Sign In
Forgot Password?
Sign In | | Create Account

All IESF Events

Print This Schedule

Thursday, October 24

Thursday, October 24

8:00 AM - 9:00 AM  1 session

  • REGISTRATION
    Toggle Abstract

    LOGISTIC Conference badges for delegates can be collected on arrival. Registration desk will be staffed during this period and breaks.

ALL DELEGATES

9:00 AM - 9:10 AM  1 session

  • WELCOME
ALL DELEGATES

9:10 AM - 9:50 AM  1 session

  • Keynote: Importance of Systems Engineering for Aston Martin
    Toggle Abstract

    KEYNOTE Alan Bennett will describe the Aston Martin approach to engineering low volume, high luxury sports cars. Using examples from the recently launched Vanquish and the One-77 hyper car, he will highlight some of the challenges faced and how operating at a system level allows efficient delivery of complex networks with limited resources.

Presenter: Alan Bennett, Chief Engineer of Electrical and Electronics, Aston Martin
ALL DELEGATES

9:50 AM - 10:30 AM  1 session

  • Keynote: Systems Engineering At The Platform Level
    Toggle Abstract

    KEYNOTE Today’s cars can be described as the most complex consumer electronics products available.  But the distributed nature of vehicle electronics means nothing works without the electrical system that interconnects components.  This presentation explores how Mentor's Capital software models platform connectivity across abstractions.  It shows how new technology allows companies to understand the impact of and respond to changes across multiple engineering disciplines.  As the challenges and technical solutions are described, so the value of this capability becomes clear.

Presenter: Nick Smith, Business Development Director IESD, Mentor Graphics
ALL DELEGATES

10:30 AM - 11:10 AM  1 session

  • Keynote: Yazaki Europe IT Strategy and the experience with Mentor tools. What can engineers learn from our ERP experience
    Toggle Abstract

    KEYNOTE Yazaki Europe has a long experience in standardising ERP applications. Angelo Mattivi will explain what parallels can be drawn between ERP and engineering world, what benefits can be achieved through a standard approach, how specific, individual customer requirements can be met using standard tools, and how Yazaki is using Mentor tools to support this strategy.

Presenter: Angelo Mattivi, Head IT, Yazaki Europe
ALL DELEGATES

11:10 AM - 11:40 AM  1 session

  • MORNING BREAK
ALL DELEGATES

11:40 AM - 12:20 PM  4 sessions

  • An Integrated Systems Engineering Approach - How trace Requirements to Electronics and Software
    Toggle Abstract

    TECHNICAL SESSION As electrical systems become ever more sophisticated, leading organizations are adopting a systems engineering approach to EE design. This session presents new integrations between Capital and IBM's Rational tools that support this approach. Requirements captured in Rational DOORS can be natively surfaced within Mentor EE design and implementation tools, allowing designers to understand the context of their work better and giving project managers impact visibility when requirements change. Together with task and test case management, this provides a robust environment that streamlines development processes while minimizing on-going IT costs.

Presenter: Peter Schedl, IBM
Network Design Integration and AUTOSAR
  • An Integrated Systems Engineering Approach - How trace Requirements to Electronics and Software
    Toggle Abstract

    TECHNICAL SESSION As electrical systems become ever more sophisticated, leading organizations are adopting a systems engineering approach to EE design. This session presents new integrations between Capital and IBM's Rational tools that support this approach. Requirements captured in Rational DOORS can be natively surfaced within Mentor EE design and implementation tools, allowing designers to understand the context of their work better and giving project managers impact visibility when requirements change. Together with task and test case management, this provides a robust environment that streamlines development processes while minimizing on-going IT costs.

Presenter: Peter Schedl, IBM
Network Design Integration and AUTOSAR
  • Delivering Multi-domain Automotive Electronic Systems with Hypervisor Technology Linux, and AUTOSAR
    Toggle Abstract

    TECHNICAL SESSION This session will discuss alternative Embedded Software Architectures and use-cases in Automotive, particularly relating to Infotainment, Instrument Clusters and links to AUTOSAR ECUs. Secure methods for combing software domains, whilst leveraging silicon hardware capabilities are becoming increasingly important to OEMs and Tier 1’s looking for ways to provide innovative functionality at competitive prices. The options for Automotive Linux, including GENIVI 5.0, and options for including Android applications in the vehicle will be explored as part of this session.

Presenter: Scot Morrison, General manager of Embedded Runtime Solutions, Mentor Graphics
Embedded Linux GENIVI & Android Solutions
  • Enhancing Automotive Electronics Thermal Design Productivity – Rapid model creation & bridging the gap between EDA and MCAD design flow with FloTHERM XT
    Toggle Abstract

    TECHNICAL SESSION In automotive electronics cooling applications, PCB power density is steadily increasing. Taking an automotive engine control unit as an example thermal design project, this presentation shows how FloTHERM XT software can be applied to realize significant workflow and simulation productivity gains. There are advantages in this step change approach to electronics cooling by incorporating both EDA design data earlier and also mechanical design flows in this CAD centric tool suitable for creating and modifying designs for analysis from concept to verification.

Presenter: Stefan Leder, Application Engineer, Mechanical Analysis Division, Mentor Graphics
Products: FloTHERM XT
Electronics Thermal Design and measurement

12:20 PM - 1:00 PM  4 sessions

  • Automating transitions From logical design to physical implementation
    Toggle Abstract

    TECHNICAL SESSION The move from one abstraction level to another transitions concept to implementation. Some of today’s transitions are essentially manual tasks but others can be automated. Examples include network synthesis and harness synthesis.
    This presentation focuses on harness synthesis as part of the overall process. It shows how the separation of logical design from implementation specific data leads to the automated creation of harness designs and can be extended to automate details of harness engineering. It wraps up with practical examples of how this technology is used within JLR.

Presenter: Phil Davies, Business Development Manager, Integrated Electrical Systems, Mentor Graphics
Presenter: Steve Twitchett, Jaguar Land Rover
Electrical Distribution Systems Design
  • Learning from Experience: The Worldwide Adoption of AUTOSAR 4.0.3
    Toggle Abstract

    TECHNICAL SESSION BMW, GM, and Volvo are currently deploying AUTOSAR in their production automotive projects. Mentor Graphics has gained significant experience working alongside these OEMs. In this session, attendees will learn how OEMs deploy the AUTOSAR 4.0.3 specification, how OEMs develop ECUs in AUTOSAR 4.0.3, and how automotive OEMs process their software design on a particular platform. Attendees will also see the common problems that arise when working with AUTOSAR, the advantages and disadvantages to certain approaches, and how many of the challenges were eventually solved.

Presenter: Hans-Juergen Mantsch, Technical Marketing Manager, System Level Engineering, Mentor Graphics
Network Design Integration and AUTOSAR
  • The Future of the Connected Car
    Toggle Abstract

    TECHNICAL SESSION Smartphones are today's most private item as they carry all our contacts, maps, music, calendar and emails. Cars are for most a significant part of their time, either for commuting, for business or simply for leisure. RealVNC has been at the core of development of VNC™ Technology enabling to share a wide variety of devices with a strong drive in Automotive and Mobile. As a Core member of the Car Connectivity Consortium, RealVNC provides the leading solution for MirrorLink™, the standard that allows to seamlessly integrate smartphones into cars.

Presenter: Alberto Bonamico, Mobile Business Development Executive, RealVNC
Embedded Linux GENIVI & Android Solutions
  • Selecting the right Thermal Interface Material (TIM) for electronics packages based on accurate thermal measurement data
    Toggle Abstract

    TECHNICAL SESSION Thermal Interface Materials (TIMs) are used to establish good thermal contact between mating surfaces in an IC package. With ever increasing power density, especially in power electronics packages, it is important to dissipate heat as efficiently as possible. Heat transfer depends on the conductivity of the package and the influence of the thermal resistance of the interface material and contact resistances. In understanding the heat flow path, accurate thermal property information is key in selecting TIMs appropriately for successful thermal design.

    Aimed at those selecting TIM materials, this presentation reviews TIM material types (incl. greases, phase change materials, gap pads, gap fillers, solids, and prepared adhesives) alongside typical measurement techniques used for thermal characterization and how to interpret this data. A particular focus will be on transient thermal measurement using controlled environment, precision testing, to determine changes in thermal resistance for TIM thicknesses down to 1 micrometer.

Presenter: Matthew Clark, Application Engineer, Mechanical Analysis Division, Mentor Graphics
Electronics Thermal Design and measurement

1:00 PM - 2:00 PM  1 session

  • LUNCH
ALL DELEGATES

2:00 PM - 2:40 PM  4 sessions

  • What Will Save Us From Electrical Configuration Complexity (Part 1)?
    Toggle Abstract

    TECHNICAL SESSION Massive configuration complexity caused by global platforms and customer choice has become an acute pain point in electrical systems & wire harness design. This session examines the multiple areas impacted by configuration complexity, from design change management to obsolescence costs to vehicle documentation & service. The set of technology solutions embedded within Mentor's Capital tools that address this complex problem is described, and interesting reference is also made to aerospace paradigms for managing configuration complexity.

Presenter: Karin Jung, Application Engineer Transportation, Mentor Graphics
Electrical Distribution Systems Design
  • A Closer Look at AUTOSAR Design Automation
    Toggle Abstract

    TECHNICAL SESSION AUTOSAR 4.3.0 is now being deployed by many of the world’s top automotive OEMs. Unfortunately, many of the Tier 1 suppliers are struggling with AUTOSAR complexity. Significant effort is being spent on behalf of the OEMs in the design, migration, configuration, integration, generation, and in the final build of AUTOSAR-based systems. In order for the Tier 1 suppliers to participate, a fundamental change is required at the software and tools companies to abstract away the AUTOSAR standard. This presentation gives an overview of the current situation, possibilities, and future direction of abstracting AUTOSAR for design automation purposes.

Presenter: Armin Lichtblau, Business Development Manager, Embedded Systems, Mentor Graphics
Network Design Integration and AUTOSAR
  • In-Vehicle Infotainment: Multimedia and Connectivity
    Toggle Abstract

    TECHNICAL SESSION Jungo Connectivity's MediaCore is the market leading multimedia player middleware for In-Vehicle Infotainment systems. Jungo Connectivity and Mentor Embedded have partnered around MediaCore and Mentor's Automotive Technology Platform, in order to bring customers the best of both worlds. MediaCore middleware is already on the road in over 50 different vehicle models with many more under development. This session will focus on the recent trends in IVI multimedia systems, the major challenges that the industry faces, and how Jungo's MediaCore solves many of these issues. Some particular items that will be discussed include:
    • OS considerations in a multimedia perspective
    • Leveraging the most out of Apple, Android and other mobile media-sources
    • System upgradability. Why is it needed and how can it be done?
    • Apps in the car

Presenter: Yuval Ben Zeev, Director of Product and Business Development, Jungo
Embedded Linux GENIVI & Android Solutions
  • Thermal Simulation in automotive power electronics products
    Toggle Abstract

    TECHNICAL SESSION Due to the growth of the market for Electrical Vehicles and Hybrid Vehicles, power electronics products are more and more present in the automotive industry. These power electronics products must be designed to operate in very severe thermal conditions. Additionally, compactness and short development timeframe are two other strong constraints. In this context, 3D thermal simulations are a very useful tool to answer this challenge. These 3D models can be used from the early stage of the product design of up to the validation stage. In addition, these models can now address multiphysics simulations enabling us to account for strongly coupled effect, such as the thermal loads produced by the joule effect. However, complex transient power profiles can lead to long calculation times that are incompatible to the product development timeframe. For this specific case, thermal impedance methodology can be applied to calculate, in a reasonable time, transient temperature of the main components. These thermal results can finally be used to estimate reliability of the product.

Presenter: Renan Leon, Valeo
Electronics Thermal Design and measurement

2:40 PM - 3:10 PM  1 session

  • AFTERNOON BREAK
ALL DELEGATES

3:10 PM - 3:50 PM  4 sessions

  • Harness Manufacturing Cost Analysis For OEMs and Suppliers
    Toggle Abstract

    TECHNICAL SESSION Wire harnesses comprise a significant portion of overall EE system costs.  In the search for competitive advantage both OEMs and suppliers must be able to calculate harness manufacturing costs quickly, systematically and accurately.  This session presents new software that intelligently combines harness design data with highly flexible manufacturing process models to create detailed cost calculations, while fully protecting intellectual property.  This provides a firm basis for sourcing decisions, both for OEMs assessing suppliers' bids and for suppliers seeking optimal operations patterns.

Presenter: Andy Cooper, Harness Flow Product Architect, Integrated Electrical Systems, Mentor Graphics
Electrical Distribution Systems Design
  • How to succeed with AUTOSAR 4.x projects
    Toggle Abstract

    TECHNICAL SESSION AUTOSAR 4.0 is still new on the market. For an ECU supplier the AUTOSAR way provides many new challenges and new tools are needed to be able to execute an AUTOSAR based project efficiently.
    Mecel is a development partner to Mentor Graphics for the AUTOSAR 4.x products, and also a System Integrator partner for Tier 1s in their AUTOSAR projects.
    In this session we will focus on how to make the efficiently introduce of AUTOSAR4.x as efficient as possible from an ECU supplier’s perspective. Attendees will be presented our experiences of different ECU supplier’s strategies in terms of system integration, configuration, testing, etc and how to use them to achieve efficient accomplish successful deliveries of AUTOSAR 4.x production projects.

Presenter: Rolf Hagstedt, Business Manager, Mecel AB
Network Design Integration and AUTOSAR
  • The Challenges that Implementing Infotainment Systems using Audio Video Bridging (AVB) pose to System and Endpoint Developers
    Toggle Abstract

    TECHNICAL SESSION This paper describes the challenges that implementing Infotainment Systems using AVB pose to system and endpoint developers. We discuss real-life deployment examples, including considerations in system startup, network topology, and endpoint design.

    Ethernet AVB delivers many advantages, but it also comes with challenges that both hardware and software teams must consider. The standards provide Quality of Service (QoS) for AV streams by guaranteeing isochronous transmission, low latency (802.1Qav), accurate clock synchronization (802.1as), and data-rate control (802.1Qat). The real-time processing requirements of these network protocols are challenging for processors, MCUs, and software stacks. The trend towards highly responsive, deterministic Ethernet networks is seen to result in higher interrupt loads and requires changes to conventional methods for handling network interfaces.

    We consider the example of IEEE 1722. An AVB Endpoint must send/receive IEEE 1722 packets at a very high frequency: 8000 class A packets per second per stream. This high rate minimizes latency in the network, but it requires the endpoint to handle a high real-time processing load.

    The experiences we describe in Ethernet AVB Head Unit and Amplifier development are an important proof point that AVB in the car is now a reality and delivering the expected advantages

Presenter: Paul Neil, VP of Product Management, XMOS
Embedded Linux GENIVI & Android Solutions
  • Thermal Simulation and Optimization of automotive Multimedia Systems – Modeling Requirements from Chip to complete System
    Toggle Abstract

    TECHNICAL SESSION Modern radio and navigation systems, i.e. multimedia systems, for automotive applications are highly complex systems. Increased power dissipation and power density due to increased functionality (new multimedia features: e.g. video, internet, MP3) and higher demands on the audio power amplifier require intelligent thermal management strategies. In this presentation we focus on typical tasks and problems involved in the thermal design as well as design optimization and address modeling requirements from chip to the complete system and beyond (dashboard) necessary for thermal analysis. Up-front simulations increase customer satisfaction and enable us to test and modify system and components as virtual prototypes before performing physical tests and building real prototypes

Presenter: Dr. Uwe Lautenschlager, Senior Simulation Specialist, Continental Automotive GmbH
Electronics Thermal Design and measurement

3:50 PM - 4:30 PM  4 sessions

  • The Next Step In Smart Documentation
    Toggle Abstract

    TECHNICAL SESSION Smart documentation is a common requests from vehicle service technicians, who know that diagnostic trouble codes do not always quickly and unambiguously identify vehicle faults.  This session presents technology that not only automatically creates rich documentation but also delivers a highly productive environment to the technicians, with capabilities such as vehicle specific schematic generation and interactive signal tracing.  The very latest developments in this area will be shown, including delivery to tablet devices for the ultimate in usability and portability.

Presenter: Steve Trythall, Systems Engineer, Integrated Electrical Systems, Mentor Graphics
Electrical Distribution Systems Design
  • ISO 26262 and AUTOSAR - Achieving a New Level in Vehicle Safety
    Toggle Abstract

    TECHNICAL SESSION Complex safety-related electronic/electrical systems in today’s automobile continue to grow at an alarming rate. If not properly handled or mitigated, an event within one of these systems can lead to serious system failure. ISO 26262 addresses functional safety hazards and has proposed recommendations on how to identify and handle such risks. When coupled with AUTOSAR software procedures in safety-related systems, a vehicle is less likely to experience system failure. In this session ISO 26262 and AUTOSAR are discussed as joint solutions. The focus will be on solutions that ensure ISO 26262 compliance with consideration to multicore architectures and freedom from interference in mixed ASIL designs.

Presenter: Kristoffer Karlsson, Mentor Graphics
Presenter: Mathias Fritzson, Product Line Manager AUTOSAR, Mecel AB
Network Design Integration and AUTOSAR
  • Achieving Faster Boot Time with Linux for Instrument Cluster and Infotainment Systems
    Toggle Abstract

    TECHNICAL SESSION The boot times seen in personal computers and mobile phones running Linux or Android are unacceptable for automotive systems. Through correct design and effective system profiling extremely fast boot times can be achieved using Linux to address use cases such as displaying an instrument cluster under 500ms or showing the video feed from a rear-facing camera in an infotainment system. Learn about the techniques necessary to deliver the response needed for automotive systems based on Linux.

Presenter: Andrew Patterson, Director of Business Development, Embedded Systems, Mentor Graphics
Embedded Linux GENIVI & Android Solutions
  • Thermal simulation for design, integration and validation of power electronics modules of Electronic & Hybrid Vehicles
    Toggle Abstract

    TECHNICAL SESSION Nowadays car manufacturers have to challenge shorter overall development cycles of vehicles and the time to introduce innovations to the market. Simulation is an essential tool to overcome these challenges. Realizing this key factor during the engineering process, innovative simulation software such as Mentor Graphics’ FloEFD™ contributes significantly to reduce the total development costs (C), the development duration (D) and leads to a product quality (Q) improvement.
    Our specific case will focus on the 3D- thermal and fluidic analysis of power electronics modules integrated in electric and hybrid vehicles.
    Under the consideration of thermal constraints it will illustrated how the thermal models have been built within FloEFD™, validated and how the results impact the design and optimization decisions of each electronic power module.
    Furthermore, the importance of having an innovative simulation tool allowing a fast and robust link with the CAD environment CATIA™ during the development cycle is highlighted.

Presenter: Ibrahim Mohand-Kaci, RENAULT
Electronics Thermal Design and measurement

4:30 PM - 5:20 PM  1 session

  • Networking and cocktail reception
    Toggle Abstract

    LOGISTIC Conference close will be celebrated with a cocktail reception offering relaxed networking time.

ALL DELEGATES