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Mentor Blogs

Posts tagged with 'mixed vendor'

23 Oct, 2012

Mark Laing Hi there The configuration of SMT lines has changed a number of times over the years. A few years ago lines were configured with a best-in-class requirement, where the line was configured with the chip shooters being supplied from one vendor and the fine pitch machines being from another vendor. In recent years though, may be with the introduction of modular machines and dual line capability, there … Read More

process, programming, BOM, mixed vendor, vPlan, data preparation

15 Aug, 2012

Mark Laing Hi there For the many years I have worked in this industry one of the most common complaints from SMT engineers is related to position and rotation errors that were found during the first article inspection of a PCB during the sticky tape run. The programs would then be tweaked and the sticky tape board ran again to confirm the changes. This resulted in a significant loss of line down time while the … Read More

programming, data preparation, virtual sticky tape, pick and place, vPlan, mixed vendor

7 Aug, 2012

Mark Laing Hi there I have covered a number of areas of process engineering in this blog over the past few months and there is now an opportunity to see how these areas all come together next week in our Webinar titled “World Class Process Preparation”. We will be discussing a number of ways that the users of Valor MSS can streamline their process preparation tasks to make them more efficient and reduce … Read More

Planning, AOI, mixed vendor, BOM, data preparation, documentation, AVL, Flying Probe, bill of materials, ICT, Design For Test, process preparation, vPlan, Webinar, testability, stencil, programming, Sequence

17 Jul, 2012

Mark Laing Hi there One of the least efficient areas in PCB assembly concerns the creation and management of package data that will be consumed across the shop-floor. For example DFM processes rely on accurate package data to determine component to component spacing issues or using accurate pin terminus contact data to ensure that solder joints will form correctly. Accurate package data is critical for DFT analysis … Read More

programming, AOI, bill of materials, mixed vendor, process, data preparation, documentation, Design For Test, Flying Probe, ICT, BOM, VPL, vPlan, stencil, testability

3 Jul, 2012

Mark Laing Hi there One of the largest groups of users within Valor MSS Process Preparation for SMT programming is those supporting ASM, formerly Siemens, pick and place machines. ASM has released their OIB interface as a single API for both programming and monitoring for external applications to use. This has the benefit for third party applications to have an open interface that can be programmed to consistently … Read More

process, programming, data preparation, ASM, SIPLACE, OIB, vPlan, mixed vendor

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