Sign In
Forgot Password?
Sign In | | Create Account

All IESF Events

Print This Schedule

Thursday, September 19

Thursday, September 19

7:30 AM - 8:30 AM  1 session

Solutions Expo Area
  • Registration & Continental Breakfast
All

8:30 AM - 8:35 AM  1 session

Main Session Room
  • Welcome and Overview of the Day
All

8:35 AM - 9:10 AM  1 session

Main Session Room
  • Using Innovation to Build a Long Term Future in a Rapid Changing Automotive Industry! A fine line between success and failure, for industry and professional
Presenter: Oliver Kuttner, Founder & Chief Executive Officer, Edison2
All

9:10 AM - 9:35 AM  1 session

Main Session Room
  • Industry Update: Electrical & Electronics 2013 Automotive Industry Trends & Observations
    Toggle Abstract

    KEYNOTE Paul Hansen, in his 6th appearance at IESF, will give his insights on the global automotive electronics industry. Paul Hansen writes and publishes The Hansen Report on automotive electronics, a newsletter dedicated to researching and identifying technology and business trends in the global automotive electronics industry. Mr. Hansen began writing The Hansen Report in 1988 as an outgrowth of his strategy and market research consulting business, Paul Hansen Associates. Over the past two decades, Mr. Hansen has provided consultation to carmakers, many of the world's leading auto electronics suppliers, and to those exploring industry investments.

Presenter: Paul Hansen, Editor, The Hansen Report
All

9:35 AM - 9:55 AM  1 session

Solutions Expo Area
  • Coffee & Solutions Expo
All

9:55 AM - 10:30 AM  5 sessions

Breakout Room
  • A New, No-Compromise Hardware Option that Will Meet Your Cost, Schedule & Risk Budgets
    Toggle Abstract

    GUEST SPEAKER Reducing carbon footprint, fitting more functionality in a limited space, improving reliability and safety, and meeting the local needs of global markets are increasing requirements in automotive hardware development projects. Meeting these increasing needs and simultaneously reducing cost seems almost impossible. A Via Configurable ASIC (VCA) can be an optimal solution to address these challenges. VCA technology integrates silicon-proven analog and digital resources onto pre-configured ASIC arrays requiring only a single via mask layer to customize the design and finalize the manufacturing process. VCAs offer a dramatically reduced-cost alternative to ASIC design, supporting both low volumes and fast development cycles.

    This session discusses and demonstrates how a systems or application engineer, with no IC design or modeling experience, can quickly develop and test their own custom mixed-signal integrated circuit. Instead of picking discrete and COTS parts from a catalog, the engineer can design a circuit interactively in a simple, schematic-based design environment, test it, and then have it quickly implemented in a VCA platform. The design environment (built on SystemVision from Mentor Graphics) also supports multi-discipline system development and verfication of the chip in the context of its resident system.

Presenter: Reid Wender, Vice President of Marketing & Technical Sales, Triad Semiconductor
Products: SystemVision
System Modeling & Analysis
Breakout Room
  • The Challenges of Designing Electrical Systems for Really Big Zero Emission Vehicles
    Toggle Abstract

    GUEST SPEAKER Mr. Fowlkes will describe the challenges in designing an electric passenger bus capable of fully recharging in less than 10 minutes.

Presenter: Adam Fowlkes, Electrical Engineering Manager, Proterra Inc.
Hybrid Electric Vehicle
Breakout Room
  • Bringing Best-in-Industry Capability to our Engineers to Free them to Innovate
    Toggle Abstract

    GUEST SPEAKER This presentation will show an example of how Raytheon is integrating tools and processes to enable Electrical Systems engineers to achieve affordability, speed, and flawless execution. Engineers are in constant pressure to meet aggressive program schedule/targets while having to negotiate design decisions with thousands of design defect possibilities. They need help! Management must provide tools and processes to help them be effective by freeing them from transactional tasks, allowing them to innovate.

Presenter: Aaron Shin, Senior Director of Transition to Production, Raytheon
PCB Systems Design
Breakout Room
  • Multi-Domain Simulation for Advanced Alternator Control
    Toggle Abstract

    GUEST SPEAKER In today’s automotive electronics, the study of systems is linked to disparate physical domains that must interact with each other. For vehicles in particular, the electrical system is a multi-domain design comprised mainly of an alternator and battery connected to multiple loads.

    Valeo uses multi-domain simulation to design alternator control, combining digital and analog electronics with the thermal and mechanical domains in a single simulation. This is achieved using the VHDL-AMS modeling language, which is an IEEE standard for modeling mixed-signal and multi-domain systems. This session introduces the design of a regulation loop, complete with adapted correctors, for an alternator regulator, and shows the advantages of mixed-signal, multi-domain simulation prior to prototype development. In particular, the design focuses on system stability. Finally, the presentation concludes with a discussion on multi-domain simulation.

Presenter: Pierre Chassard, Electronics Senior Expert, Valeo Engine and Electrical Systems
Products: General
System Modeling & Analysis
Breakout Room
  • Variation Abstraction in System Engineering of Large Scale Embedded Systems
    Toggle Abstract

    GUEST SPEAKER Creating, maintaining and using a large scale embedded systems product line requires conscious and careful management of variation. The sources and impacts of variation follow predictable patterns and can be effectively managed with a set of methods. This presentation will introduce the sources, methods and tool needs to effectively manage this problem space.

Presenter: Len Wozniak, Electrical, Controls and Software Process and Tool Systems Architect, General Motors
Products: ESD
Embedded - IVI & GENIVI

10:35 AM - 11:10 AM  5 sessions

Breakout Room
  • Design of Reliable Electronic Systems and Efficient Design Documentation Within the PCB Design Process
    Toggle Abstract

    GUEST SPEAKER Functional Safety Process (ISO 26262) for designing and documenting safety related products is required by European Automotive producers. DFMEA is an important part of the Functional Safety process and is a required design process by all automotive producers. The PCB schematic can become the primary source for system definition and structure, and directly drive a highly automated DFMEA creation process for a component level DFMEA through a 3rd party tool. This component level DFMEA can then be merged with a system level DFMEA in existing commercially available tools. This information can also be imported into a Functional Safety analysis tool to facilitate the calculation of the Functional Safety Metrics. This session will highlight Delphi’s implementation of a functional safety process leveraging Expedition Enterprise and DfR Solutions Sherlock Design Assistant.

Presenter: Michael Varnau, Manager - Electrical Simulation and Magnetics Design; Power Electronics, Delphi
PCB Systems Design
Breakout Room
  • I’m Not an Auto Guy; I’m a Software Guy and I Work at Ford
    Toggle Abstract

    GUEST SPEAKER The automotive industry’s first-ever open developer program. Contributing their award-winning smart device / vehicle linking technology to open source. Ford Motor Company is a living example of David Kirkpatrick’s adage that “every company is a software company.” Join John Ellis as he shares the transformation under way at Ford Motor Company and how this is helping Ford “Go Further.”

Presenter: John Ellis, Global Technologist, Connected Services, Ford Motor Company
All
Breakout Room
  • Accelerating EV Technology Development Through Motorsport
    Toggle Abstract

    GUEST SPEAKER Formula E, the first FIA EV world championship commences in 2014 and will provide a platform for accelerated development of EV technologies as well as raising the profile and appeal of EVs worldwide. In this talk, Angus Lyon, from Drayson Racing Technologies will explain how motorsport and a motorsport approach to engineering can speed up development of technologies to the benefit of the automotive industry. Giving examples from their own projects including the fully electric LMP race car the ‘B12’ Angus will show how electric racing and its contribution to the greater development of EVs is becoming a reality.

Presenter: Angus Lyon, Chief Engineer, Electric Drivetrain, Drayson Racing Technologies
Hybrid Electric Vehicle
Breakout Room
  • Importance of Systems Engineering for Aston Martin
    Toggle Abstract

    GUEST SPEAKER Alan Bennett will describe the Aston Martin approach to engineering low volume, high luxury sports cars. Using examples from the recently launched Vanquish and the One-77 hyper car, he will highlight some of the challenges faced and how operating at a system level allows efficient delivery of complex networks with limited resources.

Presenter: Alan Bennett, Chief Engineer, Aston Martin
Systems Eng.
Breakout Room
  • AUTOSAR Driving Design Discontinuities
    Toggle Abstract

    GUEST SPEAKER While the dramatic increase in automotive software content is forcing associated costs to rise, AUTOSAR is completely transforming the automotive business models and design processes across OEMs and Tier companies. AUTOSAR introduces market disruption and verification discontinuities in the early adoption phases, but simulation and requirements tracking are two verification methodologies that can help drive and facilitate AUTOSAR adoption, enabling companies to leverage the entire scale of the AUTOSAR vision in the long term. We will present an outlook for AUTOSAR simulation to address faster, more efficient software and ECU network validation and optimization, IVI integration and Safety requirements, and requirements tracing through software and hardware.

Presenter: Shabtay Matalon, ESL Market Development Manager, Mentor Graphics
Products: ReqTracer
Network Dsgn & Integration & AUTOSAR

11:15 AM - 11:50 AM  5 sessions

Breakout Room
  • Connected & Electrified Vehicle - New Role for Standards
    Toggle Abstract

    GUEST SPEAKER This presentation will initially concentrate on a brief historical review of SAE International's standards program, with primary emphasis on SAE's current vehicle standards development activities. The new era of mobility and the forces behind it including converging technologies and today’s move toward “green” will be discussed. The technology enablers for vehicle electrification and vehicle connectivity, including the global landscape for EV and intelligent transportation standards, will be examined. Additionally, an overview of SAE global EV Battery Standards and activities, including industry/government collaborative efforts to develop lithium ion rechargeable energy storage system safety standards, will be provided. A look at why a collaborative approach to today’s technologies, as well as standards’ development, is essential to success will conclude the presentation.

Presenter: Jack Pokrzywa, Director, Ground Vehicle Standards, SAE International
Hybrid Electric Vehicle
Breakout Room
  • New Test Solutions for High Quality Automotive Devices
    Toggle Abstract

    GUEST SPEAKER The growing amount of electronics within today’s automobiles is driving very high quality and reliability requirements to a widening range of semiconductor devices. Improvements in test solutions are needed not only to maintain very high quality levels in more advanced technology nodes but to also address increasing reliability requirements such as defined within the ISO 26262 standard. New test approaches to be described will include a new hybrid ATPG compression and logic BIST solution that provides more efficient defect coverage together with the ability to apply tests within the system for long-term reliability. This hybrid solution also supports a new cell-aware test generation approach that has been shown to significantly reduce DPM levels in shipped devices.

Presenter: Steve Pateras, Product Marketing Director, Silicon Test Solutions, Mentor Graphics
All
Breakout Room
  • AUTOSAR – Updates, Challenges and Experiences
    Toggle Abstract

    GUEST SPEAKER AUTOSAR (AUTomotive Open System ARchitecture) is an open and standardized automotive software architecture, jointly developed by automobile manufacturers, suppliers and tool developers. Robert Rimkus from General Motors as a member of the AUTOSAR Steering Committee will provide an update on the AUTOSAR standard, adoption and the challenges moving forward. He will also share with us some experiences of AUTOSAR system engineering activities from a General Motors perspective.

Presenter: Robert Rimkus, Engineering Group Manager for Software Architecture, General Motors
Network Dsgn & Integration & AUTOSAR
Breakout Room
  • Vehicle Software & Electrical Management: Process, Methods, Tools and Infrastructure - The Ford Experience
Presenter: Christopher Davey, Senior Technical Leader, Software and Control Systems Engineering, Ford Motor Company
All
Breakout Room
  • Is that Your Customer?
    Toggle Abstract

    GUEST SPEAKER IBM's latest findings from Automotive Executives and 4,000 other C-Suite level execs.

Presenter: Karen Newman, VP, Americans Automotive Industry, IBM
All

11:55 AM - 12:30 PM  6 sessions

Breakout Room
  • Systems Engineering at the Platform Level
    Toggle Abstract

    TECHNICAL SESSION Today’s cars can be described as the most complex consumer electronics products available. But the distributed nature of vehicle architectures means nothing works without the electrical system that interconnects components within the context of the overall platform. This presentation explores how Mentor's Capital software models platform connectivity across abstractions. It shows how new technology allows companies to understand the impact of and respond to changes across multiple engineering disciplines. As the challenges and technical solutions are described, so the value of this innovative and compelling capability becomes clear.

Presenter: Martin O'Brien, General Manager, Integrated Electrical Systems, Mentor Graphics
Products: Capital
Electrical Dist. Systems Dsgn, Wire Harness Eng., Systems Eng.
Breakout Room
  • Reducing Time to Market using Model Driven Development for Design, Verification & Test
    Toggle Abstract

    TECHNICAL SESSION This presentation will show how Model Driven Development can address common challenges in the system design, verification, and testing of complex systems and systems of systems. Project success requires that hardware, software, and test teams fluently integrate application software, controlling firmware, analog and digital hardware, and mechanical components. Successfully integrating and verifying such a complex multi-disciplinary system often proves to be costly in terms of time, money, and engineering resources. This presentation covers the Model Driven Development of a virtual prototype that supports system engineering teams along with software, digital hardware, analog hardware, system interconnect algorithm development, hardware/software co-simulation, and virtual system integration using a tools flow emphasizing requirements tracing, UML/SysML system modeling, and linking to functionality FPGA, IC, and PCB domains.

Presenter: Bill Chown, Marketing Manager, System Level Engineering, Mentor Graphics
Products: SystemVision,BridgePoint,SystemVision conneXion, Context
System Modeling & Analysis
Breakout Room
  • Learning from Experience: The Worldwide Adoption of AUTOSAR 4.0.3
    Toggle Abstract

    TECHNICAL SESSION BMW, GM, and Volvo are currently deploying AUTOSAR in their production automotive projects. Mentor Graphics has gained significant experience working alongside these OEMs. In this session, attendees will learn how OEMs deploy the AUTOSAR 4.0.3 specification, how OEMs develop ECUs in AUTOSAR 4.0.3, and how automotive OEMs process their software design on a particular platform. Attendees will also see the common problems that arise when working with AUTOSAR, the advantages and disadvantages to certain approaches, and how many of the challenges were eventually solved.

Presenter: Hans-Juergen Mantsch, Technical Marketing Manager, Embedded Systems, Mentor Graphics
Products: AUTOSAR
Network Dsgn & Integration & AUTOSAR
Breakout Room
  • Enhancing Automotive Electronics Thermal Design Productivity – Rapid Model Creation & Bridging the Gap between EDA and MCAD Design Flows
    Toggle Abstract

    TECHNICAL SESSION In automotive electronics cooling applications, as elsewhere, PCB power density is steadily increasing and there are often requirements for complex and compact geometric enclosures compounding thermal management challenges driven by the need to meet vehicle design driven packaging and installation requirements. These add to demands on thermal designers for faster lead times or simply to perform more virtual testing of different design iterations in the time available to improve quality and reliability.

    Taking an automotive engine control unit as an example thermal design project, this presentation shows how FloTHERM XT software can be applied to realize significant workflow and simulation productivity gains. There are advantages in this step change approach to electronics cooling by incorporating both EDA design data earlier and also mechanical design flows in this CAD centric tool suitable for creating and modifying designs for analysis from concept to verification. Capabilities presented via the example will include: direct rapid model building, importing CAD assembly files and using FloTHERM XTs automated meshing technology and simulation set up guides - to quickly and accurately simulate designs with complex shaped components or novel enclosures.

Presenter: John Wilson, Application Engineering Manager, Mechanical Analysis, Mentor Graphics
Products: FLoTHERM XT, FloTHERM
Electronic Thermal Dsgn & Measurement
Breakout Room
  • Solutions for System-Level Design Challenges    
    Toggle Abstract

    TECHNICAL SESSION The industry is facing key challenges in the areas of accelerating design complexity, changing workforce demographics, and systems-aware engineering. The next generation of PCB systems technology must evolve to support cross-domain expertise requirements and increased team collaboration. This session will discuss Mentor’s key technology investments to address the challenges our customers are facing.

Presenter: Joe Krolla, Market Development Manager, Board Systems, Mentor Graphics
Products: Expedition
PCB Systems Design
Breakout Room
  • In-Vehicle Infotainment: Multimedia and Connectivity
    Toggle Abstract

    TECHNICAL SESSION Jungo Connectivity's MediaCore is the market leading multimedia player middleware for In-Vehicle Infotainment systems. Jungo Connectivity and Mentor Embedded have partnered around MediaCore and Mentor's Automotive Technology Platform, in order to bring customers the best of both worlds. MediaCore middleware is already on the road in over 50 different vehicle models with many more under development. This session will focus on the recent trends in IVI multimedia systems, the major challenges that the industry faces, and how Jungo's MediaCore solves many of these issues. Some particular items that will be discussed include:
    • OS considerations in a multimedia perspective
    • Leveraging the most out of Apple, Android and other mobile media-sources
    • System upgradability. Why is it needed and how can it be done?
    • Apps in the car

Presenter: Nir Hasson, Worldwide Sales Manager, Jungo
Products: Embedded Software
Embedded - IVI & GENIVI

12:30 PM - 1:30 PM  1 session

Solutions Expo Area
  • Lunch & Solutions Expo
All

1:30 PM - 2:05 PM  9 sessions

Breakout Room
  • Delivering Requirements Traceability & Impact Analysis
    Toggle Abstract

    TECHNICAL SESSION As emerging standards such as ISO 26262 become important, so organizations must be able to demonstrate the robustness of their design processes. This session presents new integrations between Capital and IBM's Rational tools to achieve exactly this. Requirements captured in Rational DOORS can be natively surfaced within Capital, allowing designers to understand the context of their work better and giving project managers visibility of impacted objects when requirements change. Together with project task and test case management, this provides a robust environment that simplifies demonstration of compliance while minimizing ongoing IT costs.

Presenter: Glenn Reynholds, Engineering Manager, Integrated Electrical Systems, Mentor Graphics
Products: Capital
Electrical Dist. Systems Dsgn
Breakout Room
  • What Will Save Us from Electrical Configuration Complexity? (part one)
    Toggle Abstract

    TECHNICAL SESSION Massive configuration complexity caused by global platforms and customer choice has become an acute pain point in electrical systems & wire harness design. This session examines the multiple areas impacted by configuration complexity, from design change management to obsolescence costs to vehicle documentation & service. The set of technology solutions embedded within Mentor's Capital tools that address this complex problem is described, and interesting reference is also made to paradigms for managing configuration complexity.

Presenter: Sjon Moore, Technical Marketing Engineer, Integrated Electrical Systems, Mentor Graphics
Products: Capital
Wire Harness Eng.
Breakout Room
  • Shifting Out of Neutral: Driving Efficiency to Advance Product and Systems Development
    Toggle Abstract

    TECHNICAL SESSION In today's complex automotive industry, there are no speed limits. Automotive OEM's and suppliers are facing an increasing number of business and technical challenges such as exponential increase in product complexity arising from increased software and multidisciplinary content, customer demand for intelligent and green vehicles, increased regulation, and collaboration amongst globally distributed supply chains. The key to meeting these challenges is an integrated approach to engineering -- with automation, best practices and world-class tools breaking down barriers between engineering disciplines and enabling collaboration and efficiency in the engineering process across the supply chain.

    IBM offers a fully integrated tool suite, the Rational solution for automotive engineering, to address these challenges. The solution offers the ability to manage a complex web of requirements, design, code, defects and issues, and test artifacts. At the same time it helps teams manage risk and program governance requirements, with certification support for ISO-26262. IBM offers a fully integrated tool suite, the Rational solution for automotive engineering, to address these challenges. The solution offers the ability to manage a complex web of requirements, design, code, defects and issues, and test artifacts. At the same time it helps teams manage risk and program governance requirements, with certification support for ISO-26262.

    The lifecycle aspects which were previously managed on one-way streets using, at best, inter-product hand-offs, making multidisciplinary collaboration and efficient development impossible, is now enabled through a integrated, open approach to managing all aspects of complex systems development--an approach that offers a significant increase in systems development effectiveness. In this session learn about fundamental principles that drive evolution of Rational Solution for automotive engineering and how it can bring efficiency to your engineering processes.

Presenter: Greg Gorman, Program Director, WW Systems Solutions & Industries, Rational, IBM
Products: Capital, Context, AUTOSAR
Systems Eng.
Breakout Room
  • Tackling Your Mechatronic System Design Challenges
    Toggle Abstract

    TECHNICAL SESSION If you design automotive systems, you no doubt deal with mechatronic elements at some point in your design cycle. Mechatronic technologies make possible many advances in modern automotive systems design. Historically non-electrical systems are being improved using combinations of sensors, actuators, electronics, and software. The benefits are tangible and measurable: better performance, higher reliability, and a safer ride. Mechatronic systems enable features and functionality that, until recently, design teams could only wish for. But designing a system that takes full advantage of mechatronic technologies is beyond the repeated “design > prototype > test” cycles of typical design processes. Getting a mechatronic system from specification to implementation within ever-shrinking market windows requires a shift in development methodology, where lab-based design and troubleshooting are shifted to the virtual world of modeling and simulation. Design teams need tools and techniques that assemble multiple mechatronic system disciplines into a single design and analysis environment.

    This session presents an innovative mechatronic system integration capability featuring SystemVision, Mentor Graphics’ solution for complex mechatronic system development. You will learn how SystemVision uses standards-based modeling, and advanced simulation and analysis capabilities, to help automotive design teams combine mechatronic system elements into a single, comprehensive modeling and analysis environment. Join us to see how SystemVision's standards-based modeling, and advanced simulation and analysis capabilities, can help you tackle your mechatronic system design challenges.

Presenter: Mike Jensen, Product Marketing Engineer, System Level Engineering, Mentor Graphics
Products: SystemVision
System Modeling & Analysis
Breakout Room
  • Incorporating Android into Infotainment (IVI) Systems
    Toggle Abstract

    TECHNICAL SESSION Android has successfully been deployed in production infotainment (IVI) systems as the primary operating system and also in conjunction with another operating system. Learn about the market needs driving the adoption of Android and the technical options for incorporating Android into an IVI system.

Presenter: Andrew Patterson, Director of Business Development, Embedded Systems, Mentor Graphics
Products: Inflexion UI
Embedded - IVI & GENIVI
Breakout Room
  • Advanced EDS Design Tools Helping to Answer Tomorrow's Demand for Fully Electric Vehicles
    Toggle Abstract

    TECHNICAL SESSION Electric and hybrid vehicles pose design challenges beyond those of conventionally powered vehicles. Technical challenges include modelling battery charge / discharge cycles, critical safety-related issues, and managing electromagnetic effects. This presentation describes these challenges and shows how modern electrical system design software can help address them.

Presenter: Nigel Hughes, Technical Director, Integrated Electrical Systems, Mentor Graphics
Products: Capital
Hybrid Electric Vehicle
Breakout Room
  • ISO 26262 and AUTOSAR - Achieving a New Level in Vehicle Safety
    Toggle Abstract

    TECHNICAL SESSION As the number of complex safety related electronic/electrical systems in today’s automobiles continue to grow hazardous events due to incorrect behavior in these systems will have to be prevented or properly mitigated. Standards such as ISO 26262 and AUTOSAR strive to reduce the risk of hazardous events and ensure the integrity of these systems by use of appropriate development processes and safety mechanisms within the architectural design.
    In this session we discuss ISO 26262-compliant development of safety related ECUs using AUTOSAR Basic Software (BSW). The discussion will focus on tier-1 and tier-2 responsibilities and development processes to fulfill ISO 26262 with regards to distributed development, the target ASIL, and integration of the BSW Safety Element out of Context (SEooC).
    To conclude this session we will describe some of the obstacles an AUTOSAR 4.0.x ECU project may encounter in terms of complying with ISO 26262, and at the same time give our advice on how to avoid or handle these.

Presenter: Kristoffer Karlsson, Mentor Graphics
Presenter: Mathias Fritzon, Product Line Manager, Mecel AB
Products: AUTOSAR
Network Dsgn & Integration & AUTOSAR
Breakout Room
  • Design Methodology for HW Realization:   The Impact of ECAD/ECAE Integration
    Toggle Abstract

    TECHNICAL SESSION The electrical hardware design development is an increasingly complex and fast exercise. While having to ensure that design requirements and delivery schedules are met, PCB engineers must conform to corporate processes and standards. Additionally, engineering tasks do not occur as expected; for example one major challenge is that the schematic reaches the layout (ECAD) before the critical simulation, modeling and analysis work (ECAE) is completed. To alleviate these obstacles, Delphi Electronics and Safety implemented a design methodology with a high level of integration and automation. In this session, we will highlight this methodology.

Presenter: Roukoz Atallah, Electrical Analysis and Hardware Engineering Processes and Tools Manager, Delphi
Products: Expedition
PCB Systems Design
Breakout Room
  • Product Engineering Insight – Thermal Design Approaches at Delphi
    Toggle Abstract

    TECHNICAL SESSION Arvind Krishna provides insight into thermal design processes within product engineering at Delphi including the use of simulation and measurement tools. Of particular focus will be how overall processes have been developed for early thermal design during project quotation phases resulting in more successful wins.

    The presentation will include topics:

    • Thermal analysis in development: Conceptual design and technical acceptance through to refinement and verification for high-volume production
    • Aligning technical capability roadmaps with Product roadmaps – for continuous improvement and competitive product development
    • Electronic component quality - where thermal measurement provides a method to verify performance within a system

Presenter: Arvind Krishna, Global Engineering Manager, Delphi
Products: T3Ster
Electronic Thermal Dsgn & Measurement

2:10 PM - 2:45 PM  9 sessions

Breakout Room
  • Right Side Of The V: Compliance & Verification
    Toggle Abstract

    TECHNICAL SESSION Activities on the right side of the Systems V are not only technically challenging but also important from commercial and regulatory standpoints.  This session examines compliance and verification for the electrical systems domain. Technologies introduced address subjects such as sub-system integration, functional verification and emergent behavior, together with compliance versus requirements such as cost and safety contraints.  Taken together, these technologies make a key contribution towards a systems engineering approach to platform-level engineering.

Presenter: Glenn Reynholds, Engineering Manager, Integrated Electrical Systems, Mentor Graphics
Products: Capital
Electrical Dist. Systems Dsgn
Breakout Room
  • What Will Save Us from Electrical Configuration Complexity? (part two)
    Toggle Abstract

    TECHNICAL SESSION Two distinct approaches have evolved to limit the configuration complexity of individual harness families. In the first, decisions are made to give away components to reduce part number proliferation. The alternate process, termed customer specific harnesses or KSK, targets a zero give-away situation. This session presents software technologies that address the value of variety versus the cost of complexity to support both these approaches. The session also highlights some of the implications process choices have on subjects such as quotation management and splicing strategy.

Presenter: John Judkins, Product Line Director (HDM), Integrated Electrical Systems, Mentor Graphics
Products: Capital ModularXC
Wire Harness Eng.
Breakout Room
  • Getting Requirements Right with Model Based Functional Analysis
    Toggle Abstract

    TECHNICAL SESSION Requirements definition is a critical part of the development lifecycle, but it is common for system-level requirements to be inconsistent and incomplete. The Rational Solution for Systems and Software Engineering provides process guidance and tooling for Model Based Systems Engineering (MBSE), including system functional analysis. By visualizing requirements, engineers have a better understanding of intended behavior. The Rational solution does not replace traditional approaches, but instead applies modeling in a non-implementation way to refine and improve upon system requirements. The outcome is requirements that have been validated through model execution and the avoidance of costly specification errors.

Presenter: Greg Gorman, Program Director, WW Systems Solutions & Industries, Rational, IBM
Products: Capital, Context
Systems Eng.
Breakout Room
  • Linux-based Automotive Software: Some Unexpected Challenges, Some Interesting Solutions
    Toggle Abstract

    TECHNICAL SESSION Linux-based software is running on multiple vehicles on the road today, including Instrument Clusters and Infotainment systems. Many of the ""speed bumps" encountered along the way were predictable, and others were completely unexpected. Automotive alliances like GENIVI have first identified and then addressed many of these concerns while member companies like Mentor Graphics, the car companies themselves, and Tier One suppliers build differentiated commercial solutions. Explore the business issues and business-focused technical challenges around using Linux-based software in Automotive.

Presenter: John Lehmann, Sr. Marketing Manager & GENIVI Board Member, Embedded Systems, Mentor Graphics
Products: Embedded Linux
Embedded - IVI & GENIVI
Breakout Room
  • A Closer Look at AUTOSAR Design Automation
    Toggle Abstract

    TECHNICAL SESSION AUTOSAR 4.3.0 is now being deployed by many of the world’s top automotive OEMs. Unfortunately, many of the Tier 1 suppliers are struggling with AUTOSAR complexity. Significant effort is being spent on behalf of the OEMs in the design, migration, configuration, integration, generation, and in the final build of AUTOSAR-based systems. In order for the Tier 1 suppliers to participate, a fundamental change is required at the software and tools companies to abstract away the AUTOSAR standard. This presentation gives an overview of the current situation, possibilities, and future direction of abstracting AUTOSAR for design automation purposes.

Presenter: Armin Lichtblau, Business Development Manager, Embedded Systems, Mentor Graphics
Products: AUTOSAR
Network Dsgn & Integration & AUTOSAR
Breakout Room
  • In-vehicle Networking Simulation: Both Sides of the Story
    Toggle Abstract

    TECHNICAL SESSION Renault sees complex electrical architectures using multiple networks and different protocols, mainly CAN and LIN, as normal in modern automobiles. Simple rules for CAN network topology design were sufficient in the past; however, today they are not adequate for quick development cycles or for a high level of complexity. Today’s design engineer must consider how the increase of data exchange due to the increase in the number of electronic control units communicating with each other can be integrated into the electrical architecture in a timely and cost-efficient manner. Using simulation has become a “must have” for this purpose, one which Renault has integrated into its development process.

    Technical points that can be verified in an in-vehicle networking simulation are basically one of two types: 1) Electrical Signal Integrity for nominal cases (propagation time, rise-time measurement, ringing, etc.). This can be verified with automatically drawn topologies as long as the simulation models (e.g., the transceiver) are available and qualified. 2) EMC robustness (especially radiated immunity) of topologies, which requires a step forward, such as import of 3D models of the vehicle and the position of the CAN cable inside the car. The purpose of this presentation is to provide an overview of what Renault does in terms of in-vehicle networking simulation and the benefits of this kind of simulation.

Presenter: Vincent Bidault, Engineer, Embedded Network Specialist, Renault
Products: SystemVision
System Modeling & Analysis
Breakout Room
  • Battery Pack Thermal Design – Accessing CFD Results Earlier in Development to Understand Packaging Changes Influence on Cooling Capacity
    Toggle Abstract

    TECHNICAL SESSION As Battery Electric Vehicles and Plug-In Hybrid Electric Vehicles become more and more prevalent on the market, battery temperature control remains a major vehicle thermal management focuses. Controlling battery temperature is a key in a vehicle operating efficiency and battery life. Although not as high a cooling capacity as a liquid cooling system, lighter weight, more reliable, and less expensive passive air cooled system are often preferred choice in compact vehicles.

    This presentation introduces the value in performing cooling analysis using fully CAD Embedded Computational Fluid Dynamics (CFD) to allow earlier thermal performance prediction such as when deciding the battery packaging and intergrartion with the vehicle structure. A passive air-cooled battery pack system example is simulated, using FloEFD software in a major CAD environment, to quickly study the effects design changes have on cooling capacity in order to maintain proper mean temperature and appropriate temperature distribution.

Presenter: Andrew Hintz, Application Engineer, Mechanical Analysis, Mentor Graphics
Products: FloEFD
Hybrid Electric Vehicle
Breakout Room
  • Multi-Board Systems Design
    Toggle Abstract

    TECHNICAL SESSION Designing a complex system of multiple PCBs by a team of engineers demands a fully integrated set of tools all the way from system-level functional-block definition to partitioned PCBs. This session will introduce new technology that provides a single cockpit for all conceptual and logical system definitions, eliminating data re-entry errors and improving system performance.

Presenter: Rainer Asfalg, Product Line Director, Board Systems, Mentor Graphics
Products: SystemDesigner
PCB Systems Design
Breakout Room
  • Detailed PCB Design for Thermal Management of an Instrument Cluster
    Toggle Abstract

    TECHNICAL SESSION In an automotive instrument cluster design, where enclosure shape and internal complexity significantly influences thermal management considerations, engineers focus their attention on areas such as PCB structure/layout and active display dimming to ensure durable performance. Efficient exchange of data between the PCB layout, the Mechanical and Thermal analysis tools therefore becomes key in designing such systems.

    In this presentation, Sam Gustafson, a Thermal Analyst at Johnson Controls, will discuss the importance of the thermal requirements and their influence on the PCB and mechanical design of a cluster. In particular, Sam will show how PCB data from Mentor Expedition software can be embedded inside a FloTHERM XT simulation model to investigate the full thermal behavior of the instrument cluster and optimize it.

Presenter: Sam Gustafson, Thermal Analyst, Johnson Controls Inc
Products: FloTHERM XT, FloTHERM
Electronic Thermal Dsgn & Measurement

2:45 PM - 3:00 PM  1 session

Solutions Expo Area
  • Coffee & Solutions Expo
All

3:00 PM - 3:35 PM  9 sessions

Breakout Room
  • Multi Voltage Systems & Aluminum Conductors: Help Me Assess New Electrical Technologies!
    Toggle Abstract

    TECHNICAL SESSION The nature of vehicle electrical systems is changing rapidly. High power electrical systems are driving mixed voltages, and cost pressures are making conductor materials like aluminum an increasingly viable competitor to copper. The challenge of assessing the impact of these technologies on vehicle safety and of understanding cost/weight trade-offs is a critical activity. This session will discuss and demonstrate trade studies involving new vehicle technologies, show how impacts on system reliability can be assessed, and optimize wire sizes for both copper and aluminum at the platform level.

Presenter: Sjon Moore, Technical Marketing Engineer, Integrated Electrical Systems, Mentor Graphics
Products: Capital
Electrical Dist. Systems Dsgn
Breakout Room
  • Harness Manufacturing Cost Analysis for OEMs and Suppliers
    Toggle Abstract

    TECHNICAL SESSION Wire harnesses comprise a significant portion of overall EE system costs.  In the search for competitive advantage both OEMs and suppliers must be able to calculate harness manufacturing costs quickly, systematically, and accurately.  This session presents new software that intelligently combines harness design data with highly flexible manufacturing process models to create detailed cost calculations, while fully protecting intellectual property.  This provides a firm basis for sourcing decisions, both for OEMs assessing suppliers' bids and for suppliers seeking optimal operations patterns.

Presenter: John Judkins, Product Line Director (HDM), Integrated Electrical Systems, Mentor Graphics
Products: Capital
Wire Harness Eng.
Breakout Room
  • Strategic Reuse - A Fundamental Approach for Success in E/E Engineering
    Toggle Abstract

    TECHNICAL SESSION Many companies agree that reuse is key to increasing efficiencies. Standardization and open-source efforts such as GENIVI, OSEK, and AUTOSAR show that industry continues to pursue reuse at a middleware, framework, and industry level. However, achieving systematic reuse at functional and organizational level, where the potential gains are highest, still remains very challenging. A more comprehensive reuse strategy for EE would include a commitment to reuse at multiple architectural levels. We will explore business and technical challenges in instilling comprehensive reuse as well as a proposed maturity framework that can be adopted to measure and facilitate reuse.

Presenter: Ron Felice, Solution Architect for Real Time & Embedded Systems, IBM
Products: Embedded, AUTOSAR
Systems Eng.
Breakout Room
  • Model-based Design of Automotive Electrical Distribution Systems - Challenges & Solutions
    Toggle Abstract

    TECHNICAL SESSION Despite the cost of vehicle late repairs, or the cost of grounding aircraft, early analysis is rarely given a high priority. This presentation considers how simulation and analysis techniques can be applied in an electrical distribution system design flow. It will discuss critical model-based design elements such as early system simulation, advanced interpretive analysis such as DC, functional quantitative, and Failure Modes & Effects Analysis (FMEA). This presentation will explore how the designs, at various stages of maturity, can be analyzed, thereby enhancing product quality. This presentation will discuss current challenges in virtually prototyping an electrical distribution system. Solutions and techniques to address these challenges using various analysis and simulation tools will be discussed.

Presenter: Asaad Makki, Ford Motor Company
Presenter: Enrique Ortega, Transportation Business Director for North America, Mentor Graphics
Products: SystemVision
System Modeling & Analysis
Breakout Room
  • Achieving Faster Boot Time with Linux for Instrument Cluster and Infotainment Systems
    Toggle Abstract

    TECHNICAL SESSION Linux has been successfully deployed in automotive systems to achieve high performance IVI and cluster designs. One of the key requirements in these deployments is rapid system boot. This requirement can be accomplished by employing a variety of techniques to significantly reduce the time it takes to boot a Linux-based embedded system. Application examples of Linux in production vehicles will be explored, including instrument clusters, infotainment systems and the video feed from a rear-facing camera. Learn about the techniques necessary to deliver the responsiveness needed for automotive systems based on Linux.

Presenter: Chris Hallinan, Technical Marketing Engineer, Embedded Systems, Mentor Graphics
Products: Linux, Android
Embedded - IVI & GENIVI
Breakout Room
  • An Integrated Tools Environment for Modeling Integrated Powertrain Systems
    Toggle Abstract

    TECHNICAL SESSION When designing systems that include motors, power electronics,and/or sensors and controls (electronics and software), waiting to verify overall performance using a physical prototype is unacceptable. Finding problems late in the development process not only has cost and schedule impact, but debugging these complex designs with limited “system-level-only” visibility is difficult. Fortunately, virtual prototypes can be used to help make critical design decisions earlier in the design cycle, to size and integrate components from various disciplines, and to verify system performance prior to building any physical hardware.

    This presentation describes a modeling and simulation development environment that supports progressive refinement of system models, from abstract to high-fidelity. It demonstrates virtual integration of Permanent Magnet Synchronous and/or Induction Machines (PMSM or IM); digital, analog and power electronics; and plant mechanical dynamics (all modeled in SystemVision from Mentor Graphics), with embedded control software (modeled in Simulink® or C-code) and a complete system test program (modeled in LabVIEW™). In addition, it shows FEA-based design software being used to analyze a machine’s physical geometry and material properties, then automatically generating an accurate behavioral model that can be simulated in the system context. This model can help identify adverse interactions with the motor and the power electronics or sensor signal conditioning circuits. This approach helps engineers gain confidence in a design before committing to a specific implementation. Tool flows that then lead to physical implementations (e.g., PCB, cabling, mixed-signal ASICs, and embedded software) are also discussed.

Presenter: Mike Donnelly, Principal Engineer, System Level Engineering, Mentor Graphics
Products: SystemVision
Hybrid Electric Vehicle
Breakout Room
  • Developing ECUs Using the Latest AUTOSAR Standard
    Toggle Abstract

    TECHNICAL SESSION AUTOSAR 4.0 is still new on the market. For an ECU supplier the AUTOSAR way provides many new challenges and new tools are needed to be able to execute an AUTOSAR based project efficiently.
    Mecel is a development partner to Mentor Graphics for the AUTOSAR 4.x products, and also a System Integrator partner for Tier 1s in their AUTOSAR projects.
    In this session we will focus on how to make the efficiently introduce of AUTOSAR4.x as efficient as possible from an ECU supplier’s perspective. Attendees will be presented our experiences of different ECU supplier’s strategies in terms of system integration, configuration, testing, etc and how to use them to achieve efficient accomplish successful deliveries of AUTOSAR 4.x production projects.

Presenter: Rolf Hagstedt, Business Manager, Mecel AB
Products: AUTOSAR
Network Dsgn & Integration & AUTOSAR
Breakout Room
  • Automotive LED Lighting - Implementing Test Data from Thermal & Photometric/Radiometric Measurement for Enhanced Installed Performance Prediction
    Toggle Abstract

    TECHNICAL SESSION LED lighting continues to grow share in automotive sector in external lighting applications beyond premium brands. Designers considering thermal factors during headlight design must take into account complex housing designs to meet consumer driven styling demands, while meeting safety standards for field of view and visibility, alongside pure reliability and strict cost requirements from manufacturing.
    This presentation reviews LED thermal behavior and direct influence on light output performance. The focus of the presentation will be full LED thermal and radiometric/photometric characterization – from measurement standards (incl. JEDEC JESD51), equipment, through to understanding data and using it in wider engineering workflows to enhance product quality. This will include characterization at the LED component level for selection purposes through to using test data in virtual CFD simulations to accurately predict luminaire installed performance more effectively.

Presenter: Joe Proulx, Consultant Engineer, Mechanical Analysis, Mentor Graphics
Products: MicRed
Electronic Thermal Dsgn & Measurement
Breakout Room
  • The Impact of SI/PI Analysis in PCB designs for Automotive Applications
    Toggle Abstract

    TECHNICAL SESSION The need to design for signal (SI) and power (PI) integrity is becoming essential in automotive electronics as the use of high speed circuitry has been growing in areas such as infotainment, active safety and wireless applications. This presentation will highlight Delphi E&S implementation of an Expedition-HyperLynx SI/PI design capability that led to improved critical net design, component selection, PCB layout topologies, timing requirements, EMC, and layout constraint management.   

Presenter: George Jiang, Sr. Project Engineer, Delphi
Products: HyperLynx SI/PI
PCB Systems Design

3:40 PM - 4:15 PM  9 sessions

Breakout Room
  • The Next Step in Smart Documentation
    Toggle Abstract

    TECHNICAL SESSION Smart documentation is one of the most common requests from vehicle service technicians who know that diagnostic trouble codes do not always quickly and unambiguously identify vehicle faults. This session presents technology that not only automatically creates rich documentation, but also delivers a highly productive environment to the technicians, with capabilities such as vehicle-specific schematic generation and interactive signal tracing. The very latest developments in this area will be shown, including delivery to tablet devices for the ultimate in usability and portability.

Presenter: Steve Trythall, Mentor Graphics
Products: Capital
Electrical Dist. Systems Dsgn
Breakout Room
  • Reducing the Hidden Cost of Design
    Toggle Abstract

    TECHNICAL SESSION Often the costs associated with vehicle design will be based on true value-add tasks as well as finding and resolving design issues. As progress is made along the design cycle, costs associated with design issues increase dramatically, resulting in potential mis-builds and manufacturing rework. This session is based on several recent case studies whereby Mentor Consulting-led deployment of the Capital tools has been proven to reduce ongoing costs and time to market.

Presenter: Russell Forsyth, Deployment Architect, Mentor Consulting Division, Mentor Graphics
Products: Capital
Wire Harness Eng.
Breakout Room
  • System Design Management in Context
    Toggle Abstract

    TECHNICAL SESSION Today’s electronic products are a complex integration of systems that must be seen and assessed in the context of the whole.  Communication between the different design communities is imperative to avoid potential misunderstandings, errors, and omissions. The real challenge is to institute a set of disciplines and develop a design methodology that works for everyone.  This presentation introduces the Context System Design Management (SDM) environment, a family of products that enables teams to productively manage the relationships of all facets of electronic system design.  Context SDM integrates with Rational Doors, QM & TC to carry requirements and dependencies across a concept-to-implementation flow.

Presenter: Bill Chown, Marketing Manager, System Level Engineering, Mentor Graphics
Products: Context
Systems Eng.
Breakout Room
  • The Challenges that Implementing Infotainment Systems using Audio Video Bridging (AVB) pose to System and Endpoint Developers
    Toggle Abstract

    TECHNICAL SESSION This paper describes the challenges that implementing Infotainment Systems using AVB pose to system and endpoint developers. We discuss real-life deployment examples, including considerations in system startup, network topology, and endpoint design.

    Ethernet AVB delivers many advantages, but it also comes with challenges that both hardware and software teams must consider. The standards provide Quality of Service (QoS) for AV streams by guaranteeing isochronous transmission, low latency (802.1Qav), accurate clock synchronization (802.1as), and data-rate control (802.1Qat). The real-time processing requirements of these network protocols are challenging for processors, MCUs, and software stacks. The trend towards highly responsive, deterministic Ethernet networks is seen to result in higher interrupt loads and requires changes to conventional methods for handling network interfaces.

    We consider the example of IEEE 1722. An AVB Endpoint must send/receive IEEE 1722 packets at a very high frequency: 8000 class A packets per second per stream. This high rate minimizes latency in the network, but it requires the endpoint to handle a high real-time processing load.

    The experiences we describe in Ethernet AVB Head Unit and Amplifier development are an important proof point that AVB in the car is now a reality and delivering the expected advantages.

Presenter: Paul Neil, XMOS
Products: Embedded Software
Embedded - IVI & GENIVI
Breakout Room
  • Model Driven Development of Reusable Electronic Control Software
    Toggle Abstract

    TECHNICAL SESSION An important aspect of today's development programs is choosing design and analysis methods that ensure that the end product functions as intended, is safe, can be delivered cost effectively, and will be reusable. With the increasing role of embedded software in the delivery of automobile functionality, it is particularly important to choose an effective software development methodology. With major new software requirements just around the corner, such as AUTOSAR compatibility and ISO26262 compliance, it is imperative to use a methodology that is adaptable to the future.

    This presentation will explore how a modern Model Driven Development (MDD) approach can be used to tackle the most common system design challenges and deliver high quality, reusable, future-proof software on time. The development flow offers a model-driven, virtual environment for software component engineering that permits early concept and requirements validation, architectural tradeoff analysis, execution and analysis across engineering domains, and transformation of the model to specific implementations. Unlike hand-crafted, prototype-driven methodologies, this solution provides a methodical, model-driven flow that automates software component delivery, can be verified early and cheaply, and can be flexibly targeted to architectures in use today or in the future.

Presenter: Dean McArthur, Product Marketing Engineer, System Level Engineering, Mentor Graphics
Products: BridgePoint, VSI
Network Dsgn & Integration & AUTOSAR
Breakout Room
  • To Build a Better Electrical Distribution System, Start with Simulation
    Toggle Abstract

    TECHNICAL SESSION Can simulation really help you build a better electrical distribution system? You may be surprised to learn that the answer is “Yes!”. Join this session to learn how you can use simulation early in the wiring development process to establish practical rules and constraints for distribution system design. Using an Alternator Load Dump example, we will illustrate how important design constraints, such as fuse and wire sizing requirements, are easily determined for a multi-voltage (48V/14V) system. This design example models important electrical system behavior, including alternator electro-dynamics, voltage regulation, battery state-of-charge, and system loading. Simulation of this system model shows the realistic high-voltage transients that occur when the battery is disconnected from the electrical system during heavy charging. During this session, you will learn how to analyze these transients to define requirements that drive the downstream electrical distribution system design process.

Presenter: Mike Jensen, Product Marketing Engineer, System Level Engineering, Mentor Graphics
Products: SystemVision, Capital
Hybrid Electric Vehicle
Breakout Room
  • Validating Compact Thermal Models for Improved Electronics Cooling Simulation Accuracy using Thermal Measurement Techniques
    Toggle Abstract

    TECHNICAL SESSION To enhance electronics cooling simulation accuracy when modeling components in enclosures, engineers often rely on a compact thermal models - detailed numerical model of the package, that represent the internal construction of the package. This requires material properties and geometric sizes to be accurately specified in whatever model type is selected. Using thermal measurement, experimentally determined structure functions can be used to provide insights into the thermal resistances and capacitances encountered as heat travels from a die through and beyond an IC package.

    By comparing a structure function derived from the simulation model with experimental testing discrepancies in thermal resistances and capacitances values in the numerical compact thermal model can be adjusted to create a validated compact thermal model. This presentation will review compact thermal models and how to create calibrated numerical package model for use in improved accurate simulation using tools like FloTHERM.

Presenter: Joe Proulx, Consultant Engineer, Mechanical Analysis, Mentor Graphics
Products: MicRed
Electronic Thermal Dsgn & Measurement
Breakout Room
  • Keep it Clean With Fast High-Speed Design Screening
    Toggle Abstract

    TECHNICAL SESSION Today’s design challenges of ensuring signal integrity, reliable timing, well behaved waveforms, acceptable levels of crosstalk, adequate power distribution and EMI levels, and meeting global regulatory requirements can no longer be met by outdated design methods and procedures that lack adequate simulation coverage and performance verification techniques. The absence of these key features can jeopardize first-time design success or profitable performance yields. This session will discuss a new approach that can quickly and accurately check the electrical performance robustness of a design as the schematic and layout design proceeds.

Presenter: Sarmad Khemmoro, Application Engineering Manager, Mentor Graphics
Presenter: Shreyas Bhat, Senior Application Engineer, Mentor Graphics
Products: HyperLynx DRC
PCB Systems Design
Breakout Room
  • Electrical Simulation & Analysis Using The Simplest Of Models
    Toggle Abstract

    TECHNICAL SESSION Compressed development cycles drive increased focus on virtual development, including simulation and analysis of electrical system designs. However, one hurdle often cited is the effort needed to develop detailed models of components such as wires, fuses and ECUs. This presentation shows that it is fully possible to obtain reliable and surprisingly accurate results using the simplest of models. By placing these models in a re-usable library and providing a simple, visual interaction environment, early design debugging using a computer becomes possible for every electrical engineer.

Presenter: Nigel Hughes, Technical Director, Integrated Electrical Systems, Mentor Graphics
Products: Capital
System Modeling & Analysis

4:20 PM - 4:55 PM  7 sessions

Breakout Room
  • Integrating a New ECAD System with Service Publications
    Toggle Abstract

    TECHNICAL SESSION Adoption of a new Electronic Systems Computer-Aided Design (ECAD) system for modeling electrical systems design by Product Engineering offers the promise of improved accuracy and productivity for Service Publication's authors to create wiring diagrams and to standardize their format, while improving comprehension and functionality of those documents for service technicians. It is also potentially disruptive, requiring new workflows, processes, standards, and lines of communication to be developed.

    This presentation describes how to structure and organize a project for effectively and efficiently bringing a new ECAD system for modeling electrical system design into Service Publications. It also provides insight into some lessons learned.

Presenter: Arnold Taube, Principal Engineer, Deere & Company
Products: Capital
Electrical Dist. Systems Dsgn, Wire Harness Eng.
Breakout Room
  • Tackling the Increasing Complexity of Systems Lifecycle Data: Introducing RELM
    Toggle Abstract

    TECHNICAL SESSION Product manufacturing and systems integration companies must tackle increasingly complex problems, yet are looking for ways to reduce costs in a fiercely competitive environment and shrinking budgets. Engineers must manage increasingly complex data sets (i.e. requirements, design elements, test cases, plans, change requests, etc.) and understand the relationships between data that has traditionally not been well connected and is stored in ‘silos’ in domain-specific tools. IBM's clients are demanding ways to manage the overhead associated with this design complexity and lack of integrated views. In this presentation, we will look at the challenges engineers face in finding relevant information, understanding relationships and structuring data, and look at capabilities to help them visualize, analyze, and organize systems lifecycle data and their relationships across domains in a vendor-independent way. These capabilities should reduce the overhead of managing complex data and help engineers focus on defining, designing, and validating smarter products.

Presenter: Ron Felice, Solution Architect for Real Time & Embedded Systems, IBM
Products: Context
Systems Eng.
Breakout Room
  • Delivering Multi-domain Automotive Electronic Systems with GENIVI, AUTOSAR, and Hypervisor Technology
    Toggle Abstract

    TECHNICAL SESSION Automobiles contain a number of domains including AUTOSAR (OSEK) , real-time OSs, and Linux. Advances in SoCs make the sharing of resources across multiple applications more appealing. Learn about some of the recently introduced SoCs that show promise for multi-domain implementations and how a real-time hypervisor can provide the necessary separation between automotive application domains.

Presenter: Warren Kurisu, Director of Product Management, Embedded Systems, Mentor Graphics
Products: Embedded
Embedded - IVI & GENIVI, Network Dsgn & Integration & AUTOSAR
Breakout Room
  • Connecting Domains: How Software Components Can Influence Electric and Hybrid Vehicle Architectures
    Toggle Abstract

    TECHNICAL SESSION Understanding how decisions are made in one domain and how these decisions can affect behavior in another domain is an important aspect of system engineering. This is particularly true when it comes to creating effective designs with a high overlap of electrical and electronic components, such as in electric and hybrid vehicle design. This session demonstrates how optimized design decisions can be made by providing insight into how software/ECU/network architecture choices impact electrical implementations in terms of cost, weight, and space reservation.

Presenter: Hans-Juergen Mantsch, Technical Marketing Manager, Embedded Systems, Mentor Graphics
Products: AUTOSAR
Hybrid Electric Vehicle
Breakout Room
  • Selecting the Right Thermal Interface Material (TIM) for Electronics Packages based on Accurate Thermal Measurement Data
    Toggle Abstract

    TECHNICAL SESSION Thermal Interface Materials (TIMs) are used to establish good thermal contact between mating surfaces in an IC package. With ever increasing power density, especially in power electronics packages, it is important to dissipate heat as efficiently as possible. Heat transfer depends on the conductivity of the package and the influence of the thermal resistance of the interface material and contact resistances. In understanding the heat flow path, accurate thermal property information is key in selecting TIMs appropriately for successful thermal design.

    Aimed at those selecting TIM materials, this presentation reviews TIM material types (incl. greases, phase change materials, gap pads, gap fillers, solids, and prepared adhesives) alongside typical measurement techniques used for thermal characterization and how to interpret this data. A particular focus will be on transient thermal measurement using controlled environment, precision testing, to determine changes in thermal resistance for TIM thicknesses down to 1 micrometer.

Presenter: John Wilson, Application Engineering Manager, Mechanical Analysis, Mentor Graphics
Products: MicRed
Electronic Thermal Dsgn & Measurement
Breakout Room
  • Model-based & Implementation-based Test Generation
    Toggle Abstract

    TECHNICAL SESSION The development of an efficient bug-free system remains a myth. Testing continues to be a major challenge, if not the most fundamental challenge, in embedded systems development. It consumes the most time during embedded systems development. Traditional validation techniques are based on hardware-in-the-loop tests, while algorithm and software developers use model-in-the-loop tests to validate their systems. Both efforts are usually separated, with few tests being reused. With the growing emphasis on safety-critical functionality, and the growing complexities of embedded systems, software test and reliable behavior are ever more critical. However, existing solutions still tend to be localized, tailored, time consuming and not extendable.

    This presentation will introduce a graph-based testing environment that ensures rapid and efficient system stimulus generation, a co-simulation solution that allows tests to be executed against different platforms/IDEs (namely Matlab/Simulink climate control model and AUTOSAR SWC simulation on VFB), automated test results verification, requirements-based coverage, and finally the ability to extend this solution to different domains. Use-cases will show that the proposed environment leads to better products, faster tests design and development, and lower production costs.

Presenter: Ghada Bahig, Engineering Manager, System Level Engineering, Mentor Graphics
Products: General
System Modeling & Analysis
Breakout Room
  • Using Design for Manufacturing to Avoid Costly PCB Design Spins
    Toggle Abstract

    TECHNICAL SESSION The session will explore the value of integrating Valor NPI into the PCB development cycle to avoid costly problems and reduce the number of board spins. Valor NPI can be used not just as a validation tool at the end of the PCB development cycle, but more of an iterative knowledge and experience capture tool to provide feedback to the PCB designer during the design process. Creating a bridge between the PCB Fabrication supplier, PCB Assembly process and the PCB designer is integral to success of any design project. Having each PCB Designer in possession of the same knowledge globally is important to maintaining the design quality and standards within a company.

Presenter: Joe Borland, Director, Global Electronics Engineering Tools and Processes, Autoliv
Products: Valor NPI
PCB Systems Design

4:55 PM - 6:30 PM  1 session

Solutions Expo Area
  • Cocktail Reception
    Toggle Abstract

    RECEPTION The event concludes with a cocktail reception and networking event. We invite our guests to walk the Solutions Expo to see demonstrations of the products that were introduced during the day and to speak with our presenters.

All