IESF Focus: PCB System Design
Thursday, June 14, 2012, 7:30AM to 7:00PM, Dearborn, MI
Come see PCB System Design tools in action at IESF
IESF 2012 will feature many sessions dealing with PCB systems design challenges and solutions for the automotive industry; the PCB System Design track will start with two guest sessions.
Now in its 12th year, the Integrated Electrical Solutions Forum (IESF) will deliver more than 40 information-packed sessions addressing design challenges and solutions in the automotive, truck, off-highway and military vehicle industries. Attend FREE by registering now!
PCB System Design track at IESF 2012
Minimize Your PCB Iterations Using Simulation and Analysis
Presented By: Keith A. Van Liere, PCB Engineering Manager, Johnson Controls - Automotive Systems Group and Tom Olson, Engineering Manager of Analysis, Modeling and Simulation, Johnson Controls, Inc.
You will learn how to utilize your available analysis tools and methods to the maximum benefit during initial product layout in ways to eliminate costly re-spins. Input to PAL is included from EMC, Signal Integrity and Timing, and Thermal disciplines. The actual PAL design cycle typically takes longer than traditional methods, but it produces the desired results more quickly, thereby reducing the number of downstream design iterations, the overall time to market and the overall design and development costs.
Managing Expedition libraries in a global enterprise
Presented By: Rollie Copp, Mark Baker, and Roukoz Atallah, Delphi
|12:50PM - 1:25PM|| |
Addressing implementation complexity in automotive electronics systems
|1:30PM - 2:05PM|| |
Managing data for automotive electronics systems development in the enterprise
|Mentor Graphics' PCB System Design product demonstrations|
Time: 7:30AM to 7:00PM
Demonstrations will include the entire system design flow, from system design definition and concurrent board design methodologies, through signal and power integrity, EMI analysis, library and data management solutions, through to the Valor tool suite for accelerating New Product Introduction.