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IESF: Electronic Thermal Design & Measurement

Learn more about the latest tools and innovations for Automotive Electronic Thermal Design & Measurement at IESF Europe 2014.

Highlights include case studies and solution demonstrations for e.g. general trends about the thermal management of LEDs as well a Laser based lights in automotive, modern Infotainment Systems and Power Electronic for EV and HEV.

Topics covered include presentations by leading automotive experts showing new trends and challenges in the industry. Mentor Graphics will unveil the latest technologies around thermal Simulation and characterization related to the robust design of electronic components as well as complete systems which help to increase the productivity and product quality during the entire automotive Electric/Electronic process.

Featured Electronics Thermal Design and Measurement Events

Parametric Study of an IGBT Cold Plate Geometry in a Thermal Simulation Thursday, October 23, 1:20 PM

Technical Session The CAD design of a cold plate for automotive power electronics is the key for an efficient cooling. A parametric study of the cold plate design was conducted to find the optimum geometry parameters such as pin/fin size, number and height. The study will show which parameter has the most influence for the considered cold plate design.

IGBT Power Cycling and Failure mode tracking Thursday, October 23, 3:50 PM

Technical Session This presentation will explain Mentor’s latest product, the Power Tester 1500A, of the MicReD product line and explain its application in the testing of IGBTs as they are used in EVs and HEVs. We will show the capabilities in the power cycling of IGBTs until their end of life as well as the continuous health monitoring during the cycling by recoding structure functions in intervals in order to determine the failure mode of the device and how this can be used in not only automotive but general power electronics testing.

F = Full registration required

Technical Session
  • Feel the Heat in the Automotive Industry: Thermal Simulation as an integral part of the Design Process!
    Toggle Abstract

    TECHNICAL SESSION Today’s automotive products have to be in line with the automotive industry's megatrends that make driving safer, more comfortable and more sustainable. High performance products, such as Navigation-, Multimedia-, Telematics-Systems, Instrument Cluster and Head-Up Displays will make Individual mobility more comfortable. Products, focusing on driving safety, collision avoidance and protection during accidents will make individual mobility saver and additionally more sustainable, when products help to reduce fuel consumption and emissions.
    The design of these highly complex automotive systems requires the interaction of mechanical, electrical and software engineers in order to fulfill requirements from mechanical stability and thermal management to electromagnetic compliance within a wide range of ambient temperatures and environmental conditions. The consequent employment of computer-based simulation, such as thermal simulation, supports the exploitation of a design’s potential, enables the comparison of different concepts and variants and contributes to numerically supported design decisions. Such up-front simulations, also called virtual analyses, an integral part of the design process, enable us to test and modify system and components as virtual prototypes before performing physical tests and building real prototypes.
    In this presentation we focus on typical tasks and problems involved in the thermal design and simulation of such systems for automotive applications. A Computational Fluid Dynamics (CFD-) program is necessary to simulate heat transfer and air flow concurrently. Employed is the commercial CFD-program FLOTHERM (Mentor Graphics) to simulate the three cooling mechanism conduction, convection, radiation.

Presenter: Dr. Uwe Lautenschlager, Senior Simulation Specialist, Continental Automotive GmbH
  • IGBT Power Cycling and Failure mode tracking
    Toggle Abstract

    TECHNICAL SESSION This presentation will explain Mentor’s latest product, the Power Tester 1500A, of the MicReD product line and explain its application in the testing of IGBTs as they are used in EVs and HEVs. We will show the capabilities in the power cycling of IGBTs until their end of life as well as the continuous health monitoring during the cycling by recoding structure functions in intervals in order to determine the failure mode of the device and how this can be used in not only automotive but general power electronics testing.

Presenter: Matthew Clark, Field Application Engineer, Mentor Graphics
  • Laser Headlamps: Latest Developments and Future Prospect
    Toggle Abstract

    TECHNICAL SESSION As LEDs are gradually setting standards in automotive head-lighting, we already have seen examples of laser headlamps touted as the future of high end automotive lighting. A diode laser pumped remote phosphor based white light source can much better than LEDs in terms of luminance and design flexibility. Diode lasers need smaller optics and hence, can offer sleek and unprecedented design possibilities.
    However, the 445 nm commercial blue laser diodes have a limited external quantum efficiency in the range of roughly 30% and heat management is a crucial issue for stable performance and durability.
    Also, the remote phosphor module is a very important component of the so called laser headlamp and the selection of the phosphor depends on its optical and thermal properties. This talk will focus on some latest developments and highlight the potential and challenges of laser headlamp technology.

Presenter: Dr. Chandrajit Basu, CTO, Aurays GmbH & Co. KG
  • Parametric Study of an IGBT Cold Plate Geometry in a Thermal Simulation
    Toggle Abstract

    TECHNICAL SESSION The CAD design of a cold plate for automotive power electronics is the key for an efficient cooling. A parametric study of the cold plate design was conducted to find the optimum geometry parameters such as pin/fin size, number and height. The study will show which parameter has the most influence for the considered cold plate design.

Presenter: Boris Marovic, Industry Manager Automotive & Transportation, Mentor Graphics
  • Winding Parameter Variations for the Cooling of an Electrical Motor
    Toggle Abstract

    TECHNICAL SESSION Flow and thermal calculations have been performed with FloEFD for different winding configurations of the motor. The bar winding is simulated with its copper and insulation layers whereas the composite wire winding is simulated by assuming equivalent thermal conductivities. The windings will be compared regarding thermal behaviors as well as material and production costs.

Presenter: Karim Segond, Freelancer, N/A