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IESF Guest Speakers

Featured Guest Speaker Events

Keynote: Importance of Systems Engineering for Aston Martin Thursday, October 24, 9:10 AM

Keynote Alan Bennett will describe the Aston Martin approach to engineering low volume, high luxury sports cars. Using examples from the recently launched Vanquish and the One-77 hyper car, he will highlight some of the challenges faced and how operating at a system level allows efficient delivery of complex networks with limited resources.

Keynote: Yazaki Europe IT Strategy and the experience with Mentor tools. What can engineers learn from our ERP experience Thursday, October 24, 10:30 AM

Keynote Yazaki Europe has a long experience in standardising ERP applications. Angelo Mattivi will explain what parallels can be drawn between ERP and engineering world, what benefits can be achieved through a standard approach, how specific, individual customer requirements can be met using standard tools, and how Yazaki is using Mentor tools to support this strategy.

An Integrated Systems Engineering Approach - How trace Requirements to Electronics and Software Thursday, October 24, 11:40 AM

Technical Session As electrical systems become ever more sophisticated, leading organizations are adopting a systems engineering approach to EE design. This session presents new integrations between Capital and IBM's Rational tools that support this approach. Requirements captured in Rational DOORS can be natively surfaced within Mentor EE design and implementation tools, allowing designers to understand the context of their work better and giving project managers impact visibility when requirements change. Together with task and test case management, this provides a robust environment that streamlines development processes while minimizing on-going IT costs.

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Alan Bennett, Chief Engineer of Electrical and Electronics, Aston Martin

  • Keynote: Importance of Systems Engineering for Aston Martin
    Toggle Abstract

    KEYNOTE Alan Bennett will describe the Aston Martin approach to engineering low volume, high luxury sports cars. Using examples from the recently launched Vanquish and the One-77 hyper car, he will highlight some of the challenges faced and how operating at a system level allows efficient delivery of complex networks with limited resources.

Angelo Mattivi, Head IT, Yazaki Europe

  • Keynote: Yazaki Europe IT Strategy and the experience with Mentor tools. What can engineers learn from our ERP experience
    Toggle Abstract

    KEYNOTE Yazaki Europe has a long experience in standardising ERP applications. Angelo Mattivi will explain what parallels can be drawn between ERP and engineering world, what benefits can be achieved through a standard approach, how specific, individual customer requirements can be met using standard tools, and how Yazaki is using Mentor tools to support this strategy.

Network Design Integration and AUTOSAR

Hans-Juergen Mantsch, Technical Marketing Manager, System Level Engineering, Mentor Graphics

  • Learning from Experience: The Worldwide Adoption of AUTOSAR 4.0.3
    Toggle Abstract

    TECHNICAL SESSION BMW, GM, and Volvo are currently deploying AUTOSAR in their production automotive projects. Mentor Graphics has gained significant experience working alongside these OEMs. In this session, attendees will learn how OEMs deploy the AUTOSAR 4.0.3 specification, how OEMs develop ECUs in AUTOSAR 4.0.3, and how automotive OEMs process their software design on a particular platform. Attendees will also see the common problems that arise when working with AUTOSAR, the advantages and disadvantages to certain approaches, and how many of the challenges were eventually solved.

Peter Schedl, IBM

  • An Integrated Systems Engineering Approach - How trace Requirements to Electronics and Software
    Toggle Abstract

    TECHNICAL SESSION As electrical systems become ever more sophisticated, leading organizations are adopting a systems engineering approach to EE design. This session presents new integrations between Capital and IBM's Rational tools that support this approach. Requirements captured in Rational DOORS can be natively surfaced within Mentor EE design and implementation tools, allowing designers to understand the context of their work better and giving project managers impact visibility when requirements change. Together with task and test case management, this provides a robust environment that streamlines development processes while minimizing on-going IT costs.

Rolf Hagstedt, Business Manager, Mecel AB

  • How to succeed with AUTOSAR 4.x projects
    Toggle Abstract

    TECHNICAL SESSION AUTOSAR 4.0 is still new on the market. For an ECU supplier the AUTOSAR way provides many new challenges and new tools are needed to be able to execute an AUTOSAR based project efficiently.
    Mecel is a development partner to Mentor Graphics for the AUTOSAR 4.x products, and also a System Integrator partner for Tier 1s in their AUTOSAR projects.
    In this session we will focus on how to make the efficiently introduce of AUTOSAR4.x as efficient as possible from an ECU supplier’s perspective. Attendees will be presented our experiences of different ECU supplier’s strategies in terms of system integration, configuration, testing, etc and how to use them to achieve efficient accomplish successful deliveries of AUTOSAR 4.x production projects.

Embedded Linux GENIVI & Android Solutions

Alberto Bonamico, Mobile Business Development Executive, RealVNC

  • The Future of the Connected Car
    Toggle Abstract

    TECHNICAL SESSION Smartphones are today's most private item as they carry all our contacts, maps, music, calendar and emails. Cars are for most a significant part of their time, either for commuting, for business or simply for leisure. RealVNC has been at the core of development of VNC™ Technology enabling to share a wide variety of devices with a strong drive in Automotive and Mobile. As a Core member of the Car Connectivity Consortium, RealVNC provides the leading solution for MirrorLink™, the standard that allows to seamlessly integrate smartphones into cars.

Paul Neil, VP of Product Management, XMOS

  • The Challenges that Implementing Infotainment Systems using Audio Video Bridging (AVB) pose to System and Endpoint Developers
    Toggle Abstract

    TECHNICAL SESSION This paper describes the challenges that implementing Infotainment Systems using AVB pose to system and endpoint developers. We discuss real-life deployment examples, including considerations in system startup, network topology, and endpoint design.

    Ethernet AVB delivers many advantages, but it also comes with challenges that both hardware and software teams must consider. The standards provide Quality of Service (QoS) for AV streams by guaranteeing isochronous transmission, low latency (802.1Qav), accurate clock synchronization (802.1as), and data-rate control (802.1Qat). The real-time processing requirements of these network protocols are challenging for processors, MCUs, and software stacks. The trend towards highly responsive, deterministic Ethernet networks is seen to result in higher interrupt loads and requires changes to conventional methods for handling network interfaces.

    We consider the example of IEEE 1722. An AVB Endpoint must send/receive IEEE 1722 packets at a very high frequency: 8000 class A packets per second per stream. This high rate minimizes latency in the network, but it requires the endpoint to handle a high real-time processing load.

    The experiences we describe in Ethernet AVB Head Unit and Amplifier development are an important proof point that AVB in the car is now a reality and delivering the expected advantages

Yuval Ben Zeev, Director of Product and Business Development, Jungo

  • In-Vehicle Infotainment: Multimedia and Connectivity
    Toggle Abstract

    TECHNICAL SESSION Jungo Connectivity's MediaCore is the market leading multimedia player middleware for In-Vehicle Infotainment systems. Jungo Connectivity and Mentor Embedded have partnered around MediaCore and Mentor's Automotive Technology Platform, in order to bring customers the best of both worlds. MediaCore middleware is already on the road in over 50 different vehicle models with many more under development. This session will focus on the recent trends in IVI multimedia systems, the major challenges that the industry faces, and how Jungo's MediaCore solves many of these issues. Some particular items that will be discussed include:
    • OS considerations in a multimedia perspective
    • Leveraging the most out of Apple, Android and other mobile media-sources
    • System upgradability. Why is it needed and how can it be done?
    • Apps in the car

Electronics Thermal Design and measurement

Dr. Uwe Lautenschlager, Senior Simulation Specialist, Continental Automotive GmbH

  • Thermal Simulation and Optimization of automotive Multimedia Systems – Modeling Requirements from Chip to complete System
    Toggle Abstract

    TECHNICAL SESSION Modern radio and navigation systems, i.e. multimedia systems, for automotive applications are highly complex systems. Increased power dissipation and power density due to increased functionality (new multimedia features: e.g. video, internet, MP3) and higher demands on the audio power amplifier require intelligent thermal management strategies. In this presentation we focus on typical tasks and problems involved in the thermal design as well as design optimization and address modeling requirements from chip to the complete system and beyond (dashboard) necessary for thermal analysis. Up-front simulations increase customer satisfaction and enable us to test and modify system and components as virtual prototypes before performing physical tests and building real prototypes

Ibrahim Mohand-Kaci, RENAULT

  • Thermal simulation for design, integration and validation of power electronics modules of Electronic & Hybrid Vehicles
    Toggle Abstract

    TECHNICAL SESSION Nowadays car manufacturers have to challenge shorter overall development cycles of vehicles and the time to introduce innovations to the market. Simulation is an essential tool to overcome these challenges. Realizing this key factor during the engineering process, innovative simulation software such as Mentor Graphics’ FloEFD™ contributes significantly to reduce the total development costs (C), the development duration (D) and leads to a product quality (Q) improvement.
    Our specific case will focus on the 3D- thermal and fluidic analysis of power electronics modules integrated in electric and hybrid vehicles.
    Under the consideration of thermal constraints it will illustrated how the thermal models have been built within FloEFD™, validated and how the results impact the design and optimization decisions of each electronic power module.
    Furthermore, the importance of having an innovative simulation tool allowing a fast and robust link with the CAD environment CATIA™ during the development cycle is highlighted.

Renan Leon, Valeo

  • Thermal Simulation in automotive power electronics products
    Toggle Abstract

    TECHNICAL SESSION Due to the growth of the market for Electrical Vehicles and Hybrid Vehicles, power electronics products are more and more present in the automotive industry. These power electronics products must be designed to operate in very severe thermal conditions. Additionally, compactness and short development timeframe are two other strong constraints. In this context, 3D thermal simulations are a very useful tool to answer this challenge. These 3D models can be used from the early stage of the product design of up to the validation stage. In addition, these models can now address multiphysics simulations enabling us to account for strongly coupled effect, such as the thermal loads produced by the joule effect. However, complex transient power profiles can lead to long calculation times that are incompatible to the product development timeframe. For this specific case, thermal impedance methodology can be applied to calculate, in a reasonable time, transient temperature of the main components. These thermal results can finally be used to estimate reliability of the product.