The JESD51-14 standard was published in November 2010, prepared by the JEDEC JC-15 Committee on Thermal Characterization. It outlines a new process to measure what is the most common IC package thermal metric, Theta_jc. This is the thermal resistance between the die and the package case face. More specifically the face of the package that is to be cooled by an external heatsinking method. Theta_jc … Read More
Well, the Christian world needs to wait a couple of more weeks for Easter to come. But the lent of the semiconductor thermal management community is close to finish - at least after a long period of my silence here - since I am writing a new post again. And the reason is that we are facing a very busy week: for the semiconductor thermal management community the week between 20 and 26 March will be like … Read More
RthJC, reliability testing, SEMI-THERM, Electronics Cooling, AC LED, T3ster, LED thermal testing, LM80 tests, TIM testing, JEDEC, JESD51-14
Jim Martens
Harry Foster
John Day
J VanDomelen
Nazita Saye
Dave Rich
Michael Ford
Dennis Brophy
Mike Jensen
Colin Walls
Tom Fitzpatrick
Mark Laing
Andrew Patterson
Matt Radochonski
Anil Khanna
Kamran Shah
Gary Lameris
Christopher Hallinan
Jamie Little
Brad Dixon
Ricardo Anguiano
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