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Mentor Blogs

Posts tagged with 'testability'

3 Apr, 2014

Mark Laing Hi there It was a great three days in Las Vegas last week for the IPC Apex Trade Show. We met many new and existing customers at our booth. The attendance seemed to be higher than last year though I don’t know the official numbers. I presented at the PCB Designers Forum on the Monday morning on simplying all those part and package libraries that you need to manage. This was also one of the areas … Read More

IPC Apex, ICT, AOI, apex, testability, vPlan, process, BOM, data preparation, process preparation, stencil, bill of materials

18 Dec, 2013

Mark Laing Hi there We have just posted 12.0 Update 1 to SupportNet for those users who have already downloaded and installed 12.0 which came out a few weeks ago. This update includes the first release for the IPC 2581 Revision A format as a CAM reader in Process Preparation. Although not common, we have had some requests to support this format so we have released this now as part of the Process Preparation suite. For … Read More

programming, process, data preparation, Design For Test, spea, IPC 2581, testability, vPlan, ICT

11 Jun, 2013

Mark Laing Hi there Boundary Scan has been available for well over 15 years now and it has continued to evolve over that time as the initial IEEE standard 1149 has been updated to cover more than just digital devices. Although for most printed circuit designs full testing through 4 or 5 connections is not possible a significant number of designs have some number of components on them that support the Boundary … Read More

ICT, Flying Probe, testability, vPlan, boundary scan, process, Design For Test, programming, data preparation

5 Mar, 2013

Mark Laing Hi there We recently had a successful trade show at Apex 2013 in San Diego. During the event I was interviewed with iConnect PCB007′s Andy Shaughnessy. We discussed the main themes that we were promoting on the booth in the area of Process Preparation, namely being able to use a single solution for all areas of PCB manufacturing data preparation as well as simplying the many types of part library … Read More

IPC, vPlan, AOI, documentation, Flying Probe, ICT, AVL, data preparation, AXI, Design For Test, Automated Optical Inspection, Automated X-Ray Inspection, BOM, bill of materials, testability, SPI, Solder Paste Inspection, programming, process

26 Feb, 2013

Mark Laing Hi there I recently discussed the new capability in Valor MSS Process Preparation 11.3. I mentioned that I would go in to more detail on some of the areas that are part of this version and I will cover the new Test Probe Placement capability today. We have added an all new Test Probe Placement Session in 11.3 that performs the physical test probe placement analysis natively within the application. This … Read More

AOI, Flying Probe, ICT, AXI, data preparation, bill of materials, Design For Test, Automated Optical Inspection, Automated X-Ray Inspection, boundary scan, BOM, process, vPlan, testability, VPL

21 Feb, 2013

Mark Laing Hi there The Valor team are here in San Diego at the IPC Apex Trade Show. We’ve had a great couple of days, meeting our customers, plenty of new ones as well as meeting with some of the other vendors at the show. Our theater presentations have been well received, bringing people in to the booth and then stopping afterwards, asking questions and looking for more information. If you are at the show … Read More

Enhancement, documentation, programming, Solder Paste Inspection, AOI, Design For Test, SPI, apex, stencil, testability, Automated Optical Inspection, VPL, BOM, Automated X-Ray Inspection, vPlan, boundary scan, approved vendor list, data preparation, AXI, AVL, bill of materials, Flying Probe, Planning, mixed vendor, OIB, IPC, ICT

4 Feb, 2013

Mark Laing Hi there We have just released a new version of Valor MSS (11.3) that brings a number of significant enhancements to existing customers as well as those looking to invest in cutting edge process preparation solutions. I’ll be covering some of these enhancements in more detail in future blogs but here is a short summary of some of the new capability that we have in 11.3. We have made significant … Read More

OIB, mixed vendor, vPlan, AOI, Flying Probe, ICT, BOM, AVL, documentation, bill of materials, Enhancement, Design For Test, data preparation, VPL, testability, stencil, programming, Planning, process

27 Nov, 2012

Mark Laing Hi there I have talked to a number of users who are asking for capability to manage the Process Preparation needs of multiple locations around the world. I would like to hear from you on what requirements you consider important to this discussion. For example we have some customers running a single database across multiple locations allowing them to share data across all their facilities. One downside … Read More

programming, ICT, AVL, multi-site, data preparation, documentation, bill of materials, Flying Probe, BOM, Design For Test, database, server, testability, vPlan

20 Nov, 2012

Mark Laing Hi there It has been a few months since we launched the World Class Process Preparation Webinar including a video of an overall product demonstration. Over the past couple of months I have met with a number of people who implemented the Valor MSS Process Preparation solution and are achieving the efficiencies and improvements that we describe in the Webinar. Therefore I would like to provide you with … Read More

mixed vendor, AOI, Flying Probe, ICT, BOM, boundary scan, AVL, bill of materials, documentation, data preparation, Design For Test, vPlan, Planning, testability, VPL, stencil, programming, process

6 Nov, 2012

Mark Laing Hi there I have been posting comments on my blog now for a number of months. The topics have been based on the feedback and conversations I’ve had with many users of Process Engineering software, both Mentor Graphics and non-Mentor Graphics products, all around the world. Many of you have also taken the time to add comments on these postings which I really appreciate. I’d like to open up … Read More

mixed vendor, AOI, Flying Probe, ICT, BOM, boundary scan, AVL, bill of materials, documentation, data preparation, Design For Test, Planning, testability, vPlan, stencil, programming, process

2 Oct, 2012

Mark Laing Hi there I spent last week in the wonderful town of Zug about 45 minutes from Zurich in Switzerland. My European colleagues organized a two day seminar for over 60 of our Valor MSS Process Preparation customers at the Siemens facility in Zug. The agenda consisted of some Valor presentations, Valor demostrations of the upcoming software, presentations by actual users of the Process Preparation software … Read More

programming, AVL, process, AOI, data preparation, documentation, Flying Probe, bill of materials, ICT, BOM, Design For Test, vPlan, testability, VPL, stencil

18 Sep, 2012

Mark Laing Hi there As a follow up to my posting last week on measuring test coverage, which you can read from the following link: http://www.mentor.com/pcb-manufacturing-assembly/blog/post/how-do-you-measure-test-coverage–77cbb106-851f-4f26-a548-4857098f23d4 I would like to hear from test and process engineers on what types of equipment form part of your test and inspection strategy. How do In-Circuit test … Read More

Design For Test, Flying Probe, AOI, testability, vPlan, ICT, data preparation, BOM, programming, boundary scan

7 Aug, 2012

Mark Laing Hi there I have covered a number of areas of process engineering in this blog over the past few months and there is now an opportunity to see how these areas all come together next week in our Webinar titled “World Class Process Preparation”. We will be discussing a number of ways that the users of Valor MSS can streamline their process preparation tasks to make them more efficient and reduce … Read More

Planning, AOI, mixed vendor, BOM, data preparation, documentation, AVL, Flying Probe, bill of materials, ICT, Design For Test, process preparation, vPlan, Webinar, testability, stencil, programming, Sequence

17 Jul, 2012

Mark Laing Hi there One of the least efficient areas in PCB assembly concerns the creation and management of package data that will be consumed across the shop-floor. For example DFM processes rely on accurate package data to determine component to component spacing issues or using accurate pin terminus contact data to ensure that solder joints will form correctly. Accurate package data is critical for DFT analysis … Read More

programming, AOI, bill of materials, mixed vendor, process, data preparation, documentation, Design For Test, Flying Probe, ICT, BOM, VPL, vPlan, stencil, testability

10 Jul, 2012

Mark Laing Hi there Within the Valor MSS Process Preparation suite, we have the best DFA capability that exists in the market. There are a number of checks that are performed that are necessary for PCB assemblers to execute prior to starting a design in production. Being able to know if fiducials on the board are near similar pads or vias is important to ensure that placement and inspection equipment don’t … Read More

Flying Probe, bill of materials, testability, vPlan, ICT, Design For Test, BOM, data preparation

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