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FloTHERM.PACKSIM from Flomerics Accelerates Thermal Characterization of Semiconductor Packages

Thermal image of a TO-style package from FloTHERM.PACKSIM

April 2008

Flomerics has released a unique new software product, FloTHERM.PACKSIM, that revolutionizes the process of semiconductor thermal characterization and design. FloTHERM.PACKSIM provides a fast, simple, proven, automated process that reduces the number of distinct steps required to be performed by thermal experts, reducing the risk of modeling errors to enhance the quality, reliability, and availability of package thermal models.

FloTHERM.PACKSIM is built upon Flomerics' FloTHERM.PACK SmartPart technology and FloTHERM's CFD solver. The web-based tool is entirely wizard-driven which makes it attractive for engineers who are not thermal specialists. The result is a fully automated process for generating accurate package models and computing the complete set of JEDEC-compatible thermal characterization data. These include all Theta and Psi metrics under various environmental conditions and industry-standard compact thermal models . Interfacing with Cadence APD, FloTHERM.PACKSIM can take advantage of existing BGA layouts to capture metallization and via placement detail.

FloTHERM.PACKSIM also serves as a powerful design tool for thermal specialists. Changes in thermal performance can be investigated through parametric variation of key package parameters to optimize the package thermal design. A comprehensive search function on all key package parameters and metric values allows the user to optimize the starting point for a new design. Package sub-elements such as substrates and leadframes are stored as separate libraries, facilitating the use of data from third-party vendors. Direct interfaces to semiconductor manufacturer packaging databases can also be created with minimal customization. Flomerics' T3Ster measurement system can be used to calibrate and validate thermal models produced by FloTHERM.PACKSIM.

All this adds up to a huge productivity boost for semiconductor package characterization and design compared to existing approaches. Commenting on the new product, Sarang Shidore Director of Web Products at Flomerics Inc. said "FloTHERM.PACKSIM is a quantum leap in Flomerics' offerings to the semiconductor industry. In creating this product our focus has been on one thing – to deliver even higher productivity. FloTHERM.PACKSIM would not have happened without the critical feedback we have received from our customers over the past several years. We thank them for their support."

E.g. DELPHI compact modeling standards that are being currently adopted by the industry standards body JEDEC

For further information, please contact:

Nazita Saye
Head of Marketing
Mentor Graphics Mechanical Analysis, UK
81 Bridge Road
Hampton Court
Surrey, KT8 9HH

Tel: +44 (0)20 8487 3000
Fax: +44 (0)20 8487 3001

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