Electromagnetics Design & Verification White Papers

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Design Optimization And Analysis of IC Packages for USB 3.0

USB 3.0 is rapidly being adopted by a growing number of system level companies, spawning many integrated device manufacturers (IDMs) to develop new chips to address this need. USB 3.0 supports data transfer rates up to 4.2 Gbits/sec, creating new challenges for IC package designers and signal integrity engineers that must be addressed as part of the high-speed SERDES design process. These higher data rates will require substantially improved modeling accuracy of the IC package’s interconnect, wire bonds, vias, and solder balls that are part of such high-speed data paths. Now, full 3D electromagnetic (EM) simulation and modeling is required for such structures to help ensure the package design is optimized for low crosstalk (EM coupling), reflection, and insertion loss. This paper will introduce important design considerations and an effective high-speed design methodology recently successfully employed for the design of a commercial USB 3.0 part.

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Marchand Balun Design and Verification Using IE3D

This white paper details the design benefits of baluns in RF/MMIC circuit design using the development of the Marchand Balun as the learning vehicle. The Marchand Balun was picked as a demonstration vehicle because of its wide bandwidth compared to other circuit-element structures and its straightforward planar implementation. The Mentor Graphics IE3D electromagnetic design and verification solution is used to analyze and model the electrical behavior of this structure.

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