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Mentor Graphics Technology Day 2013

seminar

There are currently no dates scheduled for this event.

Overview

PCB Design (Workshop)

  • Using DxDesigner and Expedition product family all design phases starting with library, schematic and followed by PCB design up to manufacturing phase, all steps will be reviewed in with samples in classroom
  • Enterprise Design Manager (EDM) demonstration for version management
  • DxSystem Designer and Expedition vX.1 introductions

Parallel Session 1 (Classroom with Computers)

 

Simulation & Analysis (Workshop)

Downstream products in the PCB Design flow as listed below will be demonstrated in the classroom using samples designs. Attendees will have computers to use and try the products in the classroom

  • Signal Integrity - HyperLynx SI
  • Power Integrity – HyperLynx PI
  • Analog Simulation – HyperLynx Analog
  • Thermal Simulation – HyperLynx Thermal
  • 3D Electromagnetic Simulation – HyperLynx 3D

Parallel Session 2 (Classroom with Computers

 

HDL (Workshop)

Products in FPGA Design family will be demonstrated for the following topics in the classroom using samples designs. Attendees will have computers to use and try the products in the classroom

  • Getting the best out of ModelSim & Questa
  • Beginners guide to Assertions
  • Design Management, Capture and Documentation – HDL Designer
  • Requirements Tracing – ReqTracer

Parallel Session 3 (Classroom with Computers)

Harness Design (Workshop)

Products in harness design family will be demonstrated in the classroom using samples designs. Attendees will have computers to use and try the products in the classroom

  • VeSys : Wire and harness design, simulation
  • Capital : Topology based wiring design, configuration management, version management, effectivity, composite harness, harness options and derivatives and change management

Parallel Session 4 (Classroom with Computers)

Mechanical Analysis

  • FloTHERM.XT (Next Generation Electronics Cooling): Electronic card and equipments thermal analysis and optimization SW demonstration
  • T3Ster (Transient Thermal Characterization): JEDEC JESD51-1 standard compliant, high level thermal test equipment demonstration

Parallel Session 4 (Classroom with Computers)

IP Certification Programs

All IPC Standards and IPC certification programs for PCB designers will be presented by IPC Turkiye – DNZ Elektronik.

Parallel Session 5

Embedded SW Design

Mentor Graphics products in Embedded SW Division will be demonstrated for different market segments

Parallel Session 5

NOTE: Classrooms in workshop style (Session 1-4) have limited seats so please register

 
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