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Mechanical Analysis
25 Jan, 2013

Experiment vs. Simulation, Part 2: TIM Thermal Conductivity

Posted by Robin Bornoff

Robin Bornoff The temperature rise that electronic components attain in operation is due to 3 things. The power that they dissipate, the ambient temperature surrounding the product and the various thermal bottlenecks that the heat passes through on its journey from the source to the ambient. An accurate simulation requires all 3 aspects to be modelled correctly. In terms of the bottlenecks, conductive resistance … Read More

Electronics Cooling, DynTIM, thermal conductivity, TIM

Mechanical Analysis
18 Jan, 2012

Bottlenecks and Interface Materials; Part 1 - Great Thermal Bedfellows

Posted by Robin Bornoff

Robin Bornoff Probably due to the beer fridge, I now seem to be becoming the repository of broken electronic products with an expectation that the cause of their demise can be identified, retrospectively, using thermal simulation. This week my good colleague John Parry dumped a rather poorly DVD player on my desk with a ‘go on then’ look. There’s nothing quite like the sight of a scorched PCB to … Read More

bottleneck, Electronics Cooling, beer, thermal interface material, TIM, thermal bottleneck

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