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In-line Solder Paste Inspection

Mark Laing

Mark Laing

Posted Jan 22, 2013
0 Comments

Hi there

A few months back I talked about in-line AOI but this time I’ll mention a similar capability we have in the Valor MSS Process Preparation suite of in-line Solder Paste Inspection or SPI. The idea with in-line AOI and SPI is for the outputs to the different inspection machines to understand where components are being placed in the line and to create output that matches the placement. In the case of AOI machines this is achieved by the machines looking up the line to see what components have been placed already. For SPI the machines looks down the line for that side to determine if an inspection test should be created for specific parts or not. In the case of SPI, we can then use the paste data if it was defined in the source CAD, ideally presented to us in ODB++ format, or we can create it within the application using the Stencil Design module.

Typically the CAD and BOM are used to create the output for inspection machines but now with both in-line AOI and SPI the output for inspection machines will match the components that are being placed in the line.

Please click on the following link to see more about the Inspection Programming capability or the Stencil Design module of Valor MSS Process Preparation.

http://www.mentor.com/pcb-manufacturing-assembly/products/valor-mss-process-preparation

Thanks

Mark

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