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Mentor Blogs

Posts tagged with 'FloTHERM.PACK'

19 Feb, 2010

John Parry Just a very quick post to alert you to the new ElectronicsCooling Magazine web site.  We’ve updated the look of the site to improve navigation ahead of the relaunch of the printed magazine. Here’s just some of the features of the new site: New look and feel Search Improved Article and Content Navigation by author; category (Calculation Corner, New Products, Technical Brief); channel (Industries, … Read More

Thermal Management, Thermal Design, FloEFD, FloTHERM.PCB, Electronics Cooling, Design Process, FloTHERM.PACK, CFD

13 Nov, 2009

John Parry Thermal headroom is a concept I’ve been pushing for a few years, but I guess many people aren’t familiar with it, so I thought some additional commentary would be appropriate. Here goes: What I’ve drawn looks pretty simple. Starting from the ambient we can attribute to total temperature rise for some critical IC to a temperature rise in the air, the PCB and/or heat sink, then the temperature rise in … Read More

Thermal Management, Thermal Headroom, Design Flow, Design Process, CFD, FloTHERM.PACK, Thermal Design, FloEFD

6 Nov, 2009

John Parry Just a quick post to let you know yours truly will be giving a presentation on: Thermal Design: A Key Part of the Electronics Design Flow At the UK Solutions Expo at the Heritage Motor Centre in Gaydon on 12th November. Miniaturization continues to increase power densities at all packaging levels, forcing design teams to identify new methods of cooling. The challenge remains consistent at all levels … Read More

Thermal Design, Shortening Design Time, Thermal Management, Electronics Cooling, Cost Saving, PCB Respin, Reliability, FloTHERM.PACK, FloTHERM.PCB

4 Nov, 2009

John Parry In “What’s black and stuck on a PCB?” I promised I’d get back to writing about FloTHERM.PACK and how it can really help your thermal modelling by helping you build accurate thermal models of chip packages. Assuming you’ve been using FloTHERM or FloTHERM.PCB without FloTHERM.PACK I guess I first need convince you about why you should bother. To help me do that I’d like to introduce you to the concept … Read More

Thermal Model, DELPHI Model, 2-Resistor Model, IC Packaging, Thermal Headroom, FloTHERM.PACK, FloTHERM.PCB

15 Oct, 2009

John Parry I’d expected to be posting about FloTHERM.PACK this time, but I thought I’d better let you know what I’ve been working on the last couple of weeks instead. I’ve been putting together the Mechanical Analysis Division’s presentations for the European Solutions Expos in Finland, The Netherlands, Sweden, and Egypt amongst other places, plus the Alcatel Thales forum in Paris and U2U in Munich. Details of … Read More

Thermal Design, Solutions Expo, Thermal Management, FloTHERM.PACK, Design Process, Saving Cost, Saving Time, FloTHERM.PCB, PCB Respin

8 Oct, 2009

John Parry Hmmm… If you’re guessing it’s a chip package, you’re right – got it in one. Well done! OK, so what type of package is it? If you’re thinking it’s a silly question as you don’t know anything about the package, other than I’ve told you its black - that was a hint that it’s an encapsulated plastic part by the way - you’d be right. You’d need me to tell you if it had leads, and if so on how many sides … Read More

JEDEC, Thermal Guideline, CFD, Chip Package, 2-Resistor Model, Thermal Standard, FloTHERM.PACK, IC Packaging, DELPHI Model, Electronics Cooling

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