All IESF Europe  Events

Thursday, October 18

Thursday, October 18

8:00 AM - 9:00 AM  1 session

  • Arrival and registration Abstract

    N/A n/a

9:00 AM - 9:10 AM  1 session

  • Welcom and overview of the day Abstract

    N/A n/a

Presenter: Matthias Knoppik, Area Director Central Europe, Mentor Graphics

9:10 AM - 9:55 AM  1 session

  • Discontinuities in Automotive EE Design Engineering Abstract

    KEYNOTE Start and end your conference day with an overview of industry trends and directions

Presenter: Wes Ryder, World Wide Technical Director, Mentor Graphics

9:55 AM - 10:40 AM  1 session

  • Connected cars, connected drivers, connected engineering Abstract

    KEYNOTE Advanced driver assistance systems, like other premium features, have arrived in the compact class vehicles. OEMs and brands are proliferating into new markets and very often into new niches to address the changing needs and wants of vehicle buyers. A lot of technical, commercial and perceptional benefits may be derived from connecting sensor data, from connecting cars or from connecting the driver with the internet. Yet the different groups tasked with the creation of all of the above, i.e. the system architects, the electrical system designers, the software developers, etc., very often live on different islands, barely connected at all. This key note analyses how the industry is challenged by these issues and discusses the way this is shaping software solutions that can work across multiple domains and organizational boundaries to help bring the aspirations of mass customization and shortened design cycles to a reality.

Presenter: Martin O'Brien, General Manager, Integrated Electrical Systems Division, Mentor Graphics
Electrical Systems Design Integration & Harnessing

9:55 AM - 10:40 PM  1 session

  • Keynote: Automotive Lighting Systems - Past, Current, and Future Technologies Abstract

    KEYNOTE 1962-2012: 50 years of endless progress.
    - Quantity of light multiplied by more than 5.
    - Environment adjustment in function of road, fog, rain, speed, vehicles.
    - Headlamps/rearlamps, levers of styling differentiation.
    - « Seeing better » but also « Being seen better»
    - Lighting: reduction of energy consumption
    The 2 trends.
    - Growth of intelligent lightings
    - Growth penetration of LED
    The 5 consequences.
    The main statement and the three messages.

Presenter: Hector Fratty, Managing director, Driving Vision News
Electronics Thermal Design and Measurement

10:40 AM - 11:10 AM  1 session

11:10 AM - 11:40 AM  4 sessions

  • Global tool standardization engineering tool chain at Leoni and process implementation at business unit commercial vehicles
Presenter: Carsten Wilhelm, Director Processes & Systems, Leoni wiring systems
Presenter: Ingo Reinhardt, Team Leader Engineering, Business Unit Commercial Vehicles, Leoni wiring systems
Products: Capital, Vesys
Electrical Systems Design Integration & Harnessing
  • Working with an AUTOSAR 4.x based electrical architecture Abstract

    TECHNICAL SESSION Background and history
    A holistic top-down approach
    Future outlook

Presenter: Hans Alminger, Senior Manager, Diagnostics & ECU Platform, Volvo Car Corporation
Network Design Integration and AUTOSAR
  • Beyond hardware: Automotive standards drive software reuse Abstract

    TECHNICAL SESSION Growing complexity of software in automotive electronic control units has forced the industry to invest into software standardization activities such as AUTOSAR and GENIVI. These standards aim at enabling higher reuse of software at all levels of the software supply chain. In this changing environment semiconductor companies that in the past supplied hardware only are now also becoming an important part of the automotive software supply chain. In parallel each automotive segment has brought forward more demanding requirements: the ISO 26262 norm defines new requirements for functional safety, powertrain applications demand higher than ever MCU performance, and lower power consumption is needed in body and comfort applications. This presentation will present the processes, competencies, product and service offerings Freescale has developed to meet these challenges.

Presenter: Dr. Andreas Both, Product Marketing Manager, AISG Automotive Software & Tools, Freescale Semiconductor Inc.
Products: Inflexion UI, CodeBench, Mentor Embedded Linux
Embedded Systems
  • Thermo-Optical-Simulations Abstract

    TECHNICAL SESSION Throughout the last year Automotive Lighting has been the subject of many innovations; new light sources, driving assistance and lighting functions, which have led to sophisticated styling trends challenging today’s automotive lighting engineer.

    To keep pace with innovations, automotive OEMs and TIERs use thermal and optical simulation software to develop LED Systems. All of these tools are well established in the automotive lighting industry; nevertheless, efficiency in workflow can still be optimized. This presentation shows some of the possible benefits to be gained from using thermal and optical simulations in one simulation step. The Thermo-Optical behavior of light sources and materials will be demonstrated.

Presenter: Prof Alexander von Hoffmann, Professor for mechatronics at the University of Applied Sciences Nuremberg, Ohmsche Hochschule
Electronics Thermal Design and Measurement

11:40 AM - 12:10 PM  4 sessions

  • Solving the change management problem Abstract

    TECHNICAL SESSION Managing the blizzard of design changes is frequently cited as the biggest challenge facing electrical systems & wire harness engineers. This breakout explains powerful technology within the Capital software suite to rigorously manage design change. A seamless process is traced from an external Change Order, through multiple impacted domains, and eventually to a revised formboard design. Both technical and commercial issues are discussed to provide a rounded approach to the subject.

Presenter: Steve Trythall, Integrated Electrical Systems Division, Mentor Graphics
Products: Capital, Vesys
Electrical Systems Design Integration & Harnessing
  • AUTOSAR development: Requirements and system-level design Abstract

    TECHNICAL SESSION This session focuses on the first steps in the development of an AUTOSAR example system, starting from requirements, defining the SW architecture and the ECU/network topology, allocating SW to ECUs, and ending with communication design. We will see how Volcano VSA is used to architect the system, allocate functionality, and design the communication matrix. This includes validation against timing requirements and consistency checking of the entire design before generating AUTOSAR ECU extracts, which will be the input to next phase of the design process. In addition, this session shows how the Volcano VSx tool chain can be used in large projects with distributed, iterative development and gradually increasing functionality, leading up to increased efficiency of development throughout the supply chain.

Presenter: Hans-Juergen Mantsch, Automotive Networking, Mentor Graphics
Products: VSA, VSA COM Designer
Network Design Integration and AUTOSAR
  • Effective development of reusable electronic control software Abstract

    TECHNICAL SESSION An important aspect of today’s development programs is choosing design and analysis methods that ensure that the end product functions as intended, is safe, can be delivered cost effectively, and will be reusable. With the increasing role of embedded software in the delivery of automobile functionality, it is particularly important to choose an effective software development methodology. With major new software requirements just around the corner, such as AUTOSAR compatibility and ISO26262 compliance, it is imperative to use a methodology that is adaptable to the future.

    This session is for the vehicle software developer who needs to deliver high quality, reusable, future-proof software on time. Our development flow provides a model-driven, virtual environment for software component engineering. Unlike hand-crafted, prototype-driven methodologies, this solution provides a methodical, model-driven flow that automates software component delivery, can be verified early and cheaply, and can be flexibly targeted to architectures in use today or in the future.

    This presentation will explore how a modern model-driven development (MDD) approach can be used to tackle the most common system design challenges, including early concept and requirements validation, requirements management and traceability, architectural tradeoff analysis, execution and analysis across engineering domains, transformation of the model to specific implementations, and leverage of a consistent test environment from concept to physical testing.

    Products featured: BridgePoint, SystemVision, Envisage, VSI, SVX for Simulink, LabVIEW, C/C++, & AUTOSAR

Presenter: Darrrell Teegarden, Director, System Modeling & Analysis Division, Mentor Graphics
Products: BridgePoint, SystemVision, Envisage, VSI, SVX for Simulink, LabVIEW, C/C++, & AUTOSAR"
Embedded Systems
  • FloEFD Version 12 - The New LED Simulation Solution Abstract

    TECHNICAL SESSION Find out everything new about the latest and greatest release of FloEFD Version 12. This session will demonstrate the new features that assist the engineer, not only in the design of LED & luminaire but also in other general application challenges. The new features of Version 12 will be demonstrated along with how they can benefit in design analysis. FloEFD V12 can also speed up the design cycle with the new capabilities such as pre and post-processing, with the improved user experience and LED simulation capabilities. The new version demonstrates capabilities that will help to achieve more results, faster and more accurately.

Presenter: Boris Marovic, Mechanical Analysis Division, Mentor Graphics
Electronics Thermal Design and Measurement

12:10 PM - 1:30 PM  1 session

  • Lunch break

1:30 PM - 2:00 PM  4 sessions

  • Meeting the electrical system cost target Abstract

    TECHNICAL SESSION Automotive electrical systems are expensive: a key task is to develop engineering solutions that meet cost mandates. This breakout shows how Capital puts tools into engineers' hands that address this need. Vehicle product plan, EE sub-systems and mechanical data are integrated within a single environment to create a complete configuration complexity model of the vehicle electrical system. Decision support tools guide designers to the best solutions, helping them to meet their targets quickly and systematically.

Products: Capital, Vesys
Electrical Systems Design Integration & Harnessing
  • Software development and virtual validation Abstract

    TECHNICAL SESSION Application SW development in an AUTOSAR context means that algorithms are partitioned into connected SW components, which in turn contain executable functions (called runnable entities in AUTOSAR). This structured definition of how the application SW is partitioned and executed enables simple relocation and reuse of application SW components inside or between ECUs. It also includes what can be called virtual validation – execution and verification of the SW components individually or in a system using a typical PC. However, to reach these benefits the application SW components require a detailed model description that can only be designed with appropriate tools. In this session we will see how to refine the system-level design from the previous session into detailed SW implementation for a selected set of SW components. We will define the internal structure of SW components and execute the SW components on top of a real AUTOSAR operating system in order to verify functional correctness.

Presenter: Joachim Langenwalter, Director - Automotive Networking, Mentor Graphics
Products: VSA, VSI          
Network Design Integration and AUTOSAR
  • GENIVI and available components for IVI systems design Abstract

    TECHNICAL SESSION This session will cover the work of the GENIVI organization, and range and scope of GENIVI components available for IVI systems design.  Some are mature and released,  while others are still in the specification and development stage.  The GENIVI development process and technology roadmap will also be outlined. IVI and adjacent technology implementation architectures will be covered, using reference to the Mentor IVI Linux design solution.

Presenter: Andrew Patterson, Embedded Systems Division, Mentor Graphics
Products: GINIVI, IVI Linux design solution
Embedded Systems
  • Thermal characterization of LED Abstract

    TECHNICAL SESSION The number of LEDs in automotive headlamps increases rapidly month on month. Even in middle class or compact class cars halogen or xenon bulbs are being replaced by LED technology. LED light output and lifetime are strongly influenced by the temperature of the LED junction. Influenced by the motor compartment, LEDs get very hot and therefore a strict temperature control in any operating case is necessary. An additional challenge in the design process of headlamps is that the LED as a source is often also changed in parallel. To solve these challenges it is necessary to use a measurement system which ensures exact measurements within a short time period, and to make these measurements in the microscopic areas of LED package and interfaces without influencing the junction itself.

    Mentor Graphics, T3Ster system has been used in Automotive Lighting Reutlingen since 2009 across different applications during development; to characterize and qualify the LED internally, to optimize interface material, PCB and thermal layouts, to validate the LED performance over lifetime and to control the manufacturing processes. Some useful characteristics and future improvements of the T3Ster system will be discussed in the presentation. All tasks lead to a safe and optimal use of LEDs in headlamp systems.

Presenter: Uwe Schubert, Section Manager Standards and Materials, R&D Testing and Release, Automotive Lighting
Electronics Thermal Design and Measurement

2:00 PM - 2:30 PM  4 sessions

  • Technology for harness manufacturing cost calculation Abstract

    TECHNICAL SESSION Precise calculation of wire harness costs is essential not only for manufacturers who must quote selling prices promptly and accurately, but also for OEMs who wish to control purchasing dynamics. This breakout presents brand new technology for detailed harness cost & time calculations. Fully integrated within the Capital suite, this new software rapidly computes material costs, labor times and associated values. Rich cost models, capturing corporate IP, can be swiftly & securely developed, then used to support activities such as margin management, sourcing decisions & manufacturing optimization.

Presenter: John Judkins, Integrated Electrical Systems Division, Mentor Graphics
Products: Capital, Vesys
Electrical Systems Design Integration & Harnessing
  • ECU design and configuration using AUTOSAR basic software                  Abstract

    TECHNICAL SESSION After the system-level design is completed and the SW development is at least initiated, the ECU design and configuration can start. The task is to configure the AUTOSAR Basic SW (BSW) modules to operate according to the needs of the application SW. The AUTOSAR BSW provides a complete embedded SW platform, with services such as task scheduling, memory protection, NVRAM management, communication, diagnostics, cryptographic services, etc. – more of less every service the application SW of an automotive ECU needs. Configuring an ECU’s BSW can be complex and error prone unless supported by adequate tooling and the appropriate methodology. In this session we will see how to configure the BSW of the ECU according to the needs of the application, using input from the previous design steps. We will demonstrate the power of a top-down development approach combined with design automation for the ECU configuration task.

Presenter: Armin Lichtblau, Automotive Networking, Mentor Graphics
Products: VSB, VSTAR
Network Design Integration and AUTOSAR
  • Designing and development of linux-based infotainment solutions
Presenter: Peter Siepen, Software Project Manager, Advanced Driver Information Technology GmbH
Products: Mentor Embedded Linux
Embedded Systems
  • Thermal Simulation for the Design of automotive Multimedia Systems Abstract

    TECHNICAL SESSION Modern radio and navigation systems, i.e. multimedia systems, for automotive applications are highly
    complex systems with a large variety of mechanical and electrical components, modules and assemblies,
    such as frame brackets, front module with LED-backlight display, PCBs, drives, fan, connectors, heat
    sinks or tuner modules. The design of these automotive multimedia systems has to fulfill requirements
    from mechanical stability and thermal management to electromagnetic compliance.Therfore, the
    thermal design requires the interaction of mechanical, electrical and software engineers in order to
    achieve a thermal system solution, hence a multi-disciplinary design and optimization problem.
    In this presentation we address thermal simulation as an integrated part of our design process for
    automotive multimedia systems. We focus on typical tasks and problems involved in the thermal design
    and address modeling requirements from chip to the complete system and beyond (dashboard)
    necessary for thermal analysis. The knowledge about critical temperature levels, heat and fluid flow or the
    necessity to implement a fan highly effects design decisions. Employed is the CFD-program FLOTHERM
    to simulate the three cooling mechanism conduction, convection, radiation. Such up-front simulations
    increase customer satisfaction and enable us to test and modify system and components as virtual
    prototypes before performing physical tests and building real prototypes. Due to a technically matured
    system, less time and money have to be spent as the number of tests/prototypes is reduced.

Presenter: Dr. Uwe Lautenschlager, Senior Specialist Simulation, Continental Automotive GmbH
Electronics Thermal Design and Measurement

2:30 PM - 3:00 PM  1 session

3:00 PM - 3:30 PM  4 sessions

  • Finding & fixing electrical system faults faster Abstract

    TECHNICAL SESSION Rapid resolution of electrical faults reduces costs and enhances brand image. This breakout presents technology to dramatically simplify the troubleshooting task. Leveraging design data directly into the service domain, the service technician is presented with vehicle-specific information, can navigate easily and dynamically through electrical schematics, and seamlessly link with other resources such as diagnostic systems, 2D and 3D views, and rectification scripts.

Products: Capital, Vesys
Electrical Systems Design Integration & Harnessing
  • Early testing of AUTOSAR-based ECUs and sub-systems Abstract

    TECHNICAL SESSION One of the AUTOSAR standard’s key points is to enable reuse of application SW, which leads to shorter development time and enables early validation of software components in the virtual environment. But when it comes to validation in the physical environment, connecting to real sensors/actuators, and communicating with real ECUs, the availability of the ECU HW is often a limiting factor, especially given the fact that the HW development is typically initiated by an ECU supplier company only after being nominated for a project. In addition to the virtual validation of software components provided by Mentor Graphics’ VSI tool, an interesting and fully compatible alternative or next step is to use a rapid prototyping ECU such as the MBtech Virtual AUTOSAR Platform (VAP): a highly configurable system based on industry PC standards and equipped with AUTOSAR BSW and tooling from Mentor. The VAP can be used to validate the complete ECU’s functionality, from its application SW via the AUTOSAR BSW to real sensor/actuator or communication interfaces. In this session we will see how the VAP prototype ECU can be used for proof of concept, validating ECU configurations and integration with real ECUs.

Presenter: Joachim Langenwalter, Director - Automotive Networking, Mentor Graphics
Products: VAP, VSTAR   
Network Design Integration and AUTOSAR
  • Does virtualization make Linux/GenIVI systems flexible and secure? Abstract

    TECHNICAL SESSION Virtualization technology has founds its home in automotive design and allows integration of more functions with fewer ECUs. AUTOSAR functions, AUTOSAR state managers, security functions, shared drivers (e.g. graphics) and the actual Linux/GenIVI operating system are all running on one shared CPU in segregated partitions.
    But does virtualization make Linux/GenIVI systems flexible and secure? Can it withstand security concerns? Does virtualization negatively impact the systems' performance? This presentation will be based on the example of integrating various functions with internet connectivity into the head unit and will describe all of the building blocks necessary to put this successfully into practice.
    This presentation is intended for system architects, engineers responsible for ECUs, embedded software developers, and managers at OEMs, Tier-1, and system houses.

Products: Inflexion UI, CodeBench, Mentor Embedded Linux
Embedded Systems
  • Thermal Design Challenges in Automotive Electronics Abstract

    TECHNICAL SESSION Space constrained and high temperature environments, coupled with an increase in the functional density of automotive electronic, has resulted in the need for thermal management to be considered throughout the design process and across the supply chain. High operating packaged IC temperatures effects both reliability and, especially in terms of LEDs, functional performance. Conductive or convective cooling strategies require the heat that is dissipated within the electronics to be removed effectively to the surrounding ambient thus minimising the temperature rises within the system.

    Determining whether a thermal design results in the required temperatures necessitates simulation to be deployed from as early in the design as possible. The main challenges in that simulation involve determination of key thermal resistances that the heat experiences as it passes from heat source to surrounding ambient. From die to die attach, from package to PCB, from PCB to chassis; obtaining good quality part and material thermal data is the key to producing usefully accurate thermal simulation data.

Presenter: Robin Bornoff, Mechanical Analysis Division, Mentor Graphics
Electronics Thermal Design and Measurement

3:30 PM - 4:00 PM  4 sessions

  • The Role Of Automotive Electronics As Indian OEM’s Compete Worlwide Abstract

    TECHNICAL SESSION The presentation on ‘PLM Meets Capital:Building an ecosystem around Capital’ highlights the pluggable nature of Capital, to fit into diverse OEM environments. The presentation highlights the importance of a tight integration between Capital and the PLM environment (Team Centre) and the benefits out of such an integration to TATA Motors. The presentation also focusses on the key aspects of Capital and how it would derive benefits for users in their projects and challenges.

Presenter: Apurbo Kirty, Deputy General Manager of Electrical, Mahindra & Mahindra
Products: Capital, Vesys
Electrical Systems Design Integration & Harnessing
  • Project experience: AUTOSAR 4.x processes at Volvo and BMW Abstract

    TECHNICAL SESSION In this session you will learn about AUTOSAR processes at specific OEMs, e.g. how they deploy the AUTOSAR 4.0 specifications in their car projects, how they develop ECU’s in AUTOSAR 4.0, and how they are processing their software design on particular platforms. You will see which problems came up, how they have been solved and what we learned in these customer projects.
    BMW example:
    Processing of the AUTOSAR 4.0 –based ECU development and testing for the 35up platform at BMW:
    • AUTOSAR 4.0 reference integration at BMW – specifications in the BAC 4.0 project
    • AUTOSAR 4.0 ECU development process
    • VAP (Virtuelle Absicherungsplatform) -Virtual Validation Platform design process at BMW

    Volvo example:
    • AUTOSAR 4.0 SPA development process
    • Project experience: problems, solutions and learnings

Presenter: Martin Ottoson, Automotive Networking, Mentor Graphics
Products: VSA, VSB, VSI, VSTAR, VAP     
Network Design Integration and AUTOSAR
  • HMI for Infotainment and instrument cluster system Abstract

    TECHNICAL SESSION The pace of change in design, dynamism and graphics in consumer HMI has been spectacular and it is no surprise that automotive OEMs and their suppliers need to rise to the challenge of creating and implementing HMIs which are at least as good as, and many cases better, than today’s consumer HMIs. Implementing these advanced HMIs in the automotive environment posses its own set of challenges: long development cycles, significant use of tier-1 suppliers, safety critical requirements, driver distraction, and in cluster there is need for highly realistic 3D HMIs which are as close to physical gauges as possible. This session discuses the challenges facing OEMs and their suppliers and looks at what can be done to help in what will continue to be a fast-changing part of a vehicle.

Presenter: Phillip Burr, Embedded Systems Division, Mentor Graphics
Products: Nucleos RTOS, Inflexion UI; Mentor Embedded Limux, Sourcery Codebench
Embedded Systems
  • Thermal reliability of high power LEDs Abstract

    TECHNICAL SESSION A low thermal resistance of a high power Light Emitting Diode (LED) is one of the most interesting product parameter, because it enables to build up and run applications with reasonable low junction temperature, leading to an efficient product with a long lifetime.
    However to ensure such good product performance over the whole product lifetime it must be ensured that the thermal interface material used in such LED application are able to withstand the thermo-mechanical stress which the application is faced in the field. Therefore the thermal characterisation in combination with accelerated stress testing is a must during the product development process.

Presenter: Dr. Thomas Zahner, Quality Management, OSRAM Opto Semiconductors GmbH
Electronics Thermal Design and Measurement

4:00 PM - 5:00 PM  1 session

  • Networking and cocktail reception Abstract

    NETWORKING EVENT n/a

Friday, October 19

Friday, October 19

9:00 AM - 9:15 AM  1 session

  • Workshop: Agenda Overview and Welcome
Electronics Thermal Design and Measurement

9:00 AM - 4:15 PM  1 session

  • Thermal Simulation & Measurement Workshop Abstract

    WORKSHOP These workshop based sessions are aimed at increasing your hands-on experience on thermal simulation with the FloEFD and FloTHERM software as well as T3Ster and TERALED hardware, including how the products can be applied in your industry.
    The day will be split into two sessions- firstly to become acquainted with the software before moving on to the hardware in the solutions later in the day. Our team members will be on hand to demonstrate the performance solutions offered.

Electronics Thermal Design and Measurement

9:15 AM - 9:40 AM  1 session

  • Workshop: Thermal Simulation - Fundamentals & Theoretical Background
Presenter: Thomas Schultz, Mechanical Analysis Division, Mentor Graphics
Electronics Thermal Design and Measurement

9:40 AM - 10:00 AM  1 session

  • Workshop: Introducing FloEFD for Electronics - A Paradigm Shift in CFD
Presenter: Thomas Schultz, Mechanical Analysis Division, Mentor Graphics
Electronics Thermal Design and Measurement

10:00 AM - 11:00 AM  1 session

  • Workshop: Thermal Simulation "Solving Problems by using FloEFD"
Presenter: Thomas Schultz, Mechanical Analysis Division, Mentor Graphics
Electronics Thermal Design and Measurement

11:10 AM - 12:10 AM  1 session

  • Workshop: Thermal Simulation - "Design Optimization by using FloTHERM's Command Center"
Presenter: Stefan Leder, Mechanical Analysis Division, Mentor Graphics
Electronics Thermal Design and Measurement

1:30 PM - 2:30 PM  1 session

  • Workshop: Thermal Characterization using T3Ster Part 1
Presenter: Mathew Clark, Mechanical Analysis Division, Mentor Graphics
Electronics Thermal Design and Measurement

3:00 PM - 4:00 PM  1 session

  • Workshop: Hands- On "Thermal Characterization using T3Ster" Part 2 - Practical Exercises
Presenter: Mathew Clark, Mechanical Analysis Division, Mentor Graphics
Electronics Thermal Design and Measurement