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31 Jul, 2009

David's DAC09 - Another Special Guest

Posted by David Abercrombie

Well, day two of DAC started a little earlier than the first day. I had to attend the speakers breakfast for the paper I was going to give later that day. However, after breakfast I had my 9am suite presentation on eqDRC again and I also had a special guest again. This time it was Robert Boone from Freescale in Austin, TX. He works in the DFM team and he also agreed to come tell everyone what he and … Read More

Reliability, IC Verification, Yield, Physical Verification, Design for Manufacturing, DAC, DRC, IC Design, Improvability, Design Rule Checking, Design Rules

Embedded Software

Book review [part 1]
Colin Walls (Posted 5/20/13)
Smart Energy Profile (SEP) 2.0 specification released – What this means to you?
Anil Khanna (Posted 5/15/13)
When an Innovative Plan Works!
Jamie Little (Posted 5/14/13)
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Valor MSS PCB Manufacturing Systems Solutions

Where Is The Manufacturing World Coming To?
Michael Ford (Posted 5/16/13)
Retain your existing investment in assembly programs even if you change your machines
Mark Laing (Posted 5/14/13)
How do you manage your assembly variants?
Mark Laing (Posted 5/8/13)
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Electrical & Wire Harness Design

Estimating wiring harness costs in seconds
John Day (Posted 5/9/13)
A pickup truck with park assist and a lot more
John Day (Posted 5/6/13)
To Infinity and Beyond
J VanDomelen (Posted 4/30/13)
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FPGA

OVM Gets Connected
Dennis Brophy (Posted 9/10/12)
The floating point argument
Colin Walls (Posted 9/10/12)
Open Stand & EDA Standardization
Dennis Brophy (Posted 8/28/12)
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Functional Verification

Part 1: The 2012 Wilson Research Group Functional Verification Study
Harry Foster (Posted 5/8/13)
Those nasty wire’s and reg’s in Verilog
Dave Rich (Posted 5/3/13)
Getting AMP’ed Up on the IEEE Low-Power Standard
Dennis Brophy (Posted 4/29/13)
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IC Design

Battle of Fins and BOXes
Arvind Narayanan (Posted 12/7/12)
TSMC 28nm yield (SemiWiki)
Simon Favre (Posted 3/5/12)
DAC 2011 is upon us!
Simon Favre (Posted 5/11/11)
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Mechanical Analysis

Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow Budgets
Robin Bornoff (Posted 5/15/13)
Why Not Just Shove a Heatsink on Top of it? Part 1
Robin Bornoff (Posted 5/13/13)
Hot Off the Press
Nazita Saye (Posted 5/3/13)
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PCB Design Software & Tools

PADS Tips and Tricks: Building a PCB Decal with Polar Patterns
Jim Martens (Posted 5/13/13)
Interactive Routing in the PADS ES Suite
Jim Martens (Posted 5/9/13)
Schematic Capture in the PADS ES Suite video release
Gary Lameris (Posted 5/3/13)
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System Modeling

EDA vs. Windows 8
Mike Jensen (Posted 5/6/13)
VHDL-AMS Stress Modeling – Part 3
Mike Jensen (Posted 3/25/13)
VHDL-AMS Stress Modeling - Part 2
Mike Jensen (Posted 1/28/13)
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Vehicle System Design

U.S. DOT launches large V2V and V2I test
John Day (Posted 8/23/12)
Did you know this?
John Day (Posted 6/25/12)
Why aren’t tools from different suppliers easier to integrate?
John Day (Posted 6/19/12)
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Aerospace and Military Solutions

To Infinity and Beyond
J VanDomelen (Posted 4/30/13)
Warp Factor 10, Mr. Sulu
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Bombardier Steps Up to the Big Boys
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Accelerating ARM-based Design

Instant Replay for Debugging SoC Level Simulations
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GENIVI development strategy requires competitors to cooperate
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ARM Development Conference
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Automotive Solutions

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If you’re in Europe this summer
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Foundry Solutions

How do you define DFM?
David Abercrombie (Posted 5/19/09)
Are Design Rules Broken?
David Abercrombie (Posted 5/15/09)

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