Posted Mar 4, 2010, by Robin Bornoff
Electronics cooling involves ensuring that IC package temperatures do not exceed maximum rated values. If they do the probability of thermo-mechanical related failure increases dramatically. The accuracy of any electronics thermal simulation will be determined by how well the IC package is represented in the solution. These are simple and evident truths. As the leading supplier of electronic thermal … Read More
Tags:
FloTHERM IC,
IC Package,
Electronics Cooling,
Thermal Resistance
Posted Oct 12, 2009, by Robin Bornoff
Lumped block package representation makes the best use of limited available data to simulate for an ‘indication’ of case temperature. Some indication is better than none but I wouldn’t bet on it, really, I wouldn’t. Accurate case and junction temperature prediction can only be realised with either a fully 3D detailed representation or an abstracted CTM (compact thermal model) representation. Here we’ll … Read More
Tags:
Thermal Resistor,
CTM,
Electronics Cooling,
Component,
SPICE,
Thermal Resistance,
FloTHERM,
IBIS
Posted Aug 19, 2009, by Robin Bornoff
Talk to a mathematician about thermodynamics and heat transfer and before long they’ll be showing you lots of weird symbols in a rather condensed vector notation. Talk to a physicist and such concepts of electron spin states will lead the discussion. Talk to a mechanical engineer and likely analogies will be used that take a well known system or process and apply that to the concept of heat flow. … Read More
Tags:
FloTHERM,
Power Dissipation,
Electronics Cooling,
Thermal Resistance
Jim Martens
Harry Foster
John Day
J VanDomelen
Paul Johnston
Dennis Brophy
Mike Jensen
Colin Walls
Travis Mikjaniec
Per Viklund