, sub-micron scale

17 Nov, 2011

Robin Bornoff My colleague Ed and I were marvelling the other day at the CPU cooling unit from one of our training desktop PCs undergoing a repair. “What, all that just for that!?”. The CPU itself was but a small square wafer compared to the behemoth that was the ducted fan and heatsink with integral heatpipes mounted on top of it. Whereas transistor sizes are measured in nanometres cooling systems can … Read More

CPU cooling, Electronics Cooling, CFD, PC cooling, Heatsink

28 Oct, 2011

Robin Bornoff What do you call someone who doesn’t believe in Father Christmas? A rebel without a Claus. Right, that’s that out of the way. This week Facebook announced that it plans to build a 300,000 ft^2 data center in Lulea, Sweden. The Lulea business agency who helped attract Facebook to their city are dutifully excited as should Facebook be as they look set to capitalise on 10 months each year of … Read More

data center cooling, data centre, Data Center, HVAC, PUE, Electronics Cooling, FloVENT

20 Oct, 2011

Robin Bornoff ‘Rubbish In -> Rubbish Out’ is a well accepted fact in the world of simulation. Regardless of the technical capabilities of your thermal simulation tool, the accuracy of prediction will always be tightly coupled to the accuracy of the input data. The most accurate thermal  IC package model is a so called ‘detailed’ model where all the internal construction is represented explicitly … Read More

Electronics Cooling, detailed thermal IC package models, T3ster, FloTHERM PACK, strucutre functions

18 Oct, 2011

Robin Bornoff It would only have cost me an extra £170, a small extra compared to the cost of the rest of the build, but I decided against laying thermal insulation boards directly under the underfloor electric heating mats. Surely better to leak some of the heat down to heat the 100mm thick concrete screed which would maintain its heat through those cold winter weeks, giving thermal support to the heating mats in … Read More

FloVENT, Electronics Cooling, HVAC, underfloor heating

19 Aug, 2011

Robin Bornoff

3D simulation can provide a detailed prediction of temperature and heat flux values at 10s of 1000s of points in a 3D model, experimental methods are somewhat limited in terms of the wealth of data they are capable of providing. But hey, this isn’t going to degrade into a pitched battle between simulators and experimentalists, nowadays good engineers (should) do both. “No one believes simulation

Read More

HVAC, Electronics Cooling, underfloor heating, FloVENT

11 Aug, 2011

Robin Bornoff It’s been over two years since the foundations went in for the extension we’re building on our house. In that time I’ve come to respect and somewhat rely on glib phrases such as “Good things come to those who wait” and “Patience is a virtue”. I told my better half we’d be moved in by Christmas, I didn’t say which one though. In this blog series of … Read More

FloVENT, Electronics Cooling, HVAC, underfloor heating

12 Jun, 2011

Robin Bornoff Thermal simulation of electronic systems using FloTHERM usually involve the definition of the 3D geometry and relevant material properties, specification of the power dissipation of the components as well as the ambient temperature that together lead to a numerical prediction of the resulting heat fluxes and temperatures. If the predicted component temperatures are too high then you’ve got a problem. … Read More

Electronics Cooling, active heatsink, LN2, overclocking

6 Jun, 2011

Robin Bornoff I’m a big fan of product demonstrations. Having once been an application engineer, there’s nothing quite like the thrill of showing the use of a software like FloTHERM live in front of a prospect. Concentrating on highlighting the main features of the product whilst being bombarded with a barrage of questions about it is certainly a lesson in focus. At the Gadget Show live event mentioned … Read More

liquid nitrogen, Electronics Cooling, LN2, overclocking

Valor MSS PCB Manufacturing Systems Solutions

Electrical & Wire Harness Design

Functional Verification

IC Manufacturing

IC Design

Mechanical Analysis

Silicon Test and Yield Analysis

System Modeling

Vehicle System Design

3D-IC Design and Test Solutions

Aerospace and Military Solutions

Accelerating ARM-based Design

Automotive Solutions

Foundry Solutions

Recent Comments