IE3D™ SI Full Wave 3D Electromagnetic (EM) Simulation
Full-wave 3D Electromagnetic Design and Verification
Today’s high-frequency IC, MMIC, package and PCB designs need full-wave electromagnetic (EM) accurate circuit models to confidently converge on a final physical implementation that will satisfy your target performance requirements. IE3D SI’s full-wave 3D EM design and verification solution meets the capacity & run-time performance demands of complete package, PCB or circuit-level simulation and modeling. The EM-accurate results enable design and signal integrity (SI) engineers to design and verify their largest designs with confidence.
Features
Full wave simulation. IE3D-SI’s full wave simulation can accurately model complex structures on packages, PCBs and IC/MMIC circuits for optimized system performance.
- Automatic 3D geometry model creation features full support for bond wires, solder balls & bumps, interconnect and dielectric thicknesses. Proprietary non-uniform mesh generation and adaptive curve fitting ensure fast and accurate simulation results for these broadband applications.
- Reliable simulation results that match measurement reduces your EM design costs by avoiding expensive design iterations
- More simulations-per-hour speeds up design convergence and improves overall design quality by verifying more design issues in less time
- Simulate even your largest structures in the smallest memory footprint reduces your EM design risks with precise modeling of geometries without time-consuming error prone design partitioning
Datasheets
Toolbox
- software eval: Free EM Design Software Evaluation – The Perfect Solution for EM Simulation
- On-demand Web Seminar: Enhancing Multi-Gbps Simulations With The New HyperLynx 3D Full-wave Solver
Contact Mentor Graphics
- IE3D SI Info Request or call toll free: 1-800-547-3000
Highlights
High Simulation Capacity
High Simulation Capacity
Other commercial EM tools forces engineers to over-simplify and/or reduce the size of the structure to be simulated. IE3D SI is uniquely capable of simulating full structures and layer stack-ups. There’s no need to trim layer stack-ups and adjacent metal structures before the tool can attempt to complete the simulation.
With this feature, engineers don’t give up the accuracy they need to save time and capture all the important parasitic coupling and electrical characteristics of the complete structure.
No need to widen design margins that lead to under-achieving system performance goals and require more area or I/Os than necessary. IE3D SI mitigates risk associated with design portioning and reduces time-to-simulated results with full structure EM simulation.
Auto 3D Geometry Modeling & Meshing from PCB Layout Design
Auto 3D Geometry Modeling & Meshing from PCB Layout Design
IE3D SI provides native integration to a variety of popular layout design tools. Full 3D geometry models of bond wires, solder balls, bumps, vias, interconnect and dielectric layers are automatically extracted directly from the layout data and meshed to ensure proper handling by the IE3D SI EM engine. Now, design and signal integrity engineers are granted easy access to an accurate EM solution to improve and verify a design’s final performance as part of their overall EM design practice.
Process Engineering from Assembly Documentation.
EM Modeling & Mixed-Domain Spice Simulation
EM Modeling & Mixed-Domain Spice Simulation
IE3D SI delivers multiport s-parameter models (Touchstone Format) and broadband RCLK Spice sub circuit models ready to be plugged into your circuit simulations. IE3D SI also comes equipped with MDSPICE, a mixed frequency and time domain SPICE simulator featuring a combined time domain and frequency-domain simulation engine. MDSPICE performs robust, accurate, and efficient time-domain simulations based upon frequency-domain s-parameters. MDSPICE accepts any combination of s-, y- or z-parameter files as elements or RLC sub-circuit netlists.
It is well known that s-parameter frequency responses are an accurate and complete description of circuit performance and that extracting RLC netlists from s-parameter models is an optimization process that suffers accuracy loss over broad frequency range. Such extraction methods attempt to match frequency responses of the extracted RLC netlist to that of the target s-parameter file. Structures with many ports further limit this approach. MDSPICE does not have such frequency limitations and performs efficient transient analysis of complex multiport EM structures without loss of accuracy.
IE3D-SI creates S-parameter, time and frequency domain,
and Eye-diagram easy to use results.