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Posts tagged with 'Validation'

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24 Feb, 2010

Semiconductor Package Thermal Characterization and Design as Easy as 1-2-3

Posted by Nazita Saye

If you are involved with semiconductor packaging design, then have I got news for you. We just announced the availability of FloTHERM IC – a web-based tool that delivers a high level of automation to design tasks associated with full-spectrum thermal characterization and validation. From what I understand, a typical semiconductor thermal team spends about 60% of their time on standard package thermal … Read More

Semiconductor, ROI, Smart Parts, CFD, BGA Substrates, Thermal Characterization, JEDEC, Package Design, Validation, FloTHERM IC, FloTHERM PACK

Electrical & Wire Harness Design

16 Dec, 2009

Wants vs. Needs

Posted by Michael Stamper

The line between something we WANT vs. something we NEED is often a blurry one. With regards to electrical design software it is very important to understand the difference in order to prioritize requests for features. I have the pleasure of working with many customers across different industries. In all of my travels I have met smart, dedicated people doing the best they can for their company. … Read More

Data Accuracy, Model, Capital Harness Systems, Validation

Embedded Software

Smart Energy Profile (SEP) 2.0 specification released – What this means to you?
Anil Khanna (Posted 5/15/13)
When an Innovative Plan Works!
Jamie Little (Posted 5/14/13)
Embedded education
Colin Walls (Posted 5/13/13)
All Blog Posts

Valor MSS PCB Manufacturing Systems Solutions

Where Is The Manufacturing World Coming To?
Michael Ford (Posted 5/16/13)
Retain your existing investment in assembly programs even if you change your machines
Mark Laing (Posted 5/14/13)
How do you manage your assembly variants?
Mark Laing (Posted 5/8/13)
All Blog Posts

Electrical & Wire Harness Design

Estimating wiring harness costs in seconds
John Day (Posted 5/9/13)
A pickup truck with park assist and a lot more
John Day (Posted 5/6/13)
To Infinity and Beyond
J VanDomelen (Posted 4/30/13)
All Blog Posts

FPGA

OVM Gets Connected
Dennis Brophy (Posted 9/10/12)
The floating point argument
Colin Walls (Posted 9/10/12)
Open Stand & EDA Standardization
Dennis Brophy (Posted 8/28/12)
All Blog Posts

Functional Verification

Part 1: The 2012 Wilson Research Group Functional Verification Study
Harry Foster (Posted 5/8/13)
Those nasty wire’s and reg’s in Verilog
Dave Rich (Posted 5/3/13)
Getting AMP’ed Up on the IEEE Low-Power Standard
Dennis Brophy (Posted 4/29/13)
All Blog Posts

IC Design

Battle of Fins and BOXes
Arvind Narayanan (Posted 12/7/12)
TSMC 28nm yield (SemiWiki)
Simon Favre (Posted 3/5/12)
DAC 2011 is upon us!
Simon Favre (Posted 5/11/11)
All Blog Posts

Mechanical Analysis

Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow Budgets
Robin Bornoff (Posted 5/15/13)
Why Not Just Shove a Heatsink on Top of it? Part 1
Robin Bornoff (Posted 5/13/13)
Hot Off the Press
Nazita Saye (Posted 5/3/13)
All Blog Posts

PCB Design Software & Tools

PADS Tips and Tricks: Building a PCB Decal with Polar Patterns
Jim Martens (Posted 5/13/13)
Interactive Routing in the PADS ES Suite
Jim Martens (Posted 5/9/13)
Schematic Capture in the PADS ES Suite video release
Gary Lameris (Posted 5/3/13)
All Blog Posts

System Modeling

EDA vs. Windows 8
Mike Jensen (Posted 5/6/13)
VHDL-AMS Stress Modeling – Part 3
Mike Jensen (Posted 3/25/13)
VHDL-AMS Stress Modeling - Part 2
Mike Jensen (Posted 1/28/13)
All Blog Posts

Vehicle System Design

U.S. DOT launches large V2V and V2I test
John Day (Posted 8/23/12)
Did you know this?
John Day (Posted 6/25/12)
Why aren’t tools from different suppliers easier to integrate?
John Day (Posted 6/19/12)
All Blog Posts

Aerospace and Military Solutions

To Infinity and Beyond
J VanDomelen (Posted 4/30/13)
Warp Factor 10, Mr. Sulu
J VanDomelen (Posted 4/25/13)
Bombardier Steps Up to the Big Boys
J VanDomelen (Posted 4/20/13)

Accelerating ARM-based Design

Instant Replay for Debugging SoC Level Simulations
Mark Olen (Posted 12/13/11)
GENIVI development strategy requires competitors to cooperate
John Day (Posted 11/10/11)
ARM Development Conference
Colin Walls (Posted 7/4/11)

Automotive Solutions

Estimating wiring harness costs in seconds
John Day (Posted 5/9/13)
A pickup truck with park assist and a lot more
John Day (Posted 5/6/13)
If you’re in Europe this summer
John Day (Posted 4/29/13)

Foundry Solutions

How do you define DFM?
David Abercrombie (Posted 5/19/09)
Are Design Rules Broken?
David Abercrombie (Posted 5/15/09)

Dave Rich said I know a few companies that have gone to the troub... in SystemVerilog Coding Guidelines
Linc Jepson said Dave, It's almost 4 years after this post. As fa... in SystemVerilog Coding Guidelines
simmons10 vigorda said What to Look for in a Hard Drive That You Are Purc... in Shortening Design Cycles With Concurrent Engineering
HMR said I am a bit worried some publications I have recent... in A Load of HVAC TLAs
Byron Blackmore said A project XML file will have a element, and an as... in FloTHERM and its new XML neutral file format
max lai said Heated Block Example Steel (Mild) 6.3000... in FloTHERM and its new XML neutral file format
max lai said Can "xml_case" tag makes it a project XML? becaus... in FloTHERM and its new XML neutral file format
max lai said Can tag makes it a project XML? because it seems ... in FloTHERM and its new XML neutral file format
Ramesh Sedam said Am very new to UVM and stuck with this error.. ple... in Using the UVM 1.0 Release with Questa
ulfat hussain said Provided link is not opening. Can u tell me what t... in Using the UVM 1.0 Release with Questa

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Posts tagged with 'Validation'

Semiconductor Package Thermal Characterization and Design as Easy as 1-2-3

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