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Posts tagged with 'Parallelism'

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Electromagnetic (EM) Design & Simulation Software

Via modeling - what do I really need?
Patrick Carrier (Posted 11/2/11)
How can we obtain the s-parameters data with non-50 normalization?
Jian Zheng (Posted 2/28/11)
The effects of different bends on performances of wideband digital circuits.
Jian Zheng (Posted 8/26/10)
All Blog Posts

Embedded Software

More on System-C
Colin Walls (Posted 2/6/12)
Q&A
Colin Walls (Posted 1/30/12)
Interview
Colin Walls (Posted 1/25/12)
All Blog Posts

Mentor ESL in TSMC Reference Flow 12
Thomas Bollaert (Posted 6/6/11)
48th DAC - Gary’s Magic Formula
Thomas Bollaert (Posted 6/6/11)
DAC: 9th ESL Symposium
Thomas Bollaert (Posted 5/16/11)
All Blog Posts

Valor MSS PCB Manufacturing Software Solutions

Production Schedules- Guidelines
Jay Gorajia (Posted 12/14/11)
Production Schedules- Alignment
Jay Gorajia (Posted 11/1/11)
Production Schedules- Planning
Jay Gorajia (Posted 10/20/11)
All Blog Posts

Electrical & Wire Harness Design

Who’s the safest of them all?
John Day (Posted 2/8/12)
Capital for Choppers
J VanDomelen (Posted 1/31/12)
New packaging for power electronics
John Day (Posted 1/30/12)
All Blog Posts

Functional Verification

SystemC 2011 Standard Published
Dennis Brophy (Posted 1/16/12)
Verification solutions that help reduce bug cost
Harry Foster (Posted 1/8/12)
Instant Replay for Debugging SoC Level Simulations
Mark Olen (Posted 12/13/11)
All Blog Posts

IC Manufacturing

Our OWL ran down the batteries after only 1 month !
Steve Collis (Posted 1/29/10)
All Blog Posts

DAC 2011 is upon us!
Simon Favre (Posted 5/11/11)
Mentor Graphics User to User (U2U)
John Ferguson (Posted 4/11/11)
Gate Oxide Breakdown Failures Highlight Industry Need for New Electrical Rule Checking Tools
Matthew Hogan (Posted 2/10/11)
All Blog Posts

Mechanical Analysis

Bottlenecks and Interface Materials; Part 3 – Relieving Thermal Bottlenecks Reduce Temperatures
Robin Bornoff (Posted 2/10/12)
Bottlenecks and Interface Materials; Part 2 - When TIMs Go Bad
Robin Bornoff (Posted 1/30/12)
Bridging the Simulation Supply Chain; NXP Semiconductors, a Case in Point
Robin Bornoff (Posted 1/22/12)
All Blog Posts

PCB Design Software & Tools

Fabrication and Assembly Analysis?
Jim Martens (Posted 2/8/12)
Advanced tools mitigates risks with Embedded Passives (EP’s)
Per Viklund (Posted 2/7/12)
Embedded passives never boomed –but saves high performance designs
Per Viklund (Posted 1/30/12)
All Blog Posts

System Modeling

Analog Modeling - Part 3
Mike Jensen (Posted 2/10/12)
Analog Modeling - Part 2
Mike Jensen (Posted 2/2/12)
Analog Modeling - Part 1
Mike Jensen (Posted 1/25/12)
All Blog Posts

Vehicle System Design

IESF 2011 Moves to Frankfurt
Mike Jensen (Posted 9/26/11)
Making automotive electronics reliable
John Day (Posted 9/29/10)
Visteon’s concept car debuts in Paris
John Day (Posted 9/27/10)
All Blog Posts

Aerospace and Military Solutions

Capital for Choppers
J VanDomelen (Posted 1/31/12)
Double duty
J VanDomelen (Posted 1/30/12)
Truly interoperable
J VanDomelen (Posted 1/29/12)

Automotive Solutions

Who’s the safest of them all?
John Day (Posted 2/8/12)
New packaging for power electronics
John Day (Posted 1/30/12)
Autonomous vehicles – so near and yet so far
John Day (Posted 1/27/12)

Low Power Solutions

See ya at the Finish Dad!
Steve Collis (Posted 3/27/10)
Time to Power Diet!
Steve Collis (Posted 2/26/10)
The rest of my family need mobile devices that can charge themselves!
Steve Collis (Posted 2/12/10)

Manufacturing Variability Solutions

How do you define DFM?
David Abercrombie (Posted 5/19/09)
Are Design Rules Broken?
David Abercrombie (Posted 5/15/09)

thogycarol said you definitely love UVM Register Kit Available for OVM 2.1.2
ABCHAC said We agree that shelter is one of the most important... in Keeping the caveman warm - HVAC blog
Bottlenecks and Interface Materials; Part 1 – Great Thermal Bedfellows « Robin Bornoff's blog said [...] To220 detailed model was created using FloTH... in Thermal Design Perfection Starts with the use of FloTHERM PACK
In Capital Deployment – tell me Paul – who’s the worthiest of them all? « Paul Johnston's Blog said [...] Librarians: Without the underpinning of a c... in Latent hero series #514: Getting dewey-eyed about librarians.
Mentor Graphics Capital gives PKC Group the Edge « J. VanDomelen Mil/Aero Blog said [...] geek celebrates the innovation of PKG Group ... in Electronics Renaissance Man
Michael White said Hi Rosario, Good question. As it turns out Calib... in Does SVRF Direct Read Make Sense?
From Megawatts to Milliwatts; sub-micron scale thermal modelling with FloTHERM « Robin Bornoff's blog said [...] an adjunct to a previous blog about the reso... in The Most Extreme CFD Model Ever Ever
Rosario said Mike, I can understand the use of Calibre for ind... in Does SVRF Direct Read Make Sense?
Rosario said Great article Mike. So true, especially now for E... in Stop Paying the DRC Waiver Productivity Tax
lkzazep said 9ojEUZ Part 3: The 2010 Wilson Research Group Functional Verification Study