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Mentor Blogs

Posts tagged with 'package level thermal'

19 Nov, 2010

Robin Bornoff Power on an IC package, measure the resulting transient response of the junction temperature and from that infer a wealth of information about the structure of the package that the heat has to flow through. Such a methodology is at the heart of the Mechanical Analysis Division’s T3Ster(pronounced “trister”) product. Some simulation software vendors pitch their products as being able … Read More

MicReD, Electronics Cooling, package level thermal, T3ster

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