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8:15 AM - 9:15 AM 1 sessions

Registration

9:15 AM - 9:20 AM 1 sessions

Welcome & Introduction

9:20 AM - 10:00 AM 1 sessions

Meeting the Challenge of Developing the ‘More Electric’ Aircraft Abstract

KEYNOTE As electronic content increases dramatically in aerospace design, aircraft are evolving into sophisticated networked computing platforms. Unfortunately, there has not been a corresponding evolution in electronic design tools and methodologies, even as the industry moves towards a ‘more electric’ aircraft. To bridge this design gap, model-driven development is emerging as the best way to manage this complex process.

Dr. Rhines will provide examples and an assessment of where aviation leaders are in the process of implementing model driven design to meet ever more demanding program requirements and functional specifications. He then will outline what needs to be done, both now and in the future, to eventually realize the goals of the all-electric airplane: including architecting and optimizing designs, and implementing subsystems across organizational, geographic, and supply-chain boundaries.

Presenter: Wally Rhines, Chairman and Chief Executive Officer, Mentor Graphics

Walden C. Rhines is Chairman and Chief Executive Officer of Mentor Graphics, a leader in worldwide electronic design automation with revenue of $1,015 million in FY2012. During his tenure at Mentor Graphics, revenue has more than doubled, growth rate since 1999 has been number one among the “Big 3” EDA companies, and Mentor has grown the industry’s number one market share solutions in physical verification, design concept-through-functional verification, and printed circuit board design. Prior to joining Mentor Graphics, Rhines was Executive Vice President of Texas Instruments’ Semiconductor Group, sharing responsibility for TI’s Components Sector, and having direct responsibility for the entire semiconductor business with more than $5 billion of revenue and more than 30,000 people. During his 21 years at TI, Rhines managed TI’s thrust into digital signal processing and supervised that business from inception with the TMS 320 family of DSPs through growth to become the cornerstone of TI’s semiconductor technology. He was also responsible for development of the first TI speech synthesis devices (used in “Speak & Spell”) and is co-inventor of the GaN blue-violet light emitting diode (now important for DVD players). He was President of TI’s Data Systems Group and held numerous other semiconductor executive management positions. Rhines is currently in his fourth term as Chairman of the Electronic Design Automation Consortium. He is also a board member of the Semiconductor Research Corporation, Lewis and Clark College, and the Portland Classic Wines Auction. He has previously served as chairman of the Semiconductor Technical Advisory Committee of the Department of Commerce, as an executive committee member of the board of directors of the Corporation for Open Systems, and as a board member of the Computer and Business Equipment Manufacturers' Association (CBEMA), SEMI-Sematech/SISA, Electronic Design Automation Consortium (EDAC), University of Michigan National Advisory Council, and Sematech. Dr. Rhines holds a bachelor of science degree in metallurgical engineering from the University of Michigan, a master of science and Ph.D. in materials science and engineering from Stanford University, a master of business administration from Southern Methodist University, and an Honorary Doctor of Technology degree from Nottingham Trent University.

Featured Sessions

10:00 AM - 10:35 AM 1 sessions

Guest Keynote TBC

Featured Sessions

10:35 AM - 10:50 AM 1 sessions

Coffee

10:50 AM - 11:45 AM 1 sessions

Strong Aircraft, Weak Economy: A Complicated Picture? Abstract

TECHNICAL SESSION A discussion of all major market trends in the aviation business today, the presentation will cover growth rates, market risks, and competitive dynamics for all turbine-powered aircraft markets, products, and manufacturers. Specifically, it will look at military fixed and rotary wing aircraft, large commercial jetliners, regional aircraft, and business aviation. A Q&A session will also answer audience questions on any secondary and related markets, such as jet engines or defense spending.

Presenter: Richard L. Aboulafia, Vice President, Analysis, Teal Group

Featured Sessions

11:45 AM - 1:00 PM 1 sessions

Lunch

1:00 PM - 1:35 PM 4 sessions

A Platform Level View of Systems Engineering – Extending Across Physical Implementations Abstract TECHNICAL SESSION Aircraft and military systems are arguably the most complex software intensive products today. But the distributed nature of computing on board these platforms means nothing works without the electrical system that interconnects the components. This presentation explores the latest technology for electrical design, and how integrations with requirements, functional design, verification & project management tools are contributing to a true systems engineering approach to platform development. As the challenges and technical solutions are described, so the value of this innovative and compelling paradigm becomes clear. Presenter: Martin O'Brien, General Manager, Mentor Graphics Martin joined Mentor Graphics in February 2001 from Tyco Electronics where he was Global Sales Director for a $500 million OEM Electronics business. Prior to that Martin held successive roles in Raychem Corporation covering Product Development, Product Marketing, and Global Market Development for transportation markets including Aerospace, Automotive, and Defense.	Electrical Distribution Systems
Efficient Compliance with ARP-4754A and DO-297 for IMA Systems Abstract TECHNICAL SESSION Any new aircraft program that involves an Integrated Modular Avionics System will need to comply with SAE ARP-4754A, Guidelines for Development of Civil Aircraft and System and RTCA DO-297, Integrated Modular Avionics (IMA) Development Guidance and Certification considerations. As there are significant overlaps between these standards, an integrated certification approach is necessary to minimize the effort associated with compliance. This presentation will provide an introduction to efficient compliance with both standards. Presenter: Marty Gasiorowski, FAA DER and President, Worldwide Certification Services Worldwide Certification Services' President, Marty Gasiorowski, has more than 25 years of experience on certification programs with FAA, EASA, and other certification authorities worldwide. He is a Systems, Safety, Electronic Hardware and Software DER, and has worked with the Certification Authorities to define IMA certification approaches. He was the United States Chairman of the Document Integration Team that generated DO-178C and associated supplements, was a member of the committees that generated DO-178B and ARP-4754, and has led a certification organization with more than 120 employees.	Hardware Development
A Cost Effective Hardware Option for SWaP and Obsolescence Challenges Abstract TECHNICAL SESSION Reducing size, weight and power (SWaP), improving reliability, and addressing parts obsolescence are increasing concerns in mil-aero hardware development projects. A Via Configurable ASICs (VCA) can be an optimal solution to address these challenges. VCA technology integrates silicon-proven analog and digital resources onto pre-configured ASIC arrays requiring only a single via mask layer to customize the design and finalize the manufacturing process. VCAs offer a dramatically reduced-cost alternative to ASIC design, supporting both low volumes and fast development cycles. This session discusses and demonstrates how a systems or application engineer, with no IC design or modeling experience, can quickly develop and test their own custom mixed-signal integrated circuit. Instead of picking discrete and COTS parts from a catalog, the engineer can design their circuit interactively in a simple, schematic-based design environment, test it, and then have it quickly implemented in a VCA platform. The design environment (built on Mentor Graphics SystemVision tool) also supports multi-discipline system development and verifying the chip in the context of its resident system. Presenter: Reid Wender, VP of Sales and Marketing, Triad Semiconductor Reid Wender thinks mixed signal chip design should be fast and affordable for everyone. As VP of Marketing and Technical Sales at Triad Semiconductor, he promotes the virtues of via configurable array technology and the democratization of IC development. His first integrated circuit project was a CGA graphics controller redesign while a coop student at IBM. He spent the late 80’s developing video ASICs for analog televisions at Philips. He had a ton of fun developing a “Universal Library” methodology that enabled the rapid prototyping of video algorithms in FPGAs. This methodology was successfully used at Philips, TI, Motorola and RCA/Thomson. Later, he led development teams in HDTV, MPEG set-top boxes and in the creation of family room products that combined PC, TV and internet capabilities. He has over 25 years of experience in the design and delivery of custom ASIC and SOC solutions. He has held design, management and VP of Engineering positions at Philips, ASIC International and QuVIS. A ‘child’ of the FPGA-era, Wender longs to bring an FPGA-like business model to analog and mixed signal chip design. He has a BSEE from the University of Tennessee. When he is not traveling the world talking about Triad’s ViaASIC technology, he enjoys God’s blessings of a wonderful family in the foothills of the Great Smoky Mountains.	System Modeling and Analysis
Thermal Characterization of Mission Critical Semiconductors for Higher Reliability Abstract TECHNICAL SESSION One critical factor in thermal management of electronics systems is being able to accurately evaluate component level thermal behavior. When operating in a system, component performance can be influenced by many factors such as the operating conditions, the system environment and even the component manufacturing process and quality.Gaining a detailed understanding of the component thermal characteristics allows system designers to select the most suitable and reliable components for their application from vendors. It also helps them to assess the impact of thermal cycling on performance, and where it can potentially lead to a component failure due to component structure degradation. This session will focus on how thermal characterization of semi-conductor components via repeatable, accurate testing methods, can be applied to assess component reliability to improve overall component/system performance in mission critical applications. Presenter: Joe Proulx, Application Engineer, Mentor Graphics	PCB Systems Design and Mechanical Analysis Track

1:35 PM - 1:40 PM 1 sessions

Break

1:40 PM - 2:15 PM 5 sessions

Early Evaluation of Electrical Distribution System Alternatives Abstract TECHNICAL SESSION No longer can decisions regarding the system interconnect be left until late in the design process. The ever-increasing electrical content of platforms and regulatory mandates like EWIS are compelling companies to look for ways to evaluate harnessing architecture alternatives very early in the design process. Being able to perform weight, electrical verification, and other types of studies early provide a means to evaluate design alternatives quickly while cost-of-change is low. This breakout investigates capabilities that provide designers a way of ensuring they are developing the electrical distribution system that best meets design objectives. Presenter: John Low, Aerospace Business Development Manager, Mentor Graphics John Low has been actively involved in the worldwide aerospace industry for more than 30 years. John started with design and manufacturing engineering responsibilities on rocket propulsion systems followed by work with The Boeing Company in a variety of design engineering roles on commercial and military applications. For the last 20 years, John has been with the Integrated Electrical Systems Division of Mentor Graphics Corporation as an aerospace business and product manager to define and execute Capital’s aerospace product vision. John has published multiple articles on how COTS tools are addressing today’s challenges of aerospace electrical distribution systems development.	Electrical Distribution Systems
Right Side Of The V: Integration, Verification & Validation Abstract TECHNICAL SESSION Activities on the right side of the Systems V are not only technically challenging but also important from commercial and regulatory standpoints. This breakout session examines the right side of the V for the electrical design domain, including the implications of EWIS regulations. Technologies introduced address subjects such as sub-system design integration, emergent behavior, requirements traceability, and test case management. These technologies make a key contribution towards a systems approach to platform level engineering. Presenter: Dr. Nick Smith, Product Director, Mentor Graphics Nick Smith is currently the Product Director of Mentor Graphics Integrated Electrical Systems Division (IESD), a position he has held for about 5 years. As such he has worldwide responsibility for inbound product definition and outbound go-to-market activities surrounding IESD’s software products, which are targeted at electrical system and wire harness designers within the transportation segment. Before joining Mentor Graphics Nick held a variety of positions at Raychem Corporation (subsequently acquired by Tyco), including managing both development and product marketing of various microelectronic and electrical interconnection components. Nick has substantial international experience, including a three-year assignment in California, mostly within the automotive, aerospace, and rail industries. Educated at Cambridge University, Nick holds a Ph.D. in laser physics and an MBA specialized in high-tech marketing.	Systems Engineering
Facing the “More Electric” Design Challenge with “More Integrated” Modeling Capability Abstract TECHNICAL SESSION System Integrators are facing unrelenting challenges as the “More Electric Vehicle” tsunami continues across multiple design beachheads. Not only are new technologies being introduced to replace traditional actuation and control approaches, but the “deep knowledge” of how they work and how to effectively integrate them into efficient and high performance systems is now distributed across multiple engineering disciplines and often across multiple corporate boundaries. Fortunately, there is new standards-based modeling format and tool integration technology that supports multi-disciplinary design team collaboration. This session will demonstrate these capabilities as they apply to power generation and distribution systems (3-Phase AC), power conversion (AC/DC and DC/DC), and motor drive actuators in motion control systems. Tool integration includes co-simulation with LabVIEW™, Simulink®, C/C++, and SystemVision® (as well as Excel® for experiment control and automated stress analysis), and FEA-based model generation/import. Presenter: Mike Donnelly, Principal Engineer, Mentor Graphics Mike is a Principal Engineer with Mentor Graphics, part of the SystemVision Development Team. He is engaged in modeling and simulation of Power, Control, and Mechatronic Systems. He has more than 30 years experience in Aerospace and Automotive Engineering, focused on simulation-based design exploration and analysis. Mike holds a MSEE from the University of Southern California and a BSEE from the University of Cincinnati.	System Modeling and Analysis
The Future in Thermal Simulation of Aerospace & Defense Electronics Abstract TECHNICAL SESSION In this session we will present the future of thermal simulation for aerospace and defense electronics, including infotainment, navigation, or tactical and/or mission-critical systems. This new technology will speed up the overall design process and enable better, more accurate, and efficient thermal analysis. We will show how to stay in the loop with the latest electrical design for thermal simulation and how to leverage the information that comes with the ECAD design for even faster simulation setup and accuracy, enabling engineers to get the design right the first time and be even faster to market than ever before. This future simulation technology is the key to all thermal designs decisions that enable better SWaP (Size, Weight and Power) of any industry-related electronics. Presenter: Joe Proulx, Application Engineer, Mentor Graphics	PCB Systems Design and Mechanical Analysis Track
FPGA Design from Concept to Implementation to Safety/Mission/Security Success Abstract TECHNICAL SESSION The design regulations for FPGAs and ASICs in commercial and military aircraft are some of the strictest to adhere to and for good reason – failure of electronics in commercial aircraft can have catastrophic results! While the commercial air industry has mandated the DO-254 hardware design standard, military aerospace companies are adopting design processes similar to DO-254, some even having their own auditors. By taking a design approach that is requirements-driven and well integrated for FPGA and ASIC design creation through device implementation, an excellent design process can be followed that will enable meeting the compliance needs of DO-254 and other such regulations, while also improving the project’s efficiency, productivity, predictability and final chip quality. This session will present advanced chip design methods and practices that are now essential for any mil/aero FPGA or ASIC design project. Presenter: Valerie Rachko, Director of Marketing, Mentor Graphics Valerie Rachko is the director of HDL & ESL design creation marketing at Mentor Graphics. Rachko has been marketing HDL design products for Mentor Graphics since 1990, ranging from creation, analysis, reuse, checking, verification, synthesis, and design management, with more recent expansion into UVM/OVM and ESL. She holds Bachelor of Science and Master of Science degrees in electrical engineering from Fairleigh Dickinson University, graduating in both with summa cum laude honors. She is also a magma cum laude Master of Business Administration in marketing graduate from Seton Hall University. Prior to joining Mentor Graphics, Valerie was an ASIC designer for more than five years.	Hardware Development

2:15 PM - 2:20 PM 1 sessions

Break

2:20 PM - 2:55 PM 5 sessions

Connected Technology for Manufacturing Engineering Abstract TECHNICAL SESSION Manufacturing engineers apply their skills and knowledge to huge volumes of data to accomplish complex tasks. This session shows how Capital’s capability extends into manufacturing process planning & optimization, seamlessly leveraging the harness design data. Capital Harness TVM, a brand new tool, will be introduced. It allows multiple end-to-end factory processes to be modeled. These are combined with design data to quickly & accurately synthesize harness manufacturing processes, right down to task level. This provides rich information and data for several purposes including DFM validation, harness costing, work instruction creation and feeding production systems. Presenter: Glenn Reynholds, Engineering Manager, Mentor Graphics Glenn Reynholds joined Mentor Graphics in 2001 and is currently the Engineering Manager for Harness Solutions. Glenn has more than twenty years of experience in the software industry developing solutions for both the MCAD and ECAD markets. He has held various positions in Mentor’s Integrated Electrical Systems Division (IESD) since the inception of the Capital product line, including software architect and engineering manager.	Electrical Distribution Systems
The "More Electric Aircraft” Demands a More Integrated Enterprise Abstract TECHNICAL SESSION As increased content places ever greater focus on electrical systems design, organizations want to use best-of-breed tools. But, deployments can be hampered by the inability of disparate tools to communicate and share data. Indeed, seamless data integration is a key element driving ROI and cost avoidance. This session describes how the Capital software suite has been built to integrate with third-party applications from the outset. Various examples will be highlighted during the session to show how digital data continuity can be realized, including the use of newer technologies such as Open Services for Lifecycle Collaboration (OSLC).	Systems Engineering
Knowledge Reuse: Leveraging Model “IP” to Accelerate the Design of Integrated Systems Abstract TECHNICAL SESSION Electro-mechanical actuation systems are becoming more common in aerospace applications. Systems that have been traditionally based on hydraulic-mechanical actuators are now being replaced by electro-mechanical actuation systems in pursuit of the more electric airplane. The complex interactions among the mechanical, electro-magnetic, electronics, and control aspects of these systems demand comprehensive modeling and simulation capability in order to build useful virtual prototypes. A fairly significant time investment in model development is required to achieve high-value results, such as making good system trade-offs or identifying problems and solutions before the hardware is available. This model development cost is highest the first time this methodology is deployed. But similar to the benefits of “circuit reuse,” the knowledge “IP” that has been stored in these models can be rapidly and effectively reused on subsequent projects. This presentation will cover the multiple insights and efficiencies gained by the design team for an electro-magnetic brake system. Presenter: Mike Shaw, Electrical Engineer, UTC Aerospace Systems Mike Shaw is an electrical engineer at United Technologies Aerospace Systems specializing in power electronics and motor control for the aerospace industry. Mike has been involved in the development of various aircraft systems including flight, engine, and brake controls. He has most recently been working in the development of electric brake technology for aircraft platforms. Mike holds a BS in Electrical Engineering from the University of Massachusetts.	System Modeling and Analysis
Requirements Management: Ensuring Functionality and Accountability Abstract TECHNICAL SESSION Requirement management and traceability is essential for safety-critical design processes used within the development of aerospace or military projects. This session explores how to manage and automate requirements traceability from specification through design, implementation, and verification. This session will detail key capabilities, including impact analysis and report generation, and take a look at capabilities to help manage requirements at a system level. This session will also describe how requirements tracking fit into a team environment and how one can trace requirements throughout many different tools and engineering flow Presenter: Valerie Rachko, Director of Marketing, Mentor Graphics Valerie Rachko is the director of HDL & ESL design creation marketing at Mentor Graphics. Rachko has been marketing HDL design products for Mentor Graphics since 1990, ranging from creation, analysis, reuse, checking, verification, synthesis, and design management, with more recent expansion into UVM/OVM and ESL. She holds Bachelor of Science and Master of Science degrees in electrical engineering from Fairleigh Dickinson University, graduating in both with summa cum laude honors. She is also a magma cum laude Master of Business Administration in marketing graduate from Seton Hall University. Prior to joining Mentor Graphics, Valerie was an ASIC designer for more than five years.	Hardware Development
Virtual Prototyping for Reliability Abstract TECHNICAL SESSION Poor reliability of a product can lead to extensive warranty cost, product recalls, and bad reputation. There are many causes of poor reliability, such as excessive heat, vibration and shock, marginal manufacturing, and poor power distribution network design. This session will discuss how virtual prototyping analysis can predict long-term reliability issues and help designers eliminate them without the use of expensive and time-consuming physical prototypes and test chamber testing.	PCB Systems Design and Mechanical Analysis Track

2:55 PM - 3:15 PM 1 sessions

Coffee Break

3:15 PM - 3:50 PM 5 sessions

Case Study: Creating electrical schematics and wire harnesses for a full flight simulator Abstract TECHNICAL SESSION The modern flight simulator consists of a generic building block mated to an aircraft-specific front-end. With the rising complexity and need to manage configurations/change requests across projects, our legacy toolset began to struggle. During this presentation I’ll explain the functional criteria we needed to fulfill whilst evaluating Capital against other vendors, and how in the space of just over two years we have successfully moved six projects into the Capital design environment and the benefits this has brought us. Presenter: David Hyder, Hardware Engineering Group, L3 Link Simulation	Electrical Distribution Systems
Advanced Systems Engineering and Model Philosophy Abstract TECHNICAL SESSION As systems grow more complex, development programs grow larger and more difficult to execute successfully. Challenges in meeting cost and schedule targets show up across all industries in complex systems development. Recent research shows that correctly applied systems engineering approaches can make a significant impact on cost and schedule risk. This led to the Advanced Systems Engineering initiative, a set of concepts and directions aiming at improving program execution. Though many buy into the mantra, “models are the answer” in systems engineering, we must distinguish what makes a model, a model. Beyond particular modeling languages and diagram types, models exist for various purposes, and can have relationships with each other, forming a kind of “model of models.” In Advanced Systems Engineering, the relationship between models and requirements is also changing and evolving to include both model-driven requirements and requirements-driven models. Presenter: Barclay Brown, Global Solution Executive for Aerospace and Defense, IBM Barclay Brown is the Global Solution Executive for Systems Engineering for IBM Rational. A former chief engineer for IBM Global Business Services, he was the lead systems engineer for some of IBM’s largest development projects. He is the designer of the model-driven system development course and co-author of the book Model-Driven Systems Engineering with Rational Tools. Mr. Brown holds a BS degree in electrical engineering with graduate degrees in psychology and business and continued graduate work in systems engineering. He is a certified Expert Systems Engineering Professional (ESEP), the Americas Sector Director for INCOSE, and an adjunct professor of systems engineering at the University of Central Florida.	Systems Engineering
An xtUML Methodology for Efficient Model-Driven, Safety-Critical Software Development Abstract TECHNICAL SESSION Today’s mil-aero programs are facing pressure from both an ever-growing, ever-evolving list of customer requirements as well as increasing certification requirements. This is driving companies to seek out and establish modern development methodologies that focus on both development efficiency and ease of certification compliance. Development efficiencies (including reuse, early testing, architectural optimization, abstraction, and automation) and compliance-driven software development methodologies (requiring a structured process, clear documentation, proof of thorough testing, and qualification of tools) do not need to be at odds with each other. This session introduces a model-driven methodology based on executable and translatable UML (xtUML), which provides the foundational elements of systems and software development that address both the efficiency and certification needs of today’s safety-critical programs. Presenter: Anders Eriksson, Principal Engineer, SAAB Aeronautics Anders Eriksson is a Principal Engineer working with Software Systems in Aeronautics at Saab. For the past fifteen years, Anders has been working with xtUML in various projects as an architect and xtUML model compiler developer. He is currently working towards a Ph.D. degree with a focus on Model Driven Development and RTCA/DO--178C. He also has a special interest in SW/HW co-design supported by xtUML platform-independent modeling. Anders received a Master of Science degree in Computer Science and Engineering from Linköping University, Sweden, in 1995 Presenter: Michelle Lange, Marketing Manager, System Modeling and Analysis, Mentor Graphics Michelle Lange, a 22 year veteran of the EDA industry, has spent her career working in numerous aspects of marketing and technical communications. Michelle is currently the Marketing Manager for the System Modeling and Analysis (SMA) business unit in the System Level Engineering division. In this role, Michelle is responsible for the market strategy and messaging for the SystemVision, SystemVision conneXion, and BridgePoint products. Prior to this, Michelle was the DO-254 and Design Assurance Program Manager at Mentor Graphics where she worked with customers striving to meet DO-254 and similar regulatory compliance, the product teams within Mentor that developed the tools/features required for these flows, partners in the industry who offered complimentary services and tools, and industry organizations such as the DO-254 User’s Group (in both EU and the US) whose participants focused on DO-254 issues. She also continues to be a member of the SAE S-18 committee, the group responsible for developing the system-level development and safety standards for civil aviation. Previous to her DO-254 focused role, Michelle held a variety of technical and marketing positions in several product divisions at Mentor including Design-for-Test and Design Verification. She has a BSEE (Maxima Cum Laude) from the University of Portland and MBA (Summa Cum Laude) from University of Phoenix.	System Modeling and Analysis
HW and SW Design Demands Parallel Development Abstract TECHNICAL SESSION Complexities and quality requirements of FPGA and ASIC designs today are demanding new design approaches that start with creation. The level of design abstraction must now be raised above RTL in order to contribute an entire new dimension of benefits to design, especially for multi-core architectures. Raising the design description language up from RTL to electronic system level (ESL), which is TLM-based (transaction level modeling), enables more design to designed, explored, validated, and co-designed with corresponding software and firmware using virtual prototypes to result in faster design cycles, higher quality projects, and higher levels of hardware and software design assurance. Presenter: Jon McDonald, Strategic Program Manager, Mentor Graphics	Hardware Development
Complexity Management for Electronic Systems Engineering Abstract TECHNICAL SESSION The engineering of a complex system of multiple PCBs by a team of engineers requires not only an advanced systems definition capability but also the ability of teams of engineers to define the system and the design constraints concurrently. This session will illustrate Mentor's technology that is unique in the industry where multiple engineers can work on the same schematic and define high speed constraints on a system concurrently while viewing their peers' edits real time. It will also describe the ability to define the multi-PCB system top-down with automated backplane and cable integrity.	PCB Systems Design and Mechanical Analysis Track

3:50 PM - 3:55 PM 1 sessions

Break

3:55 PM - 4:30 PM 5 sessions

Reducing the Time-to-Value for a Capital Deployment Abstract TECHNICAL SESSION Mentor Graphics Capital is an extremely powerful set of electrical design tools. The road from initial purchase to production usage can take several paths. Working with partners who have the experience of leading others to early success with Capital to create a plan that leads to successful use of the Capital tools, and following that plan, are essential to achieving the fastest return on investment and quickest proactive use of the Capital tools. This session will contrast several Capital customers who have chosen different paths to prepare for the use of Capital tools in production aerospace design environments. Presenter: Russell Forsyth, Deployment Architect, Mentor Consulting Division A little more than two years ago, Russ joined the Mentor Consulting group as a Deployment Architect. Within this role he oversees the deployment of the Capital tools, forming both solutions architecture and resource scheduling. Over the last two years he has been responsible for the implementation of refined deployment processes which has already expedited tool adoption into numerous accounts. Previous to this position, Russ was part of the business development team for the Mentor Graphics Capital products where he was responsible for assessing the business problems of an account, leading the account from pre-sales into deployment, and driving the development of the Capital product to better serve its users. Presenter: Scott Majdecki, Consulting Manager, Mentor Consulting Division	Electrical Distribution Systems
A Smart Documentation & Maintenance Solution for Mil-Aero Platforms Abstract TECHNICAL SESSION Efficient repurposing of engineering data into technical publications cuts project costs and timescales. And, efficient maintenance and repair maximizes aircraft availability. This breakout shows new technology that automates the assembly of electrical design data for consumption by publications environments; it also shows a new, lightweight, browser-enabled environment for maintenance technicians. Incorporating on-the-fly schematic generation, the technician's environment is highly navigable and can display effectivity-specific data to reduce the time and cost of fault diagnosis and repair. Presenter: Artem Kornilov, Engineering Manager, Mentor Graphics	Systems Engineering
Tool Qualification using DO-178C and DO-330: A Case Study Abstract TECHNICAL SESSION It is impossible to verify a design by testing every timing corner condition, or to find all unintentional interactions in a network within the timeframe of a typical project. And yet, the DO-178 certification standard demands the highest level of rigor to ensure aircraft safety. Having a tool that can perform complete verification of a complex network system in minutes, and be able to obtain certification credit for that verification, can result in huge savings during development and certification. DO-178C introduced DO-330, Software Tool Qualification Considerations, as well as Tool Qualification Levels (TQL) 1 through 5. Marty Gasiorowski worked with Mentor Graphics in 2012 to meet the objectives of DO-330 for Volcano AeroQ , a TQL-5 tool. This was one of the first, if not the first, project to use DO-178C and DO-330. Volcano AeroQ analyzes communication design in different aspects, such as utilization, queue delays, jitter, etc. The output of such analysis can be used to optimize communication to improve overall system performance. The output of the tool is a verification artifact that serves as credit towards certification of the communication design. If verification fails, the generated report clearly describes the errors found and guides the user on how to correct these. This presentation introduces Volcano AeroQ, a qualified communication verification and analysis tool for multi-protocol airborne network systems. It summarizes the processes used in the certification efforts and the key differences compared to DO-178B Verification Tool Qualification. Presenter: Marty Gasiorowski, FAA DER and President, Worldwide Certification Services Worldwide Certification Services' President, Marty Gasiorowski, has more than 25 years of experience on certification programs with FAA, EASA, and other certification authorities worldwide. He is a Systems, Safety, Electronic Hardware and Software DER, and has worked with the Certification Authorities to define IMA certification approaches. He was the United States Chairman of the Document Integration Team that generated DO-178C and associated supplements, was a member of the committees that generated DO-178B and ARP-4754, and has led a certification organization with more than 120 employees. Presenter: Michael Chen, Early Stage Programs Business Unit Director, Mentor Graphics	System Modeling and Analysis
Addressing Challenges with PCB Data Management Abstract TECHNICAL SESSION The design of complex PCB systems requires the coordinated efforts of extended design teams as well as leveraging the intellectual property of the company such as component libraries and re-usable designs. This requires data management infrastructure that is specifically tuned to the PCB design process, as well as a collaboration protocol between the design team and the supporting corporate infrastructure. This session will illustrate Mentor's successful capabilities in this area.	PCB Systems Design and Mechanical Analysis Track
Static Formal Verification Methods and their application to safety critical and military designs Abstract TECHNICAL SESSION Today's complex electronic designs contain many behaviors that are difficult or even impossible to fully verify using conventional simulation-based verification techniques (For example, complex control logic, error recovery circuitry, Single Event Upset detection and correction logic, internal storage elements such as FIFOs, and many others). Verifying these types of design behaviors using simulation can lead to extremely long (and expensive) design verification tasks. Furthermore, even after "completing" the verification task, the design in question might not behave properly under all circumstances. It's common knowledge that bugs left in any design can be problematic, but for certain types and classes of designs, design errors are simply intolerable, especially if they are contained in satellites (where repair is intractable), safety critical designs (where bugs could cause injury or death), or military designs (where errors could place our military personnel or innocent bystanders in mortal peril). Luckily, there are alternative approaches that can be used to verify design correctness that are significantly faster and more thorough than traditional simulation-based verification. One such technique is Static Formal Verification (also known as "Model Checking"). Static Formal Verification is a technique that utilizes a mathematical analysis of the synthesizable digital design, and creates an unequivocal proof that the design behavior in question is, indeed, 100% correct – or it will prove that the design is NOT correct (i.e. It contains a bug), and will provide a waveform trace demonstrating the failure. This analysis is exhaustive, covering all input conditions across all time. When a design MUST be correct, and extremely thorough or exhaustive verification is needed, then Static Formal Verification is obviously a good technology to have in your tool belt. Static Formal Verification has a very strong pedigree. Many companies have used it for more than 15 years, and its popularity is growing rapidly thanks to IEEE design and verification standards. This presentation will discuss the use of Static Formal Verification, what it is and how it works, as well as the types of design behaviors where it is most and least effective. It will also discuss limitations and caveats, and provide links to papers and presentations containing more detailed information. Presenter: David Landoll, Engineered Solutions Group, Mentor Graphics	Hardware Development

4:30 PM - 5:05 PM 1 sessions

An unusual case study: Wire Harnessing on Mars and Curiosity's Rover Mission!

Presenter: Alex Jimenez, Spacecraft Mechanical Engineering, Jet Propulsion Laboratory
Presenter: Angel Garnica, Spacecraft Mechanical Engineering, Jet Propulsion Laboratory

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