Sign In
Forgot Password?
Sign In | | Create Account

Mentor Blogs

Posts tagged with 'T3ster'

25 Nov, 2010

Andras Poppe I guess, many people who had to find the metric  known as “theta-JC”  have asked themselves the question great many times: how to measure junction-to-case thermal resistance quickly and accurately?  So did my colleagues at MicReD back in 2004/2005 when they had to do contract measurement of over 80 power transistor packages. The usual answer is: read the relevant standard - such as MIL-883 or … Read More

thetaJC, thermal transient testing, Electronics Cooling, JEDEC, dual interface method, RthJC, T3ster, JESD51, junction-to-case thermal resistance

24 Nov, 2010

Nazita Saye It seems that my previous post resonated deeply with everyone – I received a lot of offline comments and my post inspired two of my colleagues (Boris and Andras) to do their own blog posts. This doesn’t shock me because Thanksgiving week is one of the busiest travel periods in the States so everyone is thinking about flying. So I thought we should stay with the subject for one more day and look at it … Read More

T3ster, Thermal, FloEFD, CFD, LED, QA, FloVENT, hybrid engine

19 Nov, 2010

Robin Bornoff Power on an IC package, measure the resulting transient response of the junction temperature and from that infer a wealth of information about the structure of the package that the heat has to flow through. Such a methodology is at the heart of the Mechanical Analysis Division’s T3Ster(pronounced “trister”) product. Some simulation software vendors pitch their products as being able … Read More

MicReD, Electronics Cooling, package level thermal, T3ster

2 Aug, 2010

Nazita Saye I believe in simulation and its effectiveness. I’ve seen how much money it can save. I’m also not the most patient person on the face of the planet. Therefore, I like simulation because it can give fast answers to rather big questions. But sometimes you need more.  Sometimes you also need to measure the real world. This is especially true in the world of semiconductors. You see heat dissipation in … Read More

Thermal, T3ster, CTM, JEDEC, characteristics, package, Semiconductor, measurement hardware, NXP Semiconductors

4 Jan, 2010

Robin Bornoff This series, despite being somewhat lengthy, is by no means a complete overview of the various methods, options and approaches to predicting component temperatures. Here is some stuff I didn’t cover… My bias in this series is towards the prediction of component temperature via simulation using a 3D CFD approach adopted in our (as ever) market leading FloTHERM and FloTHERM.PCB products. 3D CFD is not … Read More

Electronics Cooling, Component, T3ster, Network, Psi

Valor MSS PCB Manufacturing Systems Solutions

Electrical & Wire Harness Design

Functional Verification

IC Manufacturing

IC Design

Mechanical Analysis

Silicon Test and Yield Analysis

System Modeling

Vehicle System Design

3D-IC Design and Test Solutions

Aerospace and Military Solutions

Accelerating ARM-based Design

Automotive Solutions

Foundry Solutions

Recent Comments