Posted Feb 17, 2012, by Per Viklund
The IPC Embedded Mailing list (EmbeddedNet@IPC.org) has been silent –some may claim stone dead for a very long time.
My article and subsequent blog posts claiming that there never was an Embedded Passive boom apparently provoked some and an intense discussion broke out on the mailing list where EP material vendors, IPC, EIA, EIC standardization committee members, PCB designers, board shops….argued … Read More
Tags:
Expedition PCB,
Expedition,
HERMES,
ECP,
EMAP,
"Embedded Passives",
embedded parts,
EP,
Embedded,
embedded actives
Posted Jan 30, 2012, by Per Viklund
Do you remember the hype on EP’s (Embedded Passives) just a few years ago?
In the PCBD&F magazine, late in 2006, Kathy Nargi-Toth wrote in an Editorial to PCD&F referring to an industry survey:
The statistic that blew me away was the change in anticipated implementation of embedded passives.
The projections are that 24.6% of the PCBs, up 222% over current figures, will incorporate embedded … Read More
Tags:
EP,
Expedition,
"Embedded Passives",
Expedition Enterprise
Posted May 23, 2011, by Patrick Carrier
Proper stackup design is the key to ensuring maximum performance for your PCB design. Electromagnetic compatibility, signal integrity, power integrity - even proper thermal performance - can all be ensured with the proper stackup design. Given the high route density of most boards nowadays, you try to pack as many routing layers as possible into a given thickness. For most large-scale consumer products, … Read More
Tags:
Expedition,
HyperLynx,
EMC,
Signal Integrity,
stackup,
layers,
Power Integrity
Posted Jan 18, 2011, by John Isaac
The Aberdeen Group conducted a survey of 536 electronics company management types to determine what business results (time-to-market, product cost and competitiveness, quality, … ) qualified them as “Best-in-Class” status. They then matched those BiC companies with common PCB design best practices that they had identified to help bring them to that status.
Highlighted as the 3 top … Read More
Tags:
design concurrency,
Collaboration,
Signal Integrity,
Thermal Analysis,
Expedition
Posted Jul 20, 2010, by Nazita Saye
In a recent survey, 60% of mechanical engineers in electronics companies stated that thermal issues had forced board layout changes during the previous 12 months. While I can’t purport to know how much respins cost within every organization, I’m willing to bet it is not an insignificant amount – especially if the company has a large portfolio. But I know that thermal simulation can help minimize the … Read More
Tags:
Respin,
Thermal Design,
board-level,
Boardstation,
Allegro,
Expedition,
FloTHERM PCB,
CR5000,
Design Engineer
Posted Jul 15, 2010, by John Isaac
We have just announced our 22nd annual TLA contest. This is a Mentor program that recognizes PCB design teams for their innovative talents in overcoming today’s most challenging design problems. Last year we had entries from electronics companies, large and small, from 17 countries around the world and announced winners in 6 categories plus an overall. And we had winners from all three design systems: … Read More
Tags:
Expedition,
John Isaac,
Technology Leadership,
TLA,
PADS
Posted Jun 25, 2010, by Mark Forbes
Hi folks
We are currently looking at the value of data sheets. Do you use them? Are they important to have available on the web site? What information is essential to you when checking out products that you may need?
I’d sure appreciate it if you could respond with a comment and take a few seconds to tell me what you think.
Everyone who responds will win a hardy “THANK YOU” from me!
… Read More
Tags:
datasheet,
Expedition,
data sheet,
HyperLynx
Posted Jun 23, 2010, by John Isaac
A few weeks ago we annouced release 9 of the vSure design for manufactuability (DFM) product. Press Release. This product came to us via the Valor acquisition and is used in many competitive design environments as well as Mentor’s Expedition and Board Station. We have an on-demand webinar about it on the web site.
My original thought was that this type of pre-manufacturing NPI product really … Read More
Tags:
Expedition,
Design for Manufacture,
PCB Manufacturing,
John Isaac,
NPI
Posted Jan 6, 2010, by John Isaac
Wow! Have you seen Avatar in 3D? This movie adds a whole new meaning to 3D. And sometimes we forget that the rest of the world is 3D including the product that electronics industry companies design. So why do we sometimes limit our design capabilities to only consider the 2D aspects of the PCB? Certainly the mechanical design MCAD world has gone mostly 3D.
In a viewpoint I wrote for PCD&F … Read More
Tags:
Electronics Industry,
Expedition,
3D,
MCAD,
Mechanical Design,
FloEFD
Posted Sep 2, 2009, by Dave Brady
Coil-Winder: Adding a Simulation Model to the LM317 PCB Component
File Size 11 MBytes
… Read More
Tags:
DxDesigner,
Expedition,
Coil Winder,
Multi-Board Projects,
Wind Turbine,
Functional Simulation,
Mixed Signal Functional Design
Jim Martens
John Day
J VanDomelen
Michael Ford
Robin Bornoff
Dennis Brophy
Mike Jensen
Colin Walls
Tom Fitzpatrick
Max Clark
Mark Laing
Travis Mikjaniec
Christopher Hallinan
Bernard Sutton