Posted Feb 14, 2012, by Nazita Saye
Back in December I heard something on the radio that made me both sad and happy at the same time. It turns out that the last neon sign in Piccadilly Square in London was to be turned off by the end of the year. For those of you who haven’t had the pleasure of seeing London at night, Piccadilly Sq is a sight to behold (for a picture click here ) The neon sign in question had been in use since 1987 and … Read More
Tags:
FloEFD,
CFD,
Thermal Characterization,
T3ster
Posted Jan 30, 2012, by Robin Bornoff
‘Bits stuck onto other bits’, a succinct definition of an electronic product, if not a product that contains electronics. Soldering is the method of choice for getting the components to attach to the pcb, the layered board that contains the metallic traces connecting component pins to other component pins. Rivets, welds, screws or bolts for the chassis, some form of gluing or sticky adhesion … Read More
Tags:
Electronics Cooling,
CFD,
thermal chokepoint,
T3ster,
thermal bottleneck
Posted Jan 3, 2012, by Robin Bornoff
LED based lighting is now a very hot topic (believe me, in electronic thermal management circles that used to be funny, the first few times). Control of packaged IC junction temperatures will always have a bearing on reliability but for LEDs thermal also effects functional performance in terms of brightness and colour. The hotter they get, the dimmer they appear. A particular contradiction in the context … Read More
Tags:
LED,
Electronics Cooling,
TERALED,
LEDs,
T3ster
Posted Dec 15, 2011, by John Day
Hardware and software tools that help engineers deal effectively with temperature and heat transfer offer significant value, since increased design complexity and smaller form factors create heat management problems that represent one of the biggest challenges in electronics today.
Temperature is understood to be the key accelerator in the majority of reliability failures and IEEE Standard 1413 (for … Read More
Tags:
Heat Transfer,
IEEE Standard 1413,
FloTHERM software,
thermal simulation and analysis,
thermal transient tester,
Mentor Graphics,
T3ster
Posted Oct 20, 2011, by Robin Bornoff
‘Rubbish In -> Rubbish Out’ is a well accepted fact in the world of simulation. Regardless of the technical capabilities of your thermal simulation tool, the accuracy of prediction will always be tightly coupled to the accuracy of the input data. The most accurate thermal IC package model is a so called ‘detailed’ model where all the internal construction is represented explicitly … Read More
Tags:
Electronics Cooling,
detailed thermal IC package models,
T3ster,
FloTHERM PACK,
strucutre functions
Posted Oct 14, 2011, by Nazita Saye
For the past few months I’ve been talking about our user meetings – the Mechanical Analysis Division User2User meetings which are taking place all over the world.
The venue was built at the site of an old castle.
I just came back from the meeting in Germany and I can quite honestly say that it was one of the most energizing meetings I’ve attended in a long time. This was a meeting of “firsts”: the … Read More
Tags:
Mechanical U2U,
FloEFD,
T3ster
Posted Mar 18, 2011, by Robin Bornoff
One of the highlights of the electronics thermal management calender is the annual SEMI-THERM symposium held in sunny San Jose, California and it’s with the usual sense of excitement that I’m preparing to attend it. The acquisition of Flomerics by Mentor Graphics was two and half years ago and, despite the expectations of many, the activities and success of the ‘Mechanical Analysis … Read More
Tags:
Semitherm,
Electronics Cooling,
T3ster
Posted Mar 14, 2011, by Andras Poppe
Well, the Christian world needs to wait a couple of more weeks for Easter to come. But the lent of the semiconductor thermal management community is close to finish - at least after a long period of my silence here - since I am writing a new post again. And the reason is that we are facing a very busy week: for the semiconductor thermal management community the week between 20 and 26 March will be like … Read More
Tags:
RthJC,
reliability testing,
SEMI-THERM,
Electronics Cooling,
AC LED,
T3ster,
LED thermal testing,
LM80 tests,
TIM testing,
JEDEC,
JESD51-14
Posted Dec 21, 2010, by Andras Poppe
I have always admired the medical diagnostic tools, especially imaging. X-rays have a long history, starting with Conrad Röntgen back in the 19th century. In fact in Hungary x-raying is called “röntgening” - yes, like this; the phrase became part of our language as an ordinary word; both as a verb (to take somebody’s x-ray image) or as an adjective to specifically name this very high … Read More
Tags:
non-destructive analysis,
structural analysis,
die attach void,
thermal transient testing,
structure function,
T3ster
Posted Dec 5, 2010, by Andras Poppe
Today is the 2nd Sunday of Advent. I am preparing for Christmas. Since my childhood I have been really fond of Christmas-trees and candles on the tree. But my father has always been afraid of fire, therefore candles were lit only when my parents were present. It changed with the strings of bulbs. They introduced a new game: when decorating the tree, one had to test the string since the low voltage … Read More
Tags:
LED reliability,
FloEFD,
T3ster,
LED testing,
LM80 tests