TOKYO, Japan, May 24, 2013 — Mentor Graphics Corporation (NASDAQ: MENT) today announced that Yafei Luo, senior application engineer for the Mentor Graphics® Mechanical Analysis Division, has received the International Conference on Electronics Packaging (ICEP) Young Award. ICEP is Japan’s only international conference on electronics packaging, and the award is sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society of Japan for young researchers under the age of 35.
Luo received this award for his paper, “Use Isothermal Surface to Help Understand the Spatial Representation of Structure Function,” which was presented at the ICEP 2012 conference last April in Tokyo, Japan. The paper referenced the Mentor Graphics T3Ster® technology which is now a standard thermal characterization solution in the industry, recently recognized by JEDEC for its significance in international testing standards of LEDs.
"We congratulate Yafei Luo for this prestigious honor from the IEEE CMPT Society Japan Chapter and for his ongoing commitment to the field of thermal research and test methodologies,” stated Dr.Erich Buergel, general manager of Mentor Graphics Mechanical Analysis Division. “We are proud of Yafei’s achievements and look forward to supporting his efforts in this field.”
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