Mentor Forum India 2012: PCB Design & Manufacturing

Technical Session Not only are speeds of systems increasing rapidly and now in the multiple Gbps, but the percentage of high speed nets common at over 75%. This all requires extensive analysis and verfication during the design process versus producing physical prototypes and testing them in the lab. This session will discuss these required analysis tools in detail for signal integrityanalysis of DDRx and SERDES interconnects, Power Distribution Network analysis,the inclusion of 3D SI analyis for via structures, and Analog simulation.

Technical Session PCB complexity is increasing at almost an exponential rate. To leverage this complexity int more competitive products while meeting productivity and time to market goals requires advanced design technologies as provided only by Mentor Graphics. This session will illustrate some of those technologies such as BGA breakouts, advanced routing, and powere distribution network creation.

Technical Session Poor reliability of a product can lead to extensive waranty cost, product recalls and bad repuitation. There are many causes of poor reliability such as excessive heat, vibration ans shock, marginal manufacturing, and poor power distribution network design. This session will discuss how virtual prototyping analysis can predict long term reliability issues and help designers eliminate them without the use of expensive and time consuming physical prototyes and test chamber testing.

Technical Session The design of today's products requires the collaboration of muliple design team members and multiple development disciplines such as MCAD, ECAD (engineers and layout designers), FPGA, RF desingers and manufacturing. This session will discuss how mentor's unique systems design technologies enable these team members to collaborate real time and reduce their schedules, increase quality and improve productivity. Discussions will include design-for-manufacturability and manufacturing interfacing, concurrent design definition and layout, FPGA/IC package/PCB co-design, and RF/Digital/Analog collaboration.