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IESF: Electronic Thermal Design & Measurement

Learn more about the latest tools and innovations for Automotive Electronic Thermal Design & Measurement at IESF 2013 - Dearborn, MI, USA - September 19th, 2013. Highlights include dedicated breakout track, case studies and solution demonstrations. Topics covered include Trends and Challenges, Automotive LED Lighting, Battery Pack Thermal Design, Electronics Cooling Simulation, and Enhancing Automotive Electronics Thermal Design Productivity.

F = Full registration required

General
  • Automotive LED Lighting - Implementing Test Data from Thermal & Photometric/Radiometric Measurement for Enhanced Installed Performance Prediction
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    TECHNICAL SESSION LED lighting continues to grow share in automotive sector in external lighting applications beyond premium brands. Designers considering thermal factors during headlight design must take into account complex housing designs to meet consumer driven styling demands, while meeting safety standards for field of view and visibility, alongside pure reliability and strict cost requirements from manufacturing.
    This presentation reviews LED thermal behavior and direct influence on light output performance. The focus of the presentation will be full LED thermal and radiometric/photometric characterization – from measurement standards (incl. JEDEC JESD51), equipment, through to understanding data and using it in wider engineering workflows to enhance product quality. This will include characterization at the LED component level for selection purposes through to using test data in virtual CFD simulations to accurately predict luminaire installed performance more effectively.

Presenter: Joe Proulx, Consultant Engineer, Mechanical Analysis, Mentor Graphics
  • Enhancing Automotive Electronics Thermal Design Productivity – Rapid Model Creation & Bridging the Gap between EDA and MCAD Design Flows
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    TECHNICAL SESSION In automotive electronics cooling applications, as elsewhere, PCB power density is steadily increasing and there are often requirements for complex and compact geometric enclosures compounding thermal management challenges driven by the need to meet vehicle design driven packaging and installation requirements. These add to demands on thermal designers for faster lead times or simply to perform more virtual testing of different design iterations in the time available to improve quality and reliability.

    Taking an automotive engine control unit as an example thermal design project, this presentation shows how FloTHERM XT software can be applied to realize significant workflow and simulation productivity gains. There are advantages in this step change approach to electronics cooling by incorporating both EDA design data earlier and also mechanical design flows in this CAD centric tool suitable for creating and modifying designs for analysis from concept to verification. Capabilities presented via the example will include: direct rapid model building, importing CAD assembly files and using FloTHERM XTs automated meshing technology and simulation set up guides - to quickly and accurately simulate designs with complex shaped components or novel enclosures.

Presenter: John Wilson, Application Engineering Manager, Mechanical Analysis, Mentor Graphics
  • Selecting the Right Thermal Interface Material (TIM) for Electronics Packages based on Accurate Thermal Measurement Data
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    TECHNICAL SESSION Thermal Interface Materials (TIMs) are used to establish good thermal contact between mating surfaces in an IC package. With ever increasing power density, especially in power electronics packages, it is important to dissipate heat as efficiently as possible. Heat transfer depends on the conductivity of the package and the influence of the thermal resistance of the interface material and contact resistances. In understanding the heat flow path, accurate thermal property information is key in selecting TIMs appropriately for successful thermal design.

    Aimed at those selecting TIM materials, this presentation reviews TIM material types (incl. greases, phase change materials, gap pads, gap fillers, solids, and prepared adhesives) alongside typical measurement techniques used for thermal characterization and how to interpret this data. A particular focus will be on transient thermal measurement using controlled environment, precision testing, to determine changes in thermal resistance for TIM thicknesses down to 1 micrometer.

Presenter: John Wilson, Application Engineering Manager, Mechanical Analysis, Mentor Graphics
  • Validating Compact Thermal Models for Improved Electronics Cooling Simulation Accuracy using Thermal Measurement Techniques
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    TECHNICAL SESSION To enhance electronics cooling simulation accuracy when modeling components in enclosures, engineers often rely on a compact thermal models - detailed numerical model of the package, that represent the internal construction of the package. This requires material properties and geometric sizes to be accurately specified in whatever model type is selected. Using thermal measurement, experimentally determined structure functions can be used to provide insights into the thermal resistances and capacitances encountered as heat travels from a die through and beyond an IC package.

    By comparing a structure function derived from the simulation model with experimental testing discrepancies in thermal resistances and capacitances values in the numerical compact thermal model can be adjusted to create a validated compact thermal model. This presentation will review compact thermal models and how to create calibrated numerical package model for use in improved accurate simulation using tools like FloTHERM.

Presenter: Joe Proulx, Consultant Engineer, Mechanical Analysis, Mentor Graphics
Guest Speakers
  • Detailed PCB Design for Thermal Management of an Instrument Cluster
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    TECHNICAL SESSION In an automotive instrument cluster design, where enclosure shape and internal complexity significantly influences thermal management considerations, engineers focus their attention on areas such as PCB structure/layout and active display dimming to ensure durable performance. Efficient exchange of data between the PCB layout, the Mechanical and Thermal analysis tools therefore becomes key in designing such systems.

    In this presentation, Sam Gustafson, a Thermal Analyst at Johnson Controls, will discuss the importance of the thermal requirements and their influence on the PCB and mechanical design of a cluster. In particular, Sam will show how PCB data from Mentor Expedition software can be embedded inside a FloTHERM XT simulation model to investigate the full thermal behavior of the instrument cluster and optimize it.

Presenter: Sam Gustafson, Thermal Analyst, Johnson Controls Inc
  • Product Engineering Insight – Thermal Design Approaches at Delphi
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    TECHNICAL SESSION Arvind Krishna provides insight into thermal design processes within product engineering at Delphi including the use of simulation and measurement tools. Of particular focus will be how overall processes have been developed for early thermal design during project quotation phases resulting in more successful wins.

    The presentation will include topics:

    • Thermal analysis in development: Conceptual design and technical acceptance through to refinement and verification for high-volume production
    • Aligning technical capability roadmaps with Product roadmaps – for continuous improvement and competitive product development
    • Electronic component quality - where thermal measurement provides a method to verify performance within a system

Presenter: Arvind Krishna, Global Engineering Manager, Delphi