Sign In
Forgot Password?
Sign In | | Create Account

Mentor Blogs

Posts tagged with 'Electronics Cooling'

25 Oct, 2013
Mechanical Analysis

Future Phone

Posted by Nazita Saye

Nazita Saye You all know how gadget-mad I am, right? Well guess what’s got my senses buzzing today? A mobile phone that you can build yourself from various components … something akin to a Lego phone and it’s called the Phoneblok. A Dutch designer, Dave Hakkens, came up with the idea after he wanted to replace a single broken component in his mobile phone. When he was told that he couldn’t just replace the broken … Read More

CFD, Electronics Cooling, Airflow

5 Jul, 2013

Robin Bornoff An appreciation of heat flow paths is a pre-requisite for good thermal design. If you attempt to augment heat flow where there is none then your expectations are as futile as your design skills. The real value of simulation for me is that it enables an insight into the behaviour of a proposed design (this is true for simulation of any design and any behaviour). Once you understand the true physics of … Read More

Heatsink, Electronics Cooling

15 May, 2013

Robin Bornoff Two different package styles, two very different thermal responses when a extruded plate fin heatsink is placed on each. At the very least a FloTHERM simulation can be used to observe the thermal behaviour of a product concept, beyond that it can be used to understand *why* the thermal behaviour is what it is. In Part 1 we saw that the BGA type package benefited from an 81% drop of junction temperature … Read More

Heatsink, Electronics Cooling, Jessica Alba and Mena Suvari and George Clooney and Leonardo DiCaprio

13 May, 2013

Robin Bornoff A common enough question. Heatsinks are often perceived to be the magic answer to all electronics cooling challenges. They should be called ‘area extenders’ as heat does not just disappear into them. Heat spreads throughout a heatsink passing to the air over a much larger area than it would otherwise do. Air can then do its magic, whisking the heat away thus keeping the electronics that … Read More

Heatsink, Electronics Cooling

19 Apr, 2013

Robin Bornoff In the royal family of thermal IC package modelling types, a detailed model is King. All critical 3D geometry is modelled explicitly, no abstraction into a thermal resistor equivalent model, no hiding all the proprietary design information inside either. Pros and cons of detailed models I covered a few years ago in this blog. Packaged ICs are complex, constructed of many parts, with many different material … Read More

Electronics Cooling, calibration, Package Model, T3ster

5 Apr, 2013

Robin Bornoff By way of an apology for the more verbose blogs I’ve been issuing recently I’d like to present you with a blog that serves no other purpose than to show a pretty picture. CFD as an acronym has quite a few different interpretations. Contracts for Difference if you’re into your financials. Colour For Directors if you’re in marketing. Cheats, Frauds and Deceivers if you’re … Read More

Electronics Cooling, CFD

5 Apr, 2013

Robin Bornoff Electronics cooling simulation was born out of the world of CFD, rather fully conjugate heat transfer simulation where convective, radiative and conductive affects are considered concurrently. Back in the day much talk was had about turbulence modelling, convective discretisation schemes and linear equation solvers, all typical CFD subjects but somewhat out of place in the context of what became the … Read More

CTM, Electronics Cooling, CFD, T3ster

22 Feb, 2013

Robin Bornoff The JESD51-14 standard was published in November 2010, prepared by the  JEDEC JC-15 Committee on Thermal Characterization. It outlines a new process to measure what is the most common IC package thermal metric, Theta_jc. This is the thermal resistance between the die and the package case face. More specifically the face of the package that is to be cooled by an external heatsinking method. Theta_jc … Read More

JEDEC, Electronics Cooling, JESD51-14, Theta_jc

25 Jan, 2013

Robin Bornoff The temperature rise that electronic components attain in operation is due to 3 things. The power that they dissipate, the ambient temperature surrounding the product and the various thermal bottlenecks that the heat passes through on its journey from the source to the ambient. An accurate simulation requires all 3 aspects to be modelled correctly. In terms of the bottlenecks, conductive resistance … Read More

Electronics Cooling, DynTIM, thermal conductivity, TIM

18 Jan, 2013

Robin Bornoff Before you sell it, or commission it, you want to be sure that it works. Monies have been spent on getting things this far, some of it on you via your overhead and your expansive salary (yeh, ok, I hear you). Expectation is that your organisation will make more money back. Last thing you want is to have your product fail, have to be tweaked, fixed, respun, redesigned or canned. What you’d like … Read More

T3ster, Electronics Cooling, TERALED

27 Sep, 2012

Robin Bornoff I put the title in quotes as it’s the title of a blog post by John Chawner at Pointwise who keeps a pleasantly vendor neutral(ish) blog about all things CFD called ‘Another Fine Mesh’, including the excellent weekly ‘This Week in CFD’ that is becoming a bit of a mecca for the CFD community. John’s blog focusses on a white paper Mentor issued recently about How to … Read More

Electronics Cooling, FloEFD, CFD, FloVENT

9 Aug, 2012

Robin Bornoff One thing the Mechanical Analysis Division is not guilty of is vendor hubris. Despite the passion we have about our CFD based simulation solutions we know our place, especially in terms of where best to apply our solutions throughout the design process. CFD is a very powerful tool to predict 3D heat air flow and heat transfer but it certainly isn’t the only approach. As is common in both electronics … Read More

FloVENT, HVAC, Electronics Cooling, thermal comfort, U-Value

3 May, 2012

Robin Bornoff It has been almost 3 years since I started this blog and I hope you’ve found it as interesting as I have cathartic. Although I’m not as yet bereft of topic ideas, I thought this would be a good time to solicit a guest blog from industry. It was either that or a Simponsesque montage of previous posts. I covered the highly successful provision of FloTHERM models of power packages from NXP … Read More

NXP, Electronics Cooling, thermal design guide

17 Apr, 2012

Robin Bornoff In 1989 Flomerics was the first organisation to provide application specific CFD based simulation software where all pre and post-processing capabilities were contained within a single WIMP based graphical user interface. That pioneering period involved missionary sales to add simulation to the arsenal of the design engineer, enabling virtual prototyping to be used as a precursor to physical build and … Read More

FloVENT, Electronics Cooling, HVAC, XML

4 Apr, 2012

Robin Bornoff The UK government has a policy for all year 10 or year 11 students to undertake a week’s work experience. Last week we welcomed a 15 year old student to the Mentor office where the FloTHERM and FloVENT software development is done. The student was tasked with simulating the air flow and temperature distribution in the office space using FloVENT. Using our own software to model our own offices … Read More

Electronics Cooling, FloVENT, CFD, HVAC, thermal comfort

Valor MSS PCB Manufacturing Systems Solutions

Electrical & Wire Harness Design

Functional Verification

IC Manufacturing

IC Design

Mechanical Analysis

Silicon Test and Yield Analysis

System Modeling

Vehicle System Design

3D-IC Design and Test Solutions

Aerospace and Military Solutions

Accelerating ARM-based Design

Automotive Solutions

Foundry Solutions

Recent Comments