TECHNICAL SESSION Thermal Interface Materials (TIMs) are used to establish good thermal contact between mating surfaces in an IC package. With ever increasing power density, especially in power electronics packages, it is important to dissipate heat as efficiently as possible. Heat transfer depends on the conductivity of the package and the influence of the thermal resistance of the interface material and contact resistances. In understanding the heat flow path, accurate thermal property information is key in selecting TIMs appropriately for successful thermal design.
Aimed at those selecting TIM materials, this presentation reviews TIM material types (incl. greases, phase change materials, gap pads, gap fillers, solids, and prepared adhesives) alongside typical measurement techniques used for thermal characterization and how to interpret this data. A particular focus will be on transient thermal measurement using controlled environment, precision testing, to determine changes in thermal resistance for TIM thicknesses down to 1 micrometer.