Posted Feb 9, 2010, by John Parry
I was on a conference call and WebEx yesterday with the NAFEMS CFD Working Group, of which Mentor Graphics is a member. One of the people on the call had a lot of background noise on his phone, which turned out to be a due to a fan by his desk to keep his computer cool.
Computational Fluid Dynamics (CFD) is a memory hungry, CPU intensive activity so I guess he was running a fairly substantial case. … Read More
Tags:
Thermal Management,
Thermal Design,
Upfront Analysis,
Concurrent CFD,
Design Process,
CFD,
Upfront CFD,
Kolb's Learning Styles,
X-ray Vision,
Electronics Cooling,
Experiential Learning
Posted Feb 8, 2010, by John Wilson
I got my eyes checked on Friday and I walked out of there over $400 lighter in the wallet, and I’m covered under two vision insurance policies. What did I get?
An eye exam for contact lenses
Some sample cleaner solution
A commitment for them to buy 6 months worth of contacts once we determine the pair they prescribed are fitted correctly.
$350 worth of contact “fitting”.
That last one is … Read More
Tags:
Thermal Design,
Multifocal
Posted Feb 3, 2010, by John Parry
I’m off to SEMI-THERM later this month. SEMI-THERM is one of the premier thermal management conferences and has the best exhibition by far.
The conference runs from 21-25 February, the first two days of which are devoted to professional short courses delivered by a number of leading names in electronics cooling, and past recipients of the IEEE’s THERMI Award. Short courses at SEMI-THERM 26 are eligible … Read More
Tags:
Thermal Standards,
JEDEC JC15,
Electronics Cooling,
Thermal Design,
Thermal Management,
SEMI-THERM Conference,
SEMI-THERM Exhibition
Posted Dec 15, 2009, by John Parry
Mentor’s Thermal Design Software Is The Best. OK, say’s who?
It’s the conclusion from some independent research carried out by Aberdeen Research Group. Last time I showed that Aberdeen had found that Mentor’s customers are almost 3 times faster at completing thermal verification than users of other tools. Let’s take a look at why that is.
Aberdeen found evidence of what users of other tools were doing … Read More
Tags:
Thermal Management,
Thermal Design,
Design Flow,
Design Process,
CFD,
FloTHERM.PCB,
PCB Respin,
Electronics Cooling
Posted Dec 12, 2009, by John Wilson
When a person describes their ideal design software, or any software for that matter, Ease-of-Use is always on the list of desirable attributes. It makes sense that in order to be productive with the software in the shortest amount of time the software must be easy to use. All of the CAD and CFD tools I work with strive to achieve this goal (except for one which I won’t name and it isn’t one of our … Read More
Tags:
Data Center,
Ease of Use,
CFD,
Thermal Design,
Electronics Cooling
Posted Dec 9, 2009, by John Parry
It could save your company a shed load of time and money…
Interested?
OK, here’s some research by Aberdeen Group, which I presented at several of the recent Solutions Expos. First off, the Mechanical Analysis Division’s customers choose Mentor’s tools because they recognise them as being the best. They don’t just make do with tools available as part of another software suite, as shown below in the … Read More
Tags:
Thermal Management,
Concurrent CFD,
Cost Saving,
CFD,
Fluent Design,
Thermal Design,
Design Process,
Electronics Cooling
Posted Dec 4, 2009, by John Parry
While I was waiting for the last few people for my presentation ‘Thermal Design: A Key Part of the Electronics Design Flow’ at the UK Solutions Expo at the Heritage Motor Center in Gaydon a couple of weeks back I thought I’d poll the audience with a couple of questions. It’s rare that I get to speak to an audience of electronics engineers, so I was interested to see how they view thermal design.
First … Read More
Tags:
Upfront Analysis,
Thermal Design,
Design Collaboration,
Design Process,
Concurrent CFD,
FloTHERM.PCB,
Fluent Design,
FloEFD
Posted Nov 13, 2009, by John Parry
Thermal headroom is a concept I’ve been pushing for a few years, but I guess many people aren’t familiar with it, so I thought some additional commentary would be appropriate. Here goes:
What I’ve drawn looks pretty simple. Starting from the ambient we can attribute to total temperature rise for some critical IC to a temperature rise in the air, the PCB and/or heat sink, then the temperature rise in … Read More
Tags:
Thermal Management,
Thermal Headroom,
Design Flow,
Design Process,
CFD,
FloTHERM.PACK,
Thermal Design,
FloEFD
Posted Nov 6, 2009, by John Parry
Just a quick post to let you know yours truly will be giving a presentation on:
Thermal Design: A Key Part of the Electronics Design Flow
At the UK Solutions Expo at the Heritage Motor Centre in Gaydon on 12th November.
Miniaturization continues to increase power densities at all packaging levels, forcing design teams to identify new methods of cooling. The challenge remains consistent at all levels … Read More
Tags:
Thermal Design,
Shortening Design Time,
Thermal Management,
Electronics Cooling,
Cost Saving,
PCB Respin,
Reliability,
FloTHERM.PACK,
FloTHERM.PCB
Posted Oct 15, 2009, by John Parry
I’d expected to be posting about FloTHERM.PACK this time, but I thought I’d better let you know what I’ve been working on the last couple of weeks instead. I’ve been putting together the Mechanical Analysis Division’s presentations for the European Solutions Expos in Finland, The Netherlands, Sweden, and Egypt amongst other places, plus the Alcatel Thales forum in Paris and U2U in Munich. Details of … Read More
Tags:
Thermal Design,
Solutions Expo,
Thermal Management,
FloTHERM.PACK,
Design Process,
Saving Cost,
Saving Time,
FloTHERM.PCB,
PCB Respin
Jim Martens
John Day
J VanDomelen
Nazita Saye
Michael Ford
Robin Bornoff
Mike Jensen
Colin Walls
Tom Fitzpatrick
Patrick Carrier
Mark Laing
Zhen Mu
Travis Mikjaniec
Christopher Hallinan
Bernard Sutton