Last week I discussed the new capability in Valor MSS Process Preparation 11.3. I mentioned that I would go in to more detail on some of the areas that are part of this version and I will start with our new capability for inspection machines.
There are three main types of automated inspection machines, Automated Optical Inspection (AOI), Automated X-Ray Inspection (AXI) and Solder Paste Inspection (SPI). The latter targets issues with the deposition of solder paste on to the PCB before components are placed on the board. AOI can address defects at the component placement or post-reflow for component pins. AXI is particularly good for hidden joint analysis such as Ball Grid Arrays (BGA).
For a lot of these machines, particularly the AOI segment, simple centroid files are used to describe the information on each component. Typically, reference designator, part number, package name, X, Y, rotation and board side are delivered in a simple delimited format that the programming software on the machine will read and then create a program from.
In Valor MSS the complete product model data is available to accelerate the programming time for inspection machines. The copper pad, solder mask opening, solder paste aperture and the actual component body and pin contact areas are available including where the SMT machine will place the component on the board. Providing this information to the inspection machines will surely give a much better starting point for program creation.
There are new machine interfaces that we now support in Valor MSS 11.3 that take advantage of all this information but the majority do not. Please let me know how we can help the programming of your inspection machines to improve the overall new product introduction time.
Here’s a link of the Valor MSS Process Preparation capability but please feel free to post your comments on this discussion to my blog.