Electromagnetic Simulation Solutions
IE3D is the first SCALABLE EM design and verification platform that delivers the modeling accuracy for the combined needs of high-frequency circuit design and signal integrity engineers across multiple design domains. For many companies, there is no longer just one EM problem at hand, but several different ones each presenting a unique bottleneck and delaying overall design closure.
IE3D’s multi-threaded and distributed simulation architecture and high-design capacity is the most cost-effective EM simulation and modeling solution for component-level and circuit-level applications. IE3D offers the highest simulation capacities and fastest turnaround times for the broadest number of applications making it the best choice for improving your design team productivity and meeting design schedules on time.
Solutions:Scalable EM Simulation Solution
Scalable EM Simulation Solution
IE3D is the first scalable design and verification platform that delivers the modeling accuracy for the combined needs of high-frequency circuit design and signal integrity engineers across multiple design domains. For many companies, there is no longer just one EM problem at hand, but several different ones each presenting a unique bottleneck and delaying overall design closure. IE3D’s multi-threaded and distributed simulation architecture and high-design capacity is the most cost-effective EM simulation and modeling solution for component-level and circuit-level applications. IE3D offers the highest simulation capacities and fastest turnaround times for the broadest number of applications making it the best choice for improving your design team productivity and meeting design schedules on time.
Solutions:Antenna
Antenna
Today’s high performance antenna array design requires both, large capacity EM simulation and unit array cell EM design and optimization capabilities. Getting the array unit cell right from the start is essential before replicating into a larger antenna array structure. And if accuracy is sought, then the designer needs to be extremely careful with approaches that formulate estimated boundary conditions for unit cells used within larger arrays. These approaches typically suffer from poor capacity limits and do not accurately model the EM behavior between unit cells, especially for cells on the antenna array periphery. IE3D-SSD offers FASTEM to thoroughly explore the relevant design space and optimize the geometry for each unique unit cell. In addition, IE3D-SSD’s superior capacity and run-time enable even the largest antenna arrays to be solved in least amount of time. IE3D-SSD is the best solution for your antenna design.
Solutions:RFID
RFID
Determining the primary and secondary characteristics of any RFID tag is always challenging. And ensuring the target layout will indeed meet the overall design objectives including a correct conjugate match is often a lengthy trial and error process. RFID design and EM modeling is a strength of IE3D SSD where combining both disciplines of antenna and embedded passive design are best addressed. Critical geometries and dielectric impact on overall tag performance can be easily isolated and optimized accelerating design closure and improving the overall quality of the design. IE3D SSD is the sure bet for RFID design.
Solutions:MMIC
MMIC
Today’s MMIC designers now require “circuit-level” EM simulation and modeling to support the accuracy and throughput demands to meet aggressive project schedule deadlines. The days of using flat planar 3D EM simulations solutions for MMIC design are over. Now full 3D geometry modeling of bond wires, via structures, and other 3D structures are a must-have for designers pushing performance. Circuit-level EM simulation captures the true electrical behavior of a designs passive structures including coupling. IE3D SSD is the perfect fit for MMIC designers requiring full 3D geometry modeling and high simulation capacities.
Solutions:IC Packaging
IC Packaging
Increasing operating frequencies and the rapid move to multi-chip system architectures have sparking a new parasitic extraction paradigm shift for IC packaging that now requires the accuracy of full 3D EM simulation and modeling. Package models built upon simplistic 2D approximations can no longer be relied upon to secure successful design closure. IE3D SI is the perfect answer for the circuit design and signal integrity engineer delivering the fastest throughput and capacity of any true 3D EM simulation commercially available. IE3D SI delivers the most accurate models of packages housing stacked die, multiple die, and embedded passives with multi-height bond wires, solder balls, bumps, vias, and through silicon vias. IE3D SI scalable computing architecture leverages your multi-core computers and server farms to solve the largest packaging problems with the fastest turnaround ensuring a fully optimized design where all end cases have been investigated prior to final tape out. IE3D-SI reduces the risk an undetected EM design flaw slips through the final verification saving time and money.