Mentor Graphics Publishes New Technology Book On BGA Routing by Charles Pfeil
WILSONVILLE, Ore., June 26, 2008 – Mentor Graphics Corporation (Nasdaq: MENT) today announced the publication of a new book written by Charles Pfeil, engineering director of Mentor’s Systems Design Division, entitled BGA Breakouts and Routing, Effective Design Methods for Very Large BGA. This publication, rich in technological expertise, explores the impact of dense ball-grid array (BGA) packages with high pin-count on PCB (printed circuit board) design, and provides solutions for inherent design challenges.
“Using a BGA is the most common method today for packaging a high pin-count or very dense application specific integrated circuits (ASIC) and field programmable gate arrays (FPGA). BGAs have been proved to be a reliable, cost-effective package while at the same time providing flexibility to address miniaturization and functional requirements,” said author Charles Pfeil. “However, as BGA density and pin count continue to increase, the designer’s ability to effectively design with the devices has not kept pace. Fortunately, significant advancements in PCB fabrication technology have enabled further miniaturization in the manufacturing process.”
These improvements, along with new software and design methods specifically for BGAs provide a means to successfully design using these devices.
“BGA Breakouts and Routing is a useful industry resource," said James Patten, assistant department manager, Components Design and Analysis Department, Northrop Grumman Space Technology. "The book explores BGA routing in a logical and straight-forward manner, and provides an orderly methodology while offering valuable insight into designing with these devices."
“We are proud to offer this in-depth look at the future enhancements of BGA technology,” said Dan Boncella, director of marketing, System Design Division, Mentor Graphics Corporation. “We continue to research and develop products for our customers with cutting-edge technologies providing designers with the tools necessary to enhance productivity and bring to market cost-effectively.”
To obtain a copy of BGA Breakouts and Routing, or to learn more about upcoming discussions, events and articles about BGAs and Mentor’s solutions to automating the design process for these complex, leading edge packages, visit, www.mentor.com/go/bga or contact Charles directly at email@example.com .
About Charles Pfeil
Charles is an engineering director at Mentor Graphics, System Design Division and was the original product architect for the Expedition® PCB software and one of the inventors of XtremePCB and XtremeAR software tools. Charles has worked in the PCB industry for over 40 years as a designer, owner of a service bureau, and has worked in marketing and/or engineering management with prominent leaders in the EDA companies. In addition, Charles is a consistent contributing author to industry publications discussing trends and technologies in PCB design as well as a regular participant in industry workshops and seminars.
About Mentor Graphics
Mentor Graphics Corporation (NASDAQ: MENT) is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world’s most successful electronics and semiconductor companies. Established in 1981, the company reported revenues over the last 12 months of over $850 million and employs approximately 4,200 people worldwide. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. World Wide Web site: http://www.mentor.com/.
Mentor Graphics and Expedition are registered trademarks of Mentor Graphics Corporation. All other company or product names are the registered trademarks or trademarks of their respective owners.
Leslie Van Grove