Mentor Blogs

Hi there I recently discussed the new capability in Valor MSS Process Preparation 11.3. I mentioned that I would go in to more detail on some of the areas that are part of this version and I will cover the new Test Probe Placement capability today. We have added an all new Test Probe Placement Session in 11.3 that performs the physical test probe placement analysis natively within the application. … Read More

AOI, Flying Probe, ICT, data preparation, AXI, bill of materials, Design For Test, Automated Optical Inspection, Automated X-Ray Inspection, boundary scan, BOM, process, vPlan, testability, VPL

Hi there The Valor team are here in San Diego at the IPC Apex Trade Show. We’ve had a great couple of days, meeting our customers, plenty of new ones as well as meeting with some of the other vendors at the show. Our theater presentations have been well received, bringing people in to the booth and then stopping afterwards, asking questions and looking for more information. If you are at the … Read More

Enhancement, documentation, programming, Solder Paste Inspection, AOI, Design For Test, SPI, apex, stencil, testability, Automated Optical Inspection, VPL, BOM, Automated X-Ray Inspection, vPlan, boundary scan, approved vendor list, data preparation, AXI, AVL, bill of materials, Flying Probe, Planning, mixed vendor, OIB, IPC, ICT

Hi there We have just released a new version of Valor MSS (11.3) that brings a number of significant enhancements to existing customers as well as those looking to invest in cutting edge process preparation solutions. I’ll be covering some of these enhancements in more detail in future blogs but here is a short summary of some of the new capability that we have in 11.3. We have made significant … Read More

OIB, mixed vendor, vPlan, AOI, Flying Probe, ICT, BOM, AVL, documentation, bill of materials, Enhancement, Design For Test, data preparation, VPL, testability, stencil, programming, Planning, process

Hi there I have talked about the Valor MSS unique capability to use the Valor Parts Library or VPL in multiple ways during PCB manufacturing. VPL data is manufacturer specific information about the actual component body and pin areas that can be used for multiple uses across DFM, Stencil, Documentation, SMT programming, test programming and inspection programming. I’d like to focus the specifics … Read More

Sequence, programming, mixed vendor, AVL, bill of materials, process, data preparation, documentation, Flying Probe, Design For Test, BOM, vPlan, stencil, VPL

Hi there It has been a few months since we launched the World Class Process Preparation Webinar including a video of an overall product demonstration. Over the past couple of months I have met with a number of people who implemented the Valor MSS Process Preparation solution and are achieving the efficiencies and improvements that we describe in the Webinar. Therefore I would like to provide you with … Read More

mixed vendor, Flying Probe, AOI, ICT, BOM, boundary scan, AVL, bill of materials, documentation, data preparation, Design For Test, vPlan, Planning, testability, VPL, stencil, programming, process

Hi there I spent last week in the wonderful town of Zug about 45 minutes from Zurich in Switzerland. My European colleagues organized a two day seminar for over 60 of our Valor MSS Process Preparation customers at the Siemens facility in Zug. The agenda consisted of some Valor presentations, Valor demostrations of the upcoming software, presentations by actual users of the Process Preparation software … Read More

programming, AVL, process, AOI, data preparation, documentation, Flying Probe, bill of materials, ICT, BOM, Design For Test, vPlan, testability, VPL, stencil

Hi there Although the Valor MSS Process Preparation solution can handle most types of data that are passed it’s way, intelligent design data brings a wealth of benefits to its users. The import process is typically a few seconds for most designs as opposed to multiple hours to reverse engineer Gerber files to a sufficient level to be useful for manufacturing. Having to support electrical test … Read More

ODB++, bill of materials, documentation, programming, Gerber, BOM, VPL, data preparation, vPlan

Hi there One of the least efficient areas in PCB assembly concerns the creation and management of package data that will be consumed across the shop-floor. For example DFM processes rely on accurate package data to determine component to component spacing issues or using accurate pin terminus contact data to ensure that solder joints will form correctly. Accurate package data is critical for DFT analysis … Read More

programming, AOI, bill of materials, mixed vendor, process, documentation, data preparation, Design For Test, Flying Probe, ICT, BOM, VPL, vPlan, stencil, testability

Dear all It has been a few months but this week I am out at the Mentor Graphics office in Yavne, Israel. I have been working with the R&D team out here on the upcoming versions of our Process Engineering solutions. I certainly appreciate people taking the time to respond to my blog last week on stencil apertures. The new area ratio report as discussed in last week’s blog will be part of the … Read More

VPL, BOM, programming, stencil, AOI, data preparation, Planning, Design For Test, Enhancement, documentation, Flying Probe, vPlan

Okay, well maybe that is a little bit of an exaggeration but there are still many ways to leverage the manufacturer specific package data from the VPL throughout the Process Engineering flow. As a follow up to my last posting I mentioned that I would be talking about the creation and use of manufacturer specific packages. Through the use of the VPL, manufacturer specific packages can be downloaded … Read More

packages, AVL, approved vendor list, bill of materials, VPL, BOM