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Mentor Blogs

Posts tagged with 'stencil'

3 Apr, 2014

Mark Laing Hi there It was a great three days in Las Vegas last week for the IPC Apex Trade Show. We met many new and existing customers at our booth. The attendance seemed to be higher than last year though I don’t know the official numbers. I presented at the PCB Designers Forum on the Monday morning on simplying all those part and package libraries that you need to manage. This was also one of the areas … Read More

IPC Apex, ICT, AOI, apex, testability, vPlan, process, BOM, data preparation, process preparation, stencil, bill of materials

26 Mar, 2013

Mark Laing Hi there As the next installment of the new capability in Valor MSS 11.3, I shall today talk about the improvements we have made in the Stencil Design module of the product. We added a number of new standard apertures to the Stencil Design with this release. These were specifically to address commonly created stencil openings that were previously challenging to create quickly. Now they are automatically … Read More

solder paste, stencil, aperture, vPlan, data preparation, BOM

19 Mar, 2013

Mark Laing Hi there I have heard of a couple of cases of PCB designs where a common pad is shared between two separate components. At it’s simplest case, two 0603 components lie end to end but instead of four pads, two for each, there are only three in total. The two pads closest to each other overlap meaning only one is visible on the board. In other words they share a common pad. This scenario is typically … Read More

packages, aperture, vPlan, programming, ICT, bill of materials, stencil, variant, BOM

21 Feb, 2013

Mark Laing Hi there The Valor team are here in San Diego at the IPC Apex Trade Show. We’ve had a great couple of days, meeting our customers, plenty of new ones as well as meeting with some of the other vendors at the show. Our theater presentations have been well received, bringing people in to the booth and then stopping afterwards, asking questions and looking for more information. If you are at the show … Read More

Enhancement, documentation, programming, Solder Paste Inspection, AOI, Design For Test, SPI, apex, stencil, testability, Automated Optical Inspection, VPL, BOM, Automated X-Ray Inspection, vPlan, boundary scan, approved vendor list, data preparation, AXI, AVL, bill of materials, Flying Probe, Planning, mixed vendor, OIB, IPC, ICT

12 Feb, 2013

Mark Laing Hi there Last week I discussed the new capability in Valor MSS Process Preparation 11.3. I mentioned that I would go in to more detail on some of the areas that are part of this version and I will start with our new capability for inspection machines. There are three main types of automated inspection machines, Automated Optical Inspection (AOI), Automated X-Ray Inspection (AXI) and Solder Paste Inspection … Read More

data preparation, AOI, aperture, Solder Paste Inspection, SPI, stencil, Automated X-Ray Inspection, AXI, process, Automated Optical Inspection

4 Feb, 2013

Mark Laing Hi there We have just released a new version of Valor MSS (11.3) that brings a number of significant enhancements to existing customers as well as those looking to invest in cutting edge process preparation solutions. I’ll be covering some of these enhancements in more detail in future blogs but here is a short summary of some of the new capability that we have in 11.3. We have made significant … Read More

OIB, mixed vendor, vPlan, AOI, Flying Probe, ICT, BOM, AVL, documentation, bill of materials, Enhancement, Design For Test, data preparation, VPL, testability, stencil, programming, Planning, process

29 Jan, 2013

Mark Laing Hi there Next month on February 19th, 20th and 21st is the annual IPC Apex Convention in San Diego and there will be more than 400 exhibitors from 50 different countries represented at the show. Here are five reasons you should attend: 1. The Valor Division of Mentor Graphics will be exhibiting at booth 1227. So, you will be able to meet the U.S. sales team as well as some of the Product Line personnel … Read More

mixed vendor, AOI, Flying Probe, apex, ICT, IPC, bill of materials, BOM, approved vendor list, documentation, data preparation, Design For Test, vPlan, stencil, Sequence, programming, san diego, process

22 Jan, 2013

Mark Laing Hi there A few months back I talked about in-line AOI but this time I’ll mention a similar capability we have in the Valor MSS Process Preparation suite of in-line Solder Paste Inspection or SPI. The idea with in-line AOI and SPI is for the outputs to the different inspection machines to understand where components are being placed in the line and to create output that matches the placement. In … Read More

vPlan, bill of materials, AOI, programming, data preparation, BOM, SPI, stencil

18 Dec, 2012

Mark Laing Hi there I have talked about the Valor MSS unique capability to use the Valor Parts Library or VPL in multiple ways during PCB manufacturing. VPL data is manufacturer specific information about the actual component body and pin areas that can be used for multiple uses across DFM, Stencil, Documentation, SMT programming, test programming and inspection programming. I’d like to focus the specifics … Read More

Sequence, programming, AVL, mixed vendor, bill of materials, process, documentation, data preparation, Flying Probe, Design For Test, BOM, vPlan, stencil, VPL

20 Nov, 2012

Mark Laing Hi there It has been a few months since we launched the World Class Process Preparation Webinar including a video of an overall product demonstration. Over the past couple of months I have met with a number of people who implemented the Valor MSS Process Preparation solution and are achieving the efficiencies and improvements that we describe in the Webinar. Therefore I would like to provide you with … Read More

mixed vendor, AOI, Flying Probe, ICT, BOM, boundary scan, AVL, bill of materials, documentation, data preparation, Design For Test, vPlan, Planning, testability, VPL, stencil, programming, process

6 Nov, 2012

Mark Laing Hi there I have been posting comments on my blog now for a number of months. The topics have been based on the feedback and conversations I’ve had with many users of Process Engineering software, both Mentor Graphics and non-Mentor Graphics products, all around the world. Many of you have also taken the time to add comments on these postings which I really appreciate. I’d like to open up … Read More

mixed vendor, AOI, Flying Probe, ICT, BOM, boundary scan, AVL, bill of materials, documentation, data preparation, Design For Test, Planning, testability, vPlan, stencil, programming, process

31 Oct, 2012

Mark Laing Hi there We released our Valor MSS Stencil Design module a few months ago and have received positive feedback which resulted in a number of major enhancements that will be part of our up-coming release. However, a topic that I have discussed with a number of our users involves the use of a stepped stencil. Standard stencils have a single thickness across them meaning that paste volume can only be controlled … Read More

stencil, programming, vPlan, data preparation

2 Oct, 2012

Mark Laing Hi there I spent last week in the wonderful town of Zug about 45 minutes from Zurich in Switzerland. My European colleagues organized a two day seminar for over 60 of our Valor MSS Process Preparation customers at the Siemens facility in Zug. The agenda consisted of some Valor presentations, Valor demostrations of the upcoming software, presentations by actual users of the Process Preparation software … Read More

programming, AVL, process, AOI, data preparation, documentation, Flying Probe, bill of materials, ICT, BOM, Design For Test, vPlan, testability, VPL, stencil

7 Aug, 2012

Mark Laing Hi there I have covered a number of areas of process engineering in this blog over the past few months and there is now an opportunity to see how these areas all come together next week in our Webinar titled “World Class Process Preparation”. We will be discussing a number of ways that the users of Valor MSS can streamline their process preparation tasks to make them more efficient and reduce … Read More

Planning, AOI, mixed vendor, BOM, data preparation, documentation, AVL, Flying Probe, bill of materials, ICT, Design For Test, process preparation, vPlan, Webinar, testability, stencil, programming, Sequence

17 Jul, 2012

Mark Laing Hi there One of the least efficient areas in PCB assembly concerns the creation and management of package data that will be consumed across the shop-floor. For example DFM processes rely on accurate package data to determine component to component spacing issues or using accurate pin terminus contact data to ensure that solder joints will form correctly. Accurate package data is critical for DFT analysis … Read More

programming, AOI, bill of materials, mixed vendor, process, data preparation, documentation, Design For Test, Flying Probe, ICT, BOM, VPL, vPlan, stencil, testability

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