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IESF: Electronic Thermal Design & Measurement

Learn more about the latest tools and innovations for Automotive Electronic Thermal Design & Measurement at IESF Europe 2013.

Highlights include dedicated breakout track, case studies and solution demonstrations. Topics covered include presentations by leading automotive experts, trends and challenges, thermal characterisation, electronics cooling simulation, and enhancing automotive electronics thermal design productivity.

F = Full registration required

Guest Speaker
  • Thermal Simulation and Optimization of automotive Multimedia Systems – Modeling Requirements from Chip to complete System
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    TECHNICAL SESSION Modern radio and navigation systems, i.e. multimedia systems, for automotive applications are highly complex systems. Increased power dissipation and power density due to increased functionality (new multimedia features: e.g. video, internet, MP3) and higher demands on the audio power amplifier require intelligent thermal management strategies. In this presentation we focus on typical tasks and problems involved in the thermal design as well as design optimization and address modeling requirements from chip to the complete system and beyond (dashboard) necessary for thermal analysis. Up-front simulations increase customer satisfaction and enable us to test and modify system and components as virtual prototypes before performing physical tests and building real prototypes

Presenter: Dr. Uwe Lautenschlager, Senior Simulation Specialist, Continental Automotive GmbH
  • Thermal simulation for design, integration and validation of power electronics modules of Electronic & Hybrid Vehicles
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    TECHNICAL SESSION Nowadays car manufacturers have to challenge shorter overall development cycles of vehicles and the time to introduce innovations to the market. Simulation is an essential tool to overcome these challenges. Realizing this key factor during the engineering process, innovative simulation software such as Mentor Graphics’ FloEFD™ contributes significantly to reduce the total development costs (C), the development duration (D) and leads to a product quality (Q) improvement.
    Our specific case will focus on the 3D- thermal and fluidic analysis of power electronics modules integrated in electric and hybrid vehicles.
    Under the consideration of thermal constraints it will illustrated how the thermal models have been built within FloEFD™, validated and how the results impact the design and optimization decisions of each electronic power module.
    Furthermore, the importance of having an innovative simulation tool allowing a fast and robust link with the CAD environment CATIA™ during the development cycle is highlighted.

Presenter: Ibrahim Mohand-Kaci, RENAULT
  • Thermal Simulation in automotive power electronics products
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    TECHNICAL SESSION Due to the growth of the market for Electrical Vehicles and Hybrid Vehicles, power electronics products are more and more present in the automotive industry. These power electronics products must be designed to operate in very severe thermal conditions. Additionally, compactness and short development timeframe are two other strong constraints. In this context, 3D thermal simulations are a very useful tool to answer this challenge. These 3D models can be used from the early stage of the product design of up to the validation stage. In addition, these models can now address multiphysics simulations enabling us to account for strongly coupled effect, such as the thermal loads produced by the joule effect. However, complex transient power profiles can lead to long calculation times that are incompatible to the product development timeframe. For this specific case, thermal impedance methodology can be applied to calculate, in a reasonable time, transient temperature of the main components. These thermal results can finally be used to estimate reliability of the product.

Presenter: Renan Leon, Valeo
Technical Session
  • Enhancing Automotive Electronics Thermal Design Productivity – Rapid model creation & bridging the gap between EDA and MCAD design flow with FloTHERM XT
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    TECHNICAL SESSION In automotive electronics cooling applications, PCB power density is steadily increasing. Taking an automotive engine control unit as an example thermal design project, this presentation shows how FloTHERM XT software can be applied to realize significant workflow and simulation productivity gains. There are advantages in this step change approach to electronics cooling by incorporating both EDA design data earlier and also mechanical design flows in this CAD centric tool suitable for creating and modifying designs for analysis from concept to verification.

Presenter: Stefan Leder, Application Engineer, Mechanical Analysis Division, Mentor Graphics
  • Selecting the right Thermal Interface Material (TIM) for electronics packages based on accurate thermal measurement data
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    TECHNICAL SESSION Thermal Interface Materials (TIMs) are used to establish good thermal contact between mating surfaces in an IC package. With ever increasing power density, especially in power electronics packages, it is important to dissipate heat as efficiently as possible. Heat transfer depends on the conductivity of the package and the influence of the thermal resistance of the interface material and contact resistances. In understanding the heat flow path, accurate thermal property information is key in selecting TIMs appropriately for successful thermal design.

    Aimed at those selecting TIM materials, this presentation reviews TIM material types (incl. greases, phase change materials, gap pads, gap fillers, solids, and prepared adhesives) alongside typical measurement techniques used for thermal characterization and how to interpret this data. A particular focus will be on transient thermal measurement using controlled environment, precision testing, to determine changes in thermal resistance for TIM thicknesses down to 1 micrometer.

Presenter: Matthew Clark, Application Engineer, Mechanical Analysis Division, Mentor Graphics