Posted Apr 25, 2012, by John Day
Registration is now open at www.mentor.com/events/iesf/detroit for the 12th IESF Conference for Automotive EE Design – June 14th, 2012 at the Hyatt Regency hotel in Dearborn, MI. Click to sign up if you haven’t already. I missed the last one and don’t want to miss this one – especially since this year I am on the program, speaking about automotive electronics reliability (shameless plug: http://books.sae.org/book-t-126) … Read More
Tags:
LEONI Wiring Systems,
Johnson Controls,
system analysis,
the GENIVI Alliance,
Automotive EE Design,
Hyatt Regency Hotel,
The Hansen Report,
automotive electronics reliability,
IBM Rational,
the Linux Foundation,
wire harness engineering,
IESF Detroit,
'FlexRay,
Infolytica,
CAN,
electronic thermal design and measurement,
Chrysler,
AUTOSAR,
Freescale Semiconductor,
Bishop & Associates,
GENIVI,
Delphi Automotive Systems,
Continental Automotive,
E/E systems design,
SAE International,
LIN,
power and signal design,
NXP Semiconductors,
Open Kernel Labs,
Mentor Graphics,
modeling and simulation,
Linux,
Mecel
Posted Jan 22, 2012, by Robin Bornoff
By far and away the most common enquiry by someone using FloTHERM, especially at the start of their adoption, is “How do I model my components?”. This is hardly surprising as the mainstay of electronics thermal management is the control of operating component temperatures (junction and/or case). A virtual prototyping design by simulation approach requires models of components capable of such predictions. … Read More
Tags:
NXP Semiconductors,
Electronics Cooling
Posted Jan 7, 2012, by John Day
Last month Broadcom said its BroadR-Reach automotive Ethernet portfolio can reduce connectivity costs by up to 80 percent and cabling weight by as much as 30 percent. NXP Semiconductors licensed BroadR-Reach and intends to create automotive-grade products for the Ethernet physical layer.
NXP noted in its announcement that major car manufacturers are designing with Ethernet as a high-bandwidth, low-cost … Read More
Tags:
NXP Semiconductors,
IEEE 802.1 AVB,
Xilinx,
Broadcom,
automotive Ethernet,
EAVB,
FPGA,
BroadR-Reach,
Digital Design Corp.
Posted Nov 5, 2011, by John Day
SAE AS6802 – Time-Triggered Ethernet – is the new industry standard that establishes Ethernet as a deterministic networking technology. It’s available for download at http://standards.sae.org/.
Although the source of the new standard, SAE International’s AS-2 Embedded Computing Systems Committee, is part of SAE International’s Avionic Systems Group, automakers and suppliers are known to … Read More
Tags:
SAE,
Renesas Electronics,
SAE AS6802,
CAN,
'FlexRay,
time-triggered Ethernet,
MOST,
NXP Semiconductors,
deterministic Ethernet,
Freescale Semiconductor
Posted Aug 20, 2011, by John Day
A partial solution usually implies a need for ongoing work until the problem at hand is finally solved, but that’s not the case with CAN (Controller Area Network) partial networking. Despite the name, it’s a major step forward in automotive efficiency, and it’s a lot closer than I realized until this week when NXP introduced a CAN transceiver (TJA1145) and an integrated system basis chip (UJA1168) that … Read More
Tags:
TJA1145 CAN transceiver,
Porsche,
UJA1168 system basis chip,
AUTOSAR R3.2.1,
Audi,
Volkswagen,
ISO 11898-6,
NXP Semiconductors,
CAN partial networking,
Daimler
Posted Feb 17, 2011, by John Day
More evidence that cars are fast becoming computing devices on wheels and that vehicle occupants want the same kind of interactive experience inside the car that they have everywhere else.
This week Renesas announced a new family of automotive systems on chips (R-Car M1) that target navigation and multimedia applications in midrange, as opposed to luxury vehicles. Renesas noted that dashboard-mounted … Read More
Tags:
u-blox,
near field communication,
Telematics,
NXP Semiconductors,
Mobile World Congress,
GPS modules,
Renesas,
Continental AG
Posted Dec 20, 2010, by John Day
This week NXP Semiconductors announced a chip it developed under the code name HERO (highly efficient radio one), an “all-in-one” automotive radio chip based on automotive-qualified RF CMOS technology. Alpine Electronics raves about it.
Torsten Lehmann, NXP’s VP of car entertainment solutions, says chips in the HERO (TEF663x) family are the first automotive RF CMOS devices to combine AM/FM radio and … Read More
Tags:
automotive radio,
RF CMOS,
NXP Semiconductors,
audio codecs,
Alpine Electronics,
automotive infotainment
Posted Aug 2, 2010, by Nazita Saye
I believe in simulation and its effectiveness. I’ve seen how much money it can save. I’m also not the most patient person on the face of the planet. Therefore, I like simulation because it can give fast answers to rather big questions. But sometimes you need more. Sometimes you also need to measure the real world.
This is especially true in the world of semiconductors. You see heat dissipation in … Read More
Tags:
Thermal,
T3ster,
CTM,
JEDEC,
characteristics,
package,
Semiconductor,
measurement hardware,
NXP Semiconductors
Jim Martens
J VanDomelen
Michael Ford
Mike Jensen
Colin Walls
Tom Fitzpatrick
Patrick Carrier
Mark Laing
Travis Mikjaniec
Christopher Hallinan
Bernard Sutton